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8183633 |
Semiconductor device and method for forming the same
Provided is a semiconductor and a method for forming the same. The method includes forming a buried insulating layer locally in a substrate. The substrate is etched to form an opening exposing the...
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8169059 |
On-chip RF shields with through substrate conductors
Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, the system on a chip includes an RF component disposed on a first part of a substrate, a...
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8138575 |
Integrated circuit including a reverse current complex
An integrated circuit and a production method is disclosed. One embodiment forms reverse-current complexes in a semiconductor well, so that the charge carriers, forming a damaging reverse current,...
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8129817 |
Reducing high-frequency signal loss in substrates
An integrated circuit structure includes a semiconductor substrate of a first conductivity type; and a depletion region in the semiconductor substrate. A deep well region is substantially enclosed...
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8093676 |
Semiconductor component including an edge termination having a trench and method for producing
A semiconductor component includes a semiconductor body having a first side, a second side, an edge delimiting the semiconductor body in a lateral direction, an inner region and an edge region. A...
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8084844 |
Semiconductor device
A semiconductor device in which potential is uniformly controlled and in which the influence of noise is reduced. A p-type well region is formed beneath a surface of a p-type Si substrate. n-type...
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8084843 |
N well implants to separate blocks in a flash memory device
A semiconductor memory device that has an isolated area formed from one conductivity and formed in part by a buried layer of a second conductivity that is implanted in a substrate. The walls of the...
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8049286 |
Semiconductor device and semiconductor device manufacturing method
In the present invention, there is provided a semiconductor device including: element isolation regions formed in a state of being buried in a semiconductor substrate such that an element formation...
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8030654 |
Thin film transistor and method of manufacturing the same
A thin film transistor comprising a gate electrode, a gate insulating layer, an active layer, and source and drain electrodes is provided. The gate electrode overlaps with a channel region of the...
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7944021 |
Semiconductor device with suppressed hump characteristic
A semiconductor device includes an element isolation film formed on a semiconductor substrate surface of one conductivity type, a gate electrode having one pair of end portions located on a...
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7888775 |
Vertical diode using silicon formed by selective epitaxial growth
Some embodiments relate to an apparatus that exhibits vertical diode activity to occur between a semiconductive body and an epitaxial film that is disposed over a doping region of the...
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7884426 |
Layout design method of semiconductor integrated circuit having well supplied with potential different from substrate potential
Design time (TAT) is reduced in a layout design of a semiconductor integrated circuit having a well supplied with a potential different from a substrate potential. A layout design method of the...
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7883946 |
Angled implantation for deep submicron device optimization
A method for forming a submicron device includes depositing a hard mask over a first region that includes a polysilicon well of a first dopant type and a gate of a second dopant type and a second...
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7859905 |
Semiconductor storage device and method of manufacturing the same
A method of manufacturing a semiconductor storage device according to an embodiment of the present invention includes forming dummy cells 611, to 618 at a position adjacent to a reference cell 412,...
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7851889 |
MOSFET device including a source with alternating P-type and N-type regions
Apparatus and methods are provided for fabricating semiconductor devices with reduced bipolar effects. One apparatus includes a semiconductor body (120) including a surface and a transistor source...
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7851285 |
Non-volatile memory device and method for fabricating the same
A method for fabricating a non-volatile memory device includes forming a charge tunneling layer composed of a hafnium silicate (HfSixOyNz) layer on a semiconductor substrate. A charge trapping...
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7763542 |
Semiconductor memory device and method of fabricating the same
A semiconductor memory device includes a semiconductor substrate. An inter-layer dielectric is disposed on the semiconductor substrate. A bit line is disposed on the inter-layer dielectric. A bit...
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7763955 |
Reducing shunt currents in a semiconductor body
A description is given of a concept for reducing shunt currents in a semiconductor body.
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7723799 |
Semiconductor device
A semiconductor device includes a P-substrate, an N-well disposed in the P-substrate, an NMOS transistor disposed in the P-substrate and having one of a source and a drain connected to a ground...
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7696592 |
Solid state imaging apparatus method for fabricating the same and camera using the same
A solid state imaging apparatus includes a plurality of photoelectric conversion sections formed in an imaging area of a silicon substrate, and an embedded layer embedded in an isolation trench...
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7675120 |
Integrated circuit having a multipurpose resistor for suppression of a parasitic transistor or other purposes
A composite integrated circuit incorporating two LDMOSFETs of unlike designs, with the consequent creation of a parasitic transistor. A multipurpose resistor is integrally built into the composite...
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7649238 |
Semiconductor device
In a PMOS transistor, the source-drain region is divided into four parts along the gate width and has an arrangement of four independent source regions and an arrangement of four independent drain...
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7608913 |
Noise isolation between circuit blocks in an integrated circuit chip
An integrated circuit includes a p-well block region having a high resistivity due to low doping concentration formed in a region of a substrate for providing noise isolation between a first...
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7560797 |
Semiconductor device and manufacturing method of the same
In a semiconductor device of the present invention, two epitaxial layers are formed on a P type single crystal silicon substrate. One of the epitaxial layers has an impurity concentration higher...
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7491964 |
Nitridation of STI fill oxide to prevent the loss of STI fill oxide during manufacturing process
A method and structure for an improved shallow trench isolation (STI) structure for a semiconductor device. The STI structure incorporates an oxynitride top layer of the STI fill. Optionally, the...
