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7061093 |
Semiconductor device and voltage regulator
A semiconductor device having a chip size package is disclosed. The chip size package comprises a semiconductor chip having at least a bonding pad, at least a terminal of said chip size package and...
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7053432 |
Enhanced surface area capacitor fabrication methods
A capacitor fabrication method may include forming a first capacitor electrode over a substrate and atomic layer depositing an insulative barrier layer to oxygen diffusion over the first electrode....
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7053462 |
Planarization of metal container structures
A conductive material is provided in an opening formed in an insulative material. The process involves first forming a conductive material over at least a portion of the opening and over at least a...
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7049679 |
Capacitor and production method therefor
A solid electrolytic capacitor is obtained in which a sintered metal serves as an anode and a silver layer serves as a cathode. A surface of sintered metal made of tantalum or the like and having...
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7046936 |
Light receiving element carrier and optical receiver
There is provided a light receiving element carrier including first through fourth layers laminated, a differential pair of vertical vias, one of them penetrating the second layer, and the other...
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7042064 |
Integrated circuit with a MOS capacitor
The present invention relates to an integrated circuit having a MOS capacitor. In one embodiment, a method of forming an integrated circuit comprises forming an oxide layer on a surface of a...
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7042041 |
Semiconductor device
There is here disclosed a semiconductor device comprising a capacitor provided on a substrate and formed by sandwiching a capacitive insulating film between lower and upper electrodes, an...
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7038296 |
Electrical component structure
An electrical component structure ( 14 ) comprises a plurality of overlying substantially parallel layers ( 15, 16 ). Each layer ( 15, 16 ) provides a lattice ( 17, 20 ) comprising a first set of...
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7030443 |
MIM capacitor
A MIM (metal-insulator-metal) capacitor is provided with a substrate; a first metal area; a second metal area formed between the substrate and the first metal area; and a first insulating layer...
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7030460 |
Selectable capacitance apparatus and methods
A user-selectable integrated circuit capacitance apparatus may include first and second electrodes defining a first fractal geometry, along with second and third electrodes defining a second...
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7026676 |
Memory array having a layer with electrical conductivity anisotropy
A memory array includes a memory layer that has hysteretic domains with domain axes extending between first and second memory layer surfaces. A conductive layer on the first memory layer surface...
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7027289 |
Extended thin film capacitor (TFC)
Extending high k material of a second dielectric layer to surround at least one thru-via designed to provide a signal other than a power signal to a die may eliminate discrete AC coupling...
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7026703 |
Thin-film capacitor element with reduced inductance component
A conductive material such as silver is charged in a via hole of an insulative substrate made of low-temperature-sintered ceramic. A lower electrode, a dielectric layer, and an upper electrode are...
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7019352 |
Low silicon-hydrogen sin layer to inhibit hydrogen related degradation in semiconductor devices having ferroelectric components
Semiconductor devices and fabrication methods are disclosed, in which one or more low silicon-hydrogen SiN barriers are provided to inhibit hydrogen diffusion into ferroelectric capacitors and into...
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7015561 |
Active rectifier
A switching circuit has an active switch, a controller, and at least two terminals. The at least two terminals include two current control terminals for connection at two locations in another...
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7015564 |
Capacitive element and semiconductor memory device
A capacitive element includes a lower electrode having a three-dimensional shape, an upper electrode formed so as to be opposed to the lower electrode, and a capacitor insulating film formed...
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7015152 |
Method of film deposition, and fabrication of structures
A method of fabricating aluminum oxide films utilizing aluminum alkoxide precursors is described. The aluminum oxide film is formed by (a) providing an aluminum alkoxide precursor that is...
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7012317 |
Tunable thin film capacitor
It is an object of the invention to provide a variable capacitor constituted such that, even when an external control voltage is applied, a stable dielectric constant of the dielectric layer can be...
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7012339 |
Semiconductor chip with passive element in a wiring region of the chip
When an integrated circuit is formed in a semiconductor wafer, the integrated circuit is formed only in the central part of each chip region. In a case where packaging other than a chip size...
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7013436 |
Analog circuit power distribution circuits and design methodologies for producing same
A power distribution circuit built with wiring layers that reside above an analog circuit is described. The power distribution circuit comprises one or more capacitive structures that reside above...
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7009276 |
Thin film capacitor, thin film capacitor array and electronic component
A thin film capacitor with small electrode resistance and great Q-value which comprises a small number of thin films that are deposited successively is disclosed. It is effective for...
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7009891 |
System and method for one-time programmed memory through direct-tunneling oxide breakdown
A one-time programming memory element, capable of being manufactured in a 0.13 μm or below CMOS technology, having a capacitor, or transistor configured as a capacitor, with an oxide layer capable...
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7005721 |
RF passive circuit and RF amplifier with via-holes
An input matching parallel inductor 114 which utilizes a spiral inductor, and an input matching parallel capacitor 115 which utilizes an MIM capacitor, both being constituting elements of an...
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7002234 |
Low cost capacitors manufactured from conductive loaded resin-based materials
Capacitors are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of...
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7002439 |
Switchable capacitor and method of making the same
A micro electromechanical switchable capacitor is disclosed, comprising a substrate, a bottom electrode, a dielectric layer deposited on at least part of said bottom electrode, a conductive...
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7002249 |
Microelectronic component with reduced parasitic inductance and method of fabricating
A semiconductor device package is disclosed which includes inter-digitated input and output bond wires configured to increase the negative mutual inductive coupling between the wires, thus reducing...
