Matches 1 - 50 out of 440 1 2 3 4 5 6 7 8 9 >
Match Document Document Title
7622364 Bond pad for wafer and package for CMOS imager  
An electronic packaging having at least one bond pad positioned on a chip for effectuating through-wafer connections to an integrated circuit. The electronic package is equipped with an edge seal...
7618878 Wafer dividing method  
A method of dividing a wafer having a plurality of devices, which are formed in a plurality of areas sectioned by streets formed in a lattice pattern on the front surface, and having test metal...
7618877 Semiconductor wafer, method of manufacturing the same, and method of manufacturing a semiconductor device  
In a semiconductor wafer including a plurality of element forming regions formed on a front surface of a semiconductor substrate, a scribe line groove is formed along a periphery of the each of the...
7615848 Semiconductor device and a method of manufacturing the same  
A semiconductor IC device which includes a circuit region and a peripheral region on a main surface of a semiconductor substrate, a first insulating film formed over the main surface, external...
7608932 Deterministic generation of an integrated circuit identification number  
The generation of an identification number of a chip supporting at least one integrated circuit, including the step of causing a cutting of at least one conductive section by cutting of the chip...
7605457 Semiconductor device and method of manufacturing the same  
The present invention provides a semiconductor device that includes: stacked semiconductor chips, each semiconductor chip including a semiconductor substrate and a first insulating layer that is...
7605448 Semiconductor device with seal ring  
A semiconductor device according to the invention is a semiconductor device which includes a low dielectric constant film of which the relative dielectric constant is less than 3.5, is provided...
7602071 Apparatus for dividing an adhesive film mounted on a wafer  
A method of dividing an adhesive film mounted on the back surface of a wafer having a plurality of streets formed on the front surface in a lattice pattern and function elements formed in a...
7592686 Semiconductor device having a junction extended by a selective epitaxial growth (SEG) layer and method of fabricating the same  
In a semiconductor device, and a method of fabricating the same, the semiconductor device includes a protrusion extending from a substrate and a selective epitaxial growth (SEG) layer surrounding...
7589396 Chip scale surface mount package for semiconductor device and process of fabricating the same  
A semiconductor package with contacts on both sides of the dice on a wafer scale. The back side of the wafer is attached to a metal plate. The scribe lines separating the dice expose the metal...
7589395 Multiple-dice packages using elements between dice to control application of underfill material to reduce void formation  
Application of underfill material may be controlled to minimize the formation of voids between a plurality of integrated circuit (“IC”) dice and a substrate in an IC package. One or more...
7586176 Semiconductor device with crack prevention ring  
A crack prevention ring at the exterior edge of an integrated circuit prevents delamination and cracking during the separation of the integrated circuits into individual die. The crack prevention...
7586175 Semiconductor wafer having embedded electroplating current paths to provide uniform plating over wafer surface  
A semiconductor wafer having multi-layer metallization structures that are fabricated to include embedded interconnection structures which serve as low-resistance electroplating current paths to...
7582950 Semiconductor chip having gettering layer, and method for manufacturing the same  
In a semiconductor chip A wherein an element layer 2 having transistors and the like is formed on the front face, and the back face is joined to an underlying member, such as a package substrate,...
7576412 Wafer with improved sawing loops  
In a wafer ( 1 ) with chips ( 2 ) and elongate separating zones ( 4 ) between the chips ( 2 ), each chip ( 2 ) comprises at least one sawing loop ( 6 ), which sawing loop ( 6 ) comprises two...
7576411 Semiconductor device and method for manufacturing the same  
In manufacturing a semiconductor memory, a gate oxide film, a polysilicon film and a WSi film are laminated on the major surface of a semiconductor wafer corresponding to both an element region on...
7573130 Crack trapping and arrest in thin film structures  
The present invention relates to a process for preparing a robust crack-absorbing integrated circuit chip comprising a crack trapping structure containing two metal plates and a via-bar structure...
7569409 Isolation structures for CMOS image sensor chip scale packages  
Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support...
7566915 Guard ring extension to prevent reliability failures  
An embodiment of the present invention is a technique to prevent reliability failures in semiconductor devices. A trench is patterned in a polyimide layer over a guard ring having a top metal...
7566636 Method of scribing stuck mother substrate and method of dividing stuck mother substrate  
There is provided a method of scribing a stuck mother substrate for obtaining a plurality of stuck substrates formed by sticking a first square substrate and a second square substrate together so...
7564107 Power semiconductor device including a terminal structure  
A semiconductor device is disclosed, which comprises a terminal section formed to surround a device active region. The terminal section includes a trench formed in the semiconductor layer, and a...
7563694 Scribe based bond pads for integrated circuits  
A method and system for utilizing a semiconductor wafer is disclosed. The wafer comprises a plurality of semiconductor die and a plurality of scribe areas interspersed between. The method and...
7560801 Rewiring substrate strip with several semiconductor component positions  
A rewiring substrate strip and a method of producing a rewiring substrate strip is disclosed. In one embodiment, the rewiring substrate strip has several semiconductor component positions for...
7557430 Semiconductor seal ring  
An improved semiconductor seal ring and method therefore is described. The seal ring comprises a thick layer wherein at least a portion of the thick layer is removed from a singulation street prior...
7557017 Method of manufacturing semiconductor device with two-step etching of layer  
The invention is directed to improvement of reliability of a process of separating a layer to be patterned such as a wiring layer in a semiconductor device manufacturing method. A wiring layer is...