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7443009 |
N well implants to separate blocks in a flash memory device
A semiconductor memory device that has an isolated area formed from one conductivity and formed in part by a buried layer of a second conductivity that is implanted in a substrate. The walls of the...
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7420260 |
Power semiconductor device for suppressing substrate recirculation current and method of fabricating power semiconductor device
A power semiconductor device has a first region in which a transistor is formed, a third region in which a control element is formed, and a second region for separating the first region and the...
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7414295 |
Transistor and method of operating transistor
A transistor in which a physical property of its channel is changed according to an applied voltage, and methods of manufacturing and operating the same are provided. The transistor may include a...
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7411271 |
Complementary metal-oxide-semiconductor field effect transistor
A complementary metal-oxide-semiconductor field effect transistor (CMOSFET) is provided. The CMOSFET includes a substrate of a first conductivity type, a first epitaxial layer, a well, a second...
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7402885 |
LOCOS on SOI and HOT semiconductor device and method for manufacturing
One or more local oxidation of silicon (LOCOS) regions may be formed that apply compressive strain to a channel of a field-effect transistor such as a P-type field-effect transistor (PFET) or other...
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7385275 |
Shallow trench isolation method for shielding trapped charge in a semiconductor device
A semiconductor structure and associated method for forming the semiconductor structure. The semiconductor structure comprises a first field effect transistor (FET), a second FET, and a shallow...
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7301219 |
Electrically erasable programmable read only memory (EEPROM) cell and method for making the same
An asymmetrically doped memory cell has first and second N+ doped junctions on a P substrate. A composite charge trapping layer is disposed over the P substrate and between the first and the second...
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7193293 |
Semiconductor component with a compensation layer, a depletion zone, and a complementary depletion zone, circuit configuration with the semiconductor component, and method of doping the compensation layer of the semiconductor component
A semiconductor component, which functions according to the principle of charge carrier compensation, has incompletely ionized dopants that are additionally provided in a semiconductor body of the...
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7064414 |
Heater for annealing trapped charge in a semiconductor device
A structure and associated method for annealing a trapped charge from a semiconductor device. The semiconductor structure comprises a substrate and a first heating element. The substrate comprises...
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6972476 |
Diode and diode string structure
A diode structure is provided. The diode structure comprises a first conductive type substrate, a second conductive type first well region, a first conductive type second well region, a second...
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6972475 |
Semiconductor device
A semiconductor device includes an N channel MOS transistor. The N channel MOS transistor includes a first P type buried layer that isolates an N epitaxial region on a P type substrate (P-SUB) from...
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6900518 |
Semiconductor device
A power semiconductor device has an active region that includes a drift region. At least a portion of the drift region is provided in a membrane which has opposed top and bottom surfaces. In one...
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6800925 |
Integrated circuit configuration having a structure for reducing a minority charge carrier current
An integrated circuit configuration includes a semiconductor body having a first semiconductor zone of a first conductivity type in a region near a rear side and a second semiconductor zone of the...
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6756280 |
Semiconductor device and a process for producing same
In a semiconductor device having a junction type diode using a bipolar transistor and a process for producing the same, a ratio of a diode electric current to a leakage electric current is...
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6639294 |
Semiconductor device having a device formation region protected from a counterelectromotive force
A semiconductor device includes an epitaxial layer formed on a P type silicon substrate; a P+ diffusion layer for dividing the epitaxial layer into an N− epi layer, which constitutes a device f...
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6593601 |
Integrated circuit device that can suppress undesired inter-device effects
When forming first and second circuits on a semiconductor substrate, an isolation region is provided between the first and second circuits by embedding a conductor in the semiconductor substrate....
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6590261 |
Electrostatic discharge protection structure
An electrostatic discharge (ESD) protection structure is disclosed. The ESD protection structure of the present invention uses a resistance capacitance (RC) circuit to distinguish an overshoot...
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6586292 |
Guard mesh for noise isolation in highly integrated circuits
A methodology of creating integrated circuits with improved noise isolation is presented. The circuitry of an integrated circuits is separated into noise generating circuit blocks and noise...
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6563159 |
Substrate of semiconductor integrated circuit
Provided is a substrate of a semiconductor integrated circuit which can easily manufacture an integrated circuit having a soft error resistance, a latch up resistance and an ESD resistance...
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6563181 |
High frequency signal isolation in a semiconductor device
A semiconductor device (20) includes an isolated p-well (22) formed in a substrate (21) by a buried n-well (25) and an n-well ring (24). The n-well ring (24) extends from a surface of the...
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6559515 |
Insulating wall between power components
An insulating wall of a second conductivity type intended for separating elementary components formed in different wells of a semiconductive layer of a first conductivity type, a component located...
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6528884 |
Conformal atomic liner layer in an integrated circuit interconnect
A manufacturing method, and an integrated circuit resulting therefrom has a substrate with a semiconductor device thereon. A channel dielectric layer is deposited over the device and has an opening...
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6512251 |
Semiconductor switching element that blocks in both directions
The semiconductor switching element blocks in both directions between a first and a second load terminal. The switching element has a field effect transistor and a bipolar transistor. The field...
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6504212 |
Method and apparatus for enhanced SOI passgate operations
A method and apparatus are provided for implementing enhanced silicon-on-insulator (SOI) passgate operations. The apparatus for implementing enhanced silicon-on-insulator (SOI) passgate operations...
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6504230 |
Compensation component and method for fabricating the compensation component
A compensating component and a method for the production thereof are described. Compensating regions are produced by implanting sulfur or selenium in a p-conductive semiconductor layer or, are...
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