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5525818 |
Reducing extrinsic base-collector capacitance
This is a method of fabricating a heterojunction bipolar transistor on a wafer. The method can comprise: forming a doped subcollector layer 31 on a semi-conducting substrate 30; forming a doped...
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5521422 |
Corner protected shallow trench isolation device
A semiconductor structure to prevent gate wrap-around and corner parasitic leakage comprising a semiconductor substrate having a planar surface. A trench is located in the substrate, the trench...
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5502314 |
Field-emission element having a cathode with a small radius
The invention is a field-emission element that is fabricated by forming an elevated surface and a base surface on a conductive substrate or a semiconductor substrate by applying a photolithographic...
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5498904 |
Polycrystalline semiconductive film, semiconductor device using the same and method of manufacturing the same
A semiconductive film is formed on a substrate having a surface with indentations defining a plurality of plane regions and elevated step difference portions between adjacent plane regions. The...
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5485025 |
Depleted extrinsic emitter of collector-up heterojunction bipolar transistor
A collector-up bipolar transistor having an undercut region (522) beneath extrinsic regions of a base layer (510) and an emitter layer (508). The extrinsic emitter region is depleted of charge...
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5453637 |
Read-only memory cell configuration with steep trenches
A semiconductor integrated circuit of a read-only memory device having steep trenches is disclosed. The memory device includes a substrate that has a plurality of interwoven chessboard-like...
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5446307 |
Microelectronic 3D bipolar magnetotransistor magnetometer
A pyramid shaped etch is made in an n or p type silicon substrate, or any symmetric etch with slanted edges, with p or n type implants in the slanted edges of the etch to form a PN junction. On...
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5438018 |
Method of making semiconductor device by selective epitaxial growth
A selective growth mask having a plurality of openings is formed on a semiconductor substrate. Desired epitaxially grown regions are formed on the openings by controlling the upward epitaxial...
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5432367 |
Semiconductor device having sidewall insulating film
A semiconductor device having a substrate, a conductive layer formed on the substrate, an upper insulting film formed on the upper surface of the conductive layer and having a sectional shape with...
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5414294 |
Remote indium bump corrugated PV diodes
A radiation detector includes a photovoltaic diode mesa structure (16) having of a plurality of sub-mesa structures (16a, 16b). Each of said sub-mesa structures includes a first layer (14a) of...
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5399901 |
Semiconductor devices having a mesa structure and method of fabrication for improved surface voltage breakdown characteristics
A semiconductor rectifier device includes a mesa structure formed on a surface of a monocrystalline silicon wafer, the mesa having four side walls meeting at rounded corner walls. The slope of the...
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5399885 |
Optoelectronic semiconductor device having plural mesas
Optoelectronic semiconductor devices including a semiconductor body with a semiconductor substrate and a substantially plane semiconductor layer structure of III-V semiconductor materials situated...
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5391895 |
Double diamond mesa vertical field effect transistor
A double diamond mesa vertical field effect transistor includes a diamond layer, a first diamond mesa on a diamond layer, and a second diamond mesa on the first diamond mesa, opposite the diamond...
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5369288 |
Semiconductor device for switching a ballistic flow of carriers
In a semiconductor device, a channel layer of an undoped semiconductor material passes carriers therethrough ballistically, a carrier injection part injects the carriers into the channel layer with...
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5357125 |
Power switching semiconductor device including SI thyristor and MOSFET connected in cascade
A semiconductor device including a normally-on SI thyristor, and a MOSFET connected in cascade with the SI thyristor. The gate of the SI thyristor is connected to the source of the MOSFET. This...
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5349211 |
Semiconductor infrared emitting device with oblique side surface with respect to the cleavage
A semiconductor infrared emitting device is fabricated from an n-type gallium arsenide substrate, an n-type gallium arsenide layer on the top surface of the substrate, a p-type gallium arsenide...