7554211 Semiconductor wafer and manufacturing process for semiconductor device  
A semiconductor wafer 1 has first scribe lines 31 in two mutually perpendicular directions which have a first width and divide the semiconductor wafer 1 into a plurality of areas; second...
7554176 Integrated circuits having a multi-layer structure with a seal ring  
A plurality of IC regions are formed on a semiconductor wafer, which is cut into individual chips incorporating ICs, wherein wiring layers and insulating layers are sequentially formed on a silicon...
7545653 Semiconductor integrated circuit device  
A disclosed semiconductor integrated circuit device includes a digital circuit and an analog circuit formed on one semiconductor substrate; a guard band configured to prevent noise generated in the...
7545024 Laser beam processing apparatus for processing semiconductor wafer in production of semiconductor devices, laser beam processing method executed therein, and such semiconductor wafer processed thereby  
In a laser beam processing apparatus that processes a semiconductor wafer having a multi-layered wiring structure formed thereon, scribe lines defined thereon, and at least one alignment mark...
7535115 Wafer and method of producing a substrate by transfer of a layer that includes foreign species  
A method of producing a substrate that has a transfer crystalline layer transferred from a donor wafer onto a support. The transfer layer can include one or more foreign species to modify its...
7535082 Nitride semiconductor wafer and method of processing nitride semiconductor wafer  
Nitride semiconductor wafers which are produced by epitaxially grown nitride films on a foreign undersubstrate in vapor phase have strong inner stress due to misfit between the nitride and the...
7534699 Separating and assembling semiconductor strips  
A method and an apparatus for separating elongated semiconductor strips from a wafer of semiconductor material are disclosed. Vacuum is applied to the face of each semiconductor strip forming an...
7518217 Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor  
A semiconductor wafer is manufactured in such a way that a main surface of a semiconductor substrate is partitioned into a plurality of semiconductor element forming regions defined by scribing...
7508083 Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same  
The invention relates to an electronic component, which comprises a semiconductor chip. The semiconductor chip is embedded in a plastic housing in such a way that is rear side and its lateral sides...
7508052 Crack protection for silicon die  
A wafer containing a plurality of die separated by streets which are to be sawn has a nitride passivation layer which has openings over die contact locations and gaps leaving nitride strips along...
7508051 Wafer with optical control modules in dicing paths  
In a wafer ( 1 ) with a number of exposure fields ( 2 ), each of which exposure fields ( 2 ) comprises a number of lattice fields ( 3 ) with an IC ( 4 ) located therein, two groups ( 5, 7 ) of...
7504722 Semiconductor device with slanting side surface for external connection  
The invention provides a semiconductor device and a manufacturing method thereof where mounting strength and accuracy can be improved without making processes complex. Grooves are formed on a back...
7501311 Fabrication method of a wafer structure  
A wafer fabricating method at least includes the steps of providing a wafer having an active surface with a plurality of pads, forming a plurality of bumps on the pad, and forming an organic...
7498660 Semiconductor device  
A semiconductor device includes a seal ring formed on an outer circumference of an element forming region when seen from the top in a multilayer interconnect structure formed on a silicon layer,...
7498659 Semiconductor device, method of manufacturing the same, and phase shift mask  
A main wall part is provided so as to surround an integrated circuit part. A sub-wall part which is in “L” shape is provided between each corner of the main wall part and the integrated circuit...
7495315 Method and apparatus of fabricating a semiconductor device by back grinding and dicing  
A method and apparatus of fabricating a semiconductor device by back grinding and dicing is disclosed. The method may include at least adhering a protection tape for back grinding on a front...
7488668 Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regions  
With use of a length-dimension of a second-line-segment of a unit-device-formation-region as an arrangement interval, a plurality of parallel lines are disposed in a...
7485549 Seal ring for mixed circuitry semiconductor devices  
In mixed-component, mixed-signal, semiconductor devices, selective seal ring isolation from the substrate and its electrical potential is provided in order to segregate noise sensitive circuitry...
7482675 Probing pads in kerf area for wafer testing  
A structure and a method for forming the same. The structure includes (a) a substrate having a top substrate surface; (b) an integrated circuit on the top substrate surface, wherein the integrated...
7470601 Semiconductor device with semiconductor chip and adhesive film and method for producing the same  
A semiconductor device includes a semiconductor chip and an adhesive film between the back side of the semiconductor chip and a chip pad of a leadframe. The adhesive film includes a film core and...
7468544 Structure and process for WL-CSP with metal cover  
A wafer level package comprises a wafer having a plurality of dice formed thereon; a thinner metal cover with a cavity formed therein attached on the wafer by an adhesive material to improve...
7459768 Semiconductor wafer and dicing method  
In order to improve the yield by suppressing peeling or the like of an accessory pattern when dicing, there include: a substrate on which an element forming region and a scribe line region formed...
7456507 Die seal structure for reducing stress induced during die saw process  
A seal ring structure between an integrated circuit region and a scribe line is provided. In one embodiment, the seal ring structure comprises a substrate; a plurality of layers of metal lines...
7456489 Wafer with optical control modules in IC fields  
In a wafer ( 1 ) with a number of exposure fields ( 2 ), each of which exposure fields comprises a number of lattice fields ( 3 ) with an IC ( 4 ) located therein, two groups ( 5, 7 ) of saw paths...
7443010 Matrix form semiconductor package substrate having an electrode of serpentine shape  
A matrix form semiconductor package substrate that has an electrode situated in-between a plurality of IC package substrates for providing electrical communication to conductive pads on the...
Matches 1 - 50 out of 440 1 2 3 4 5 6 7 8 9 >