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7002248 |
Semiconductor components having multiple on board capacitors
A semiconductor component includes a semiconductor die, and an on board capacitor on the die for filtering transient voltages, spurious signals and power supply noise in signals transmitted to the...
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6995451 |
Buried collar trench capacitor formed by LOCOS using self starved ALD nitride as an oxidation mask
A method for manufacturing a trench capacitor that comprises defining a semiconductor substrate, forming a trench with a lower region and an upper region in the semiconductor substrate, forming a...
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6995450 |
Semiconductor device with a frequency selective guard ring
A ring-shaped P + type diffusion region is formed on the top surface of a P type substrate in such a way as to surround a single internal circuit region. A shunt wiring is formed in an area...
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6995448 |
Semiconductor package including passive elements and method of manufacture
A semiconductor package including passive elements and a method of manufacturing provide reduced package size, improved performance and higher process yield by mounting the passive elements beneath...
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6995463 |
Integrated chip package having intermediate substrate and multiple semiconductor chips
The present integrated chip package provides a low cost package that is suitable for high density semiconductors that have high power dissipation. The integrated chip package includes at least one...
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6992344 |
Damascene integration scheme for developing metal-insulator-metal capacitors
The invention is directed to unique high-surface area BEOL capacitor structures with high-k dielectric layers and methods for fabricating the same. These high-surface area BEOL capacitor structures...
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6992368 |
Production of metal insulator metal (MIM) structures using anodizing process
Metal-insulator-metal capacitor structures are formed in semiconductor substrates using an anodization procedure on deposited underlying metalization followed by deposition of the second metal and...
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6987308 |
Ferroelectric capacitors with metal oxide for inhibiting fatigue
A method of forming a ferroelectric capacitor includes forming a lower electrode on a substrate. The lower electrode is oxidized to form a metal oxide film. A ferroelectric film is formed on the...
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6982472 |
Semiconductor device and capacitor
A semiconductor device comprises a semiconductor substrate and a capacitor provided above the semiconductor substrate, the capacitor comprises a lower electrode containing metal, a dielectric film...
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6977805 |
Capacitor element, semiconductor integrated circuit and method of manufacturing those
A dielectric layer is formed on a first metal layer, the dielectric layer is formed with many concave portions at the upper surface. A second metal layer is formed on the dielectric layer, the...
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6972473 |
Structure and method of making an enhanced surface area capacitor
As disclosed herein, a capacitor structure and method are provided to enhance plate surface area to provide increased capacitance. The capacitor structure includes a base which includes a surface...
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6972436 |
High voltage, high temperature capacitor and interconnection structures
Capacitors and interconnection structures for silicon carbide are provided having an oxide layer, a layer of dielectric material and a second oxide layer on the layer of dielectric material. The...
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6969880 |
High capacitive density stacked decoupling capacitor structure
A capacitive structure ( 10 ). The capacitive structure comprises a semiconductor base region ( 30 ) having an upper surface, a well ( 12 ) formed within the semiconductor base region and adjacent...
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6965167 |
Laminated chip electronic device and method of manufacturing the same
The present invention discloses a laminated chip electronic device and a method of manufacturing the same. In the laminated chip electronic device and the method of manufacturing the same according...
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6963122 |
Capacitor structure and automated design flow for incorporating same
A capacitive structure is described that comprises a first node and a second node. The first node comprises a first pair of vertically aligned strips that are electrically connected with one or...
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6963483 |
Self-aligned coaxial via capacitors
The various embodiments of coaxial capacitors are self-aligned and formed in a via, including blind vias, buried vias and plated through holes. The coaxial capacitors are adapted to utilize the...
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6963084 |
Semiconductor device having a storage capacitor
In a semiconductor device having a substrate which has a metal surface, an insulating film which is formed on the substrate having the metal surface, and a pixel unit which is formed on the...
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6960365 |
Vertical MIMCap manufacturing method
A method of manufacturing a vertical metal-insulator-metal capacitor (MIMCap) ( 10 ) in regions ( 19 ) of an insulating layer ( 14 ). Trenches for both conductive lines and vertical MIMCap's are...
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6958522 |
Method to fabricate passive components using conductive polymer
A method and structure for an integrated circuit chip has a logic core which includes a plurality of insulating and conducting levels, an exterior conductor level and passive devices having a...
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6949815 |
Semiconductor device with decoupling capacitors mounted on conductors
A semiconductor device has an LSI device provided with a plurality of power supply line connection pads and ground line connection pad in a peripheral edge part of a circuit-formation surface,...
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6949811 |
Device having interdigital capacitor
A device includes a transistor, and two interdigital capacitors. The transistor is located on an imaginary extension line aligned with a common electrode of the two interdigital capacitors.
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6949810 |
Active phase cancellation for power delivery
An apparatus and a method for active phase cancellation for an inductor/capacitor network have been disclosed. One embodiment of the apparatus includes a package and a die mounted on the package....
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6943375 |
Capacitor in a pixel structure
A capacitor in a pixel structure deposited under a pixel electrode comprises a top electrode, a bottom electrode, and a dielectric layer between the top electrode and the bottom electrode. The top...
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6943397 |
Device having capacitor and its manufacture
A device having a capacitor element includes: an underlying body having a non-orientated first surface; a lower electrode formed on the first surface of the underlying body, the lower electrode...
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