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5343070 |
Mesa type PIN diode
A mesa-type PIN diode and method for making same are disclosed. A diode made according to the present invention includes a junction formed in the top surface of the mesa-shaped structure, having an...
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5341000 |
Thin silicon carbide layer on an insulating layer
A present invention is intended to provide a semiconductor device having a structure in which devices are formed in a thin layer (18) of silicon carbide having reduced crystal faults on a silicon...
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5338942 |
Semiconductor projections having layers with different lattice constants
A semiconductor device comprising a semiconductor crystalline substrate having projections each thereof having an area of 0.01 μm 2 to 4 μm 2 or stripe projections each thereof having a width...
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5332912 |
Heterojunction bipolar transistor
A heterojunction bipolar transistor comprises n + -type GaAs collector contact region, an n-type GaAs collector region, a p + -type GaAs base region, an n-type AlGaAs emitter region, and an n + ...
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5324970 |
Interconnection structure in semiconductor device
An interconnection structure in a semiconductor device for connecting a lower conductive layer to an upper conductive layer comprises a projection which is left by selectively etching a...
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5321303 |
Semiconductor device having linearly arranged semiconductor chips
A method for manufacturing a semiconductor device using inclined stage of a dicing saw in order to cut the semiconductor substrate obliquely with respect to the depthwise direction. When a...
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5319240 |
Three dimensional integrated device and circuit structures
A set of three-dimensional structures and devices may be wired together to perform a wide variety of circuit functions such as SRAMs, DRAMs, ROMs and PLAs. Both N-Channel and P-Channel transistors...
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5313092 |
Semiconductor power device having walls of an inverted mesa shape to improve power handling capability
A semiconductor device of vertical arrangement includes an anode region formed of a first semiconductor substrate and a second semiconductor substrate joined with the first semiconductor substrate....
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5296733 |
Hetero junction bipolar transistor with improved electrode wiring contact region
A hetero junction bipolar transistor provides a contact area an area between an emitter (or collector) electrode and a wiring formed on the electrode that is larger than that of the emitter (or...
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5286997 |
Method for forming an isolated, low resistance epitaxial subcollector for bipolar transistors
Generally, and in one form of the invention a method is disclosed for forming a subcollector for bipolar transistors comprising the steps of epitaxially depositing a subcollector layer 22 on a...
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5285086 |
Semiconductor devices with low dislocation defects
Semiconductor devices having a low density of dislocation defects can be formed of epitaxial layers grown on defective or misfit substrates by making the thickness of the epitaxial layer...
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5281847 |
Groove structure for isolating elements comprising a GTO structure
A semiconductor structure comprises a gate-turn-off thyristor region (GR) and a diode region (DR) with an isolation area (SR) therebetween. The isolation area is provided with a multistage groove...
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5262669 |
Semiconductor rectifier having high breakdown voltage and high speed operation
A semiconductor rectifier having a high breakdown voltage and a high speed operation is provided, which includes a semiconductor substrate having an N + -type semiconductor layer and an N-type...
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5260588 |
Light-emitting diode array
The present invention, which is directed to a light-emitting diode array for use as the light source in optical printers and other such applications, provides improved optical efficiency and a more...
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5233219 |
Three-dimensional semiconductor device structure
A semiconductor device and a method of manufacture thereof by which circuit elements are readily formed as a three-dimensional structure without increasing the device size are provided. An N 31 ...
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5214302 |
Semiconductor integrated circuit device forming on a common substrate MISFETs isolated by a field oxide and bipolar transistors isolated by a groove
A semiconductor integrated circuit device having a structure in which each of the following regions, that is, a first region for forming the base and emitter regions of each of the bipolar...
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5194750 |
High precision ccd magnetic field sensor
A magnetic field sensor, having a charge-coupled device formed in a semiconductor region is disclosed. The magnetic field sensor has first and second contact zones, made of a heavily doped...
