Matches 1 - 50 out of 253 1 2 3 4 5 6 >
Match Document Document Title
7619282 Hybrid circuit and electronic device using same  
There is disclosed a hybrid circuit in which a circuit formed of TFTs in integrated with an RF filter. The TFTs are fabricated on a quartz substrate. A ceramic filter forming the RF filter is...
7616167 Semiconductor device and method of producing the same  
A semiconductor device includes a semiconductor substrate having a first surface and a second surface opposite to the first surface; a first through wiring penetrating through the semiconductor...
7602047 Semiconductor device having through vias  
A method of fabricating a semiconductor device is provided. The method may include forming an insulating layer on a wafer. The wafer may have an active surface and an inactive surface which face...
7592703 RF and MMIC stackable micro-modules  
A new method to form shielded vias with microstrip ground plane in the manufacture of an integrated circuit device is achieved. The method comprises, first, providing a substrate. The substrate is...
7579671 Semiconductor device and manufacturing method thereof  
Disconnection and deterioration in step coverage of wirings are prevented to offer a semiconductor device having higher reliability. A pad electrode is formed on a surface of a silicon die. A via...
7576413 Packaged stacked semiconductor device and method for manufacturing the same  
The present invention provides a packaged stacked semiconductor device which includes bumps serving as external electrode terminals, the bumps being provided on both a front surface and a back...
7566968 Biosensor with smart card configuration  
A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring...
7566656 Method and apparatus for providing void structures  
The present invention relates to integrated circuits. In particular, but not exclusively, the invention relates to a method and apparatus for connecting elements of integrated circuits with...
7564118 Chip and wafer integration process using vertical connections  
A metallized feature is formed in the top surface of a substrate, and a handling plate is attached to the substrate. The substrate is then thinned at the bottom surface thereof to expose the bottom...
7564115 Tapered through-silicon via structure  
An integrated circuit structure includes a substrate; a through-silicon via (TSV) in the substrate, the TSV being tapered; a hard mask region extending from a top surface of the substrate into the...
7560802 Electrical connections in substrates  
A method of making an electrical connection between a first (top) and a second (bottom) surface of a conducting or semi-conducting substrate includes creating a trench in the first surface, and...
7557017 Method of manufacturing semiconductor device with two-step etching of layer  
The invention is directed to improvement of reliability of a process of separating a layer to be patterned such as a wiring layer in a semiconductor device manufacturing method. A wiring layer is...
7547958 Semiconductor device, electronic device, and manufacturing method of the same  
The present invention provides a technology that makes it possible to enhance the gain and the efficiency of an RF bipolar transistor. Device isolation is given between a p+ type isolation region...
7547929 Semiconductor HBT MMIC device and semiconductor module  
The present invention provides a semiconductor device which comprises active components, passive components, wiring lines and electrodes and are satisfactory in terms of mechanical strength,...
7547630 Method for stacking semiconductor chips  
In a semiconductor system ( 100 ) including a chip ( 101 ) and a workpiece ( 102 ), the chip has metal-filled vias ( 140 ) positioned between contact pads ( 120 ) and the respective edges ( 110 )....
7545045 Dummy via for reducing proximity effect and method of using the same  
A dummy via design for a dual damascene structure has a dielectric layer on a substrate, a dual damascene structure filled with a conductive material and inlaid in the dielectric layer, and a dummy...
7534722 Back-to-front via process  
A method performed on a semiconductor chip having a doped semiconductor material abutting a substrate involves creating a first via through at least a portion of the substrate extending from an...
7531890 Multi-chip package (MCP) with a conductive bar and method for manufacturing the same  
A multi-chip package (MCP) is provided. The MCP comprises a plurality of stacked semiconductor chips, each including a chip pad and a first insulating layer overlying the chip pad with an opening...
7531455 Method for forming storage node contact in semiconductor device using nitride-based hard mask  
A method for forming a storage node contact in a semiconductor device using a nitride-based hard mask is provided. The method includes: forming an inter-layer oxide layer on a substrate; forming a...
7524753 Semiconductor device having through electrode and method of manufacturing the same  
A method of manufacturing a semiconductor device having a through electrode, includes forming through holes 36 in a substrate 31 , forming a first metal layer 39 from one surface side of the...
7521807 Semiconductor device with inclined through holes  
A semiconductor device has a semiconductor substrate with an inclined through hole extending between its two major surfaces in a peripheral part of the substrate, providing an electrical...
7511359 Dual die package with high-speed interconnect  
Embodiments of the invention relate to the construction of a dual die package with a high-speed interconnect. A package is created having a first die on a first side of a base substrate and a...
7498661 Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus  
A manufacturing method for a semiconductor device includes a hole portion formation step for forming hole portions whose entire width is substantially identical to the width of the opening portion...
7495316 Methods of forming conductive vias and methods of forming multichip modules including such conductive vias  
A method of forming a multiconductor via includes forming at least one seed layer in at least one through-hole of a substrate, selectively patterning the seed layer to form a plurality of laterally...