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5185646 |
Semiconductor device with improved current drivability
On a semiconductor substrate are formed a plurality of pedestal regions which are of the same conductivity type as the semiconductor substrate. Insulating layers are formed on side surfaces of the...
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5177027 |
Process for fabricating, on the edge of a silicon mesa, a MOSFET which has a spacer-shaped gate and a right-angled channel path
A process for fabricating, on the more or less vertical edge of a silicon mesa, a MOS field-effect transistor which has a spacer-shaped gate and a right-angled channel path. The process involves...
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5164813 |
New diode structure
A new diode structure is provided by bonding two semiconductor materials together having a low capacitance, a large contact area and mechanical ruggedness. The cross-sectional area of at least one...
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5144410 |
Ohmic contact for III-V semiconductor devices
A dependable ohmic contact with consistently low specific contact resistance (<1×10 -6 Ω-cm 2 ) to n-type GaAs (10) is produced by a three or four step procedure. The procedure, which is...
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5144413 |
Semiconductor structures and manufacturing methods
A plurality of microwave semiconductor devices is provided by plating a thin heat sink layer on a surface of a wafer of semiconductor material, masking selected portions of the heat sink layer, and...
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5144376 |
Compound semiconductor device
A compound semiconductor device includes a semi-insulating substrate having a mesa structure defined by recess-etched portions along each side. A collector layer, base layer, emitter layer, and an...
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5140388 |
Vertical metal-oxide semiconductor devices
A vertical CMOS semiconductor device and a method of making the device. A polysilicon gate post rises normal to a surface of a substrate. An annular transistor encircles the gate post. The...
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5136350 |
Semiconductor mosfet having a projecting T-shaped portion
A MOSFET having a projecting T-shaped semiconductor portion and a method of manufaturing the same. The MOSFET includes a semiconductor body having a first diffusion region of a first conductivity...
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5132769 |
Semiconductor device with high withstand voltage
A semiconductor device has PN junction in architecture of PN - N + , P + NN + , PIN, or PγN. Such semiconductor device comprises a first surface layer dopped with a first type impurity at a...
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5121194 |
Substrate output for a semiconductor device and a method of fabricating the same
In a semiconductor device, a first diffusion region on a surface of an output region for a substrate electric potential, and an element segregation third diffusion region under a field insulating...
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5119171 |
Semiconductor die having rounded or tapered edges and corners
An improved semiconductor die for plastic encapsulated semiconductor device packages which impedes the inherent delamination caused by the differing expansion coefficients of the semiconductor die...
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5079604 |
SOI layout for low resistance gate
Silicon-on-insulator mesa steps cause high resistance in polycrystalline material because of the lack of silicide coverage. In a gate or word line, for instance, this accounts for a large...
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5079616 |
Semiconductor structure
Heteroepitaxial semiconductor structures of, for example, GaAs on InP or Si. The epitaxially grown GaAs is in the form of individual spaced-apart islands having maximum dimensions in the plane of...
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5057896 |
Semiconductor device and method of producing same
A semiconductor device comprises a semiconductor substrate having a pillar-like portion projecting upwardly from the main surface thereof and defining circumferential side walls and a top surface,...
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5055894 |
Monolithic interleaved LED/PIN photodetector array
Interleaved arrays of photoelectronic devices are fabricated utilizing one-step epitaxial growth of all active layers and simple planar processing. Exemplary arrays include interleaved LED...
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5051372 |
Method of manufacturing a semiconductor optoelectric integrated circuit device, having a pin, hemt, and hbt, by selective regrowth
There is disclosed a method of manufacturing an integrated circuit, comprising: the first step of growing a first epitaxial crystal on a compound semiconductor substrate, removing an unnecessary...
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5043786 |
Lateral transistor and method of making same
A method of fabricating a lateral transistor is provided, including the steps of: providing a body of semiconductor material including a device region of a first conductivity type; patterning the...
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