7491582 Method for manufacturing semiconductor device and semiconductor device  
A semiconductor device includes: a connecting body including a connecting electrode; and at least one semiconductor chip stacked on the connecting body, the semiconductor chip including: a...
7485948 Front-end processing of nickel plated bond pads  
A front-end method of fabricating nickel plated caps over copper bond pads used in a memory device. The method provides protection of the bond pads from an oxidizing atmosphere without exposing...
7473984 Method for fabricating a metal-insulator-metal capacitor  
A method fabricating multiple wiring metals in a semiconductor device. The method includes forming a lower wiring metal on a semiconductor substrate, forming an interlayer dielectric on the lower...
7473616 Method and system for wafer bonding of structured substrates for electro-mechanical devices  
A method for forming a composite substrate structure. The method includes providing a first substrate, the first substrate having a surface region and a backside region, providing a handling...
7456098 Building metal pillars in a chip for structure support  
Stacked via pillars, such as metal via pillars, are provided at different and designated locations in IC chips to support the chip structure during processing and any related processing stresses...
7452751 Semiconductor device and method of manufacturing the same  
Semiconductor device includes a pair of substrates ( 1, 2 ) disposed oppositely, semiconductor elements ( 5, 6 ) formed in the substrates ( 1, 2 ), respectively, and having semiconductor circuits (...
7446424 Interconnect structure for semiconductor package  
A semiconductor device includes a semiconductor substrate having top and bottom surfaces, the top surface having at least one device region thereon. At least one trench opening is formed through...
7446418 Semiconductor device for preventing defective filling of interconnection and cracking of insulating film  
The semiconductor device has insulating films 40, 42 formed over a substrate 10 ; an interconnection 58 buried in at least a surface side of the insulating films 40, 42 ; insulating films ...
7443030 Thin silicon based substrate  
Embodiments of the invention provide a device with a die and a substrate having a similar coefficient of thermal expansion to that of the die. The substrate may comprise a silicon base layer. Build...
7436068 Components for film forming device  
Herein disclosed are a component of a film-forming device, in which a thin films is formed on a substrate using a film-forming material, whose surface structure makes any breakage, peeling off...
7420262 Electronic component and semiconductor wafer, and method for producing the same  
The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are...
7416963 Manufacturing method of semiconductor device  
This invention offers a manufacturing method to reduce a manufacturing cost of a semiconductor device having a through-hole electrode by simplifying a manufacturing process and to enhance yield of...
7413925 Method for fabricating semiconductor package  
According to this invention, a method for fabricating a semiconductor package, in which a plurality of semiconductor chips having a through electrode is layered on a semiconductor interposer,...
7408249 Packaged integrated circuits and methods of producing thereof  
A packaged integrated circuit and method for producing thereof, including an integrated circuit substrate lying in a substrate plane and having electrical circuitry formed thereon, a package...
7393770 Backside method for fabricating semiconductor components with conductive interconnects  
A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a circuit side, a backside, and a...
7391107 Signal routing on redistribution layer  
A semiconductor wafer has a dielectric layer, a metal last layer, a passivation layer, and a redistribution layer. The metal last layer is formed over the dielectric layer, and the metal last layer...
7387958 MMIC having back-side multi-layer signal routing  
A method includes providing a single crystal wafer having MMIC chips. Each chip has an active device in a first surface portion of a semiconductor substrate provided by the wafer and an electrical...
7381627 Dual wired integrated circuit chips  
A semiconductor device having wiring levels on opposite sides and a method of fabricating a semiconductor structure having contacts to devices and wiring levels on opposite sides. The method...
7371602 Semiconductor package structure and method for manufacturing the same  
A semiconductor package structure comprises a chip, a plurality of pad extension traces, a plurality of via holes, a lid and a plurality of metal traces, wherein the chip has an optical component...
7365413 Reduced power distribution mesh resistance using a modified swiss-cheese slotting pattern  
Electrical interconnects with a slotting pattern are provided in the present invention. In addition, the masks for making such interconnects and semiconductor devices incorporating such...
7358616 Semiconductor stacked die/wafer configuration and packaging and method thereof  
A reciprocal design symmetry allows stacked wafers or die on wafer to use identical designs or designs that vary only by a few layers (e.g. metal interconnect layers). Flipping or rotating one die...
7358602 Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer  
A semiconductor chip includes: a semiconductor substrate; a penetrating electrode which is formed through the semiconductor substrate from a first surface to a second surface of the semiconductor...
7355267 Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements  
A method of forming a multiconductor via includes forming at least one seed layer in at least one through-hole of a substrate, selectively patterning the seed layer to form a plurality of laterally...
7341938 Single mask via method and device  
A method of connecting elements such as semiconductor devices and a device having connected elements such as semiconductor devices. A first element having a first contact structure is bonded to a...
7327022 Assembly, contact and coupling interconnection for optoelectronics  
A novel micro optical system as a platform technology for electrical and optical interconnections, thermal and mechanical assembly and integration of electronic, optoelectronic, passive and active...
7312521 Semiconductor device with holding member  
Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which...
Matches 1 - 50 out of 253 1 2 3 4 5 6 >