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7619297 |
Electronic device including an inductor
An electronic device can include an inductor overlying a shock-absorbing layer. In one aspect, the electronic device can include a substrate, an interconnect level overlying the substrate, and the...
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7619296 |
Circuit board and semiconductor device
A semiconductor device, includes: a semiconductor substrate; a multilayered interconnect structure formed on the semiconductor substrate; a terminal for flip-chip packaging arranged on the surface...
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7615842 |
Inductor integrated chip
An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the...
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7612428 |
Inductor fabricated with dry film resist and cavity and method of fabricating the inductor
An inductor fabricated with a dry film resist and a cavity and a method of fabricating the inductor. The cavity can be formed in a substrate to minimize a parasitic capacitance generated by...
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7598836 |
Multilayer winding inductor
A multilayer winding inductor. The inductor at least includes multi-level interconnect and single-level interconnect structures. The multi-level interconnect structure includes a plurality of...
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7589392 |
Filter having integrated floating capacitor and transient voltage suppression structure and method of manufacture
In one embodiment, a filter structure that integrates one plate of a capacitor with an electrode of a transient voltage device. The filter structure includes a well region of one conductivity type...
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7579670 |
Integrated filter having ground plane structure
In one embodiment, a filter structure includes first and second filter devices formed using a semiconductor substrate. A vertical ground plane structure prevents cross-coupling between the first...
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7573119 |
Semiconductor device
A semiconductor device includes: a semiconductor substrate having a first face in which a hole is formed; an insulating section made of an insulating material, the insulating material accommodated...
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7573117 |
Post last wiring level inductor using patterned plate process
A semiconductor structure. The semiconductor structure includes: a substrate having a metal wiring level within the substrate; a capping layer on and above the substrate; an insulative layer on and...
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7569908 |
Semiconductor device and method of manufacturing the same
A semiconductor device including inductors with improved reliability and a method of manufacturing the same are provided. The semiconductor device may include a substrate, an insulating film...
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7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit
A method according to the present invention for producing a semiconductor-chip-mounting circuit 1 includes mainly three steps. In a first step, contacts 2 each in the form of a conical helix...
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7564319 |
Vertical LC tank device
An LC tack structure. The structure, including a set of wiring levels on top of a semiconductor substrate, the wiring levels stacked on top of each other from a lowest wiring level nearest the...
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7564078 |
Tunable semiconductor component provided with a current barrier
Semiconductor component or device is provided which includes a current barrier element and for which the impedance may be tuned (i.e. modified, changed, etc.) using a focused heating source.
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7560833 |
Drive circuit having a transformer for a semiconductor switching element
A drive circuit for a semiconductor switching element includes a transformer, first and second driver circuits, and a rectifier element. The drive circuit produces a drive signal based on an input...
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7557423 |
Semiconductor structure with a discontinuous material density for reducing eddy currents
A semiconductor structure includes an inductor; and a semiconductor substrate underlying the inductor, having a discontinuous material density across a plane underneath and in parallel with the...
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7554172 |
Multi-directional multiplexing radius convergence electrode
An electrode plate for an electricity storage and discharge device, which includes a plurality of I/O convergence terminals evenly distributed along a periphery of the electrode plate, and a...
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7550854 |
Integrated interconnect arrangement
An explanation is given of an integrated interconnect arrangement having a plurality of interconnects that cross over one another at two crossover sections. By virtue of this measure, it is...
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7545021 |
Apparatus and method for making integrated circuit packages having integrated circuits mounted onto passive electrical components
Semiconductor package assemblies having integrated circuits mounted onto passive electrical components. The assemblies each include an inductor having a magnetic core and an wire wrapped around the...
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7541662 |
Packaging chip having inductor therein
A packaging chip having inductors therein is provided. The packaging chip includes a substrate for mounting a circuit element therein, at least one port formed on a surface of the substrate, a...
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7531887 |
Miniature inductor suitable for integrated circuits
A miniature inductor suitable for integrated circuits comprises a semiconductor substrate having a coplanar strip line and a plurality of metal-insulator-metal (MIM) capacitors, wherein the...
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7524731 |
Process of forming an electronic device including an inductor
An electronic device can include an inductor overlying a shock-absorbing layer. In one aspect, the electronic device can include a substrate, an interconnect level overlying the substrate, and the...
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7518248 |
Inductive filters and methods of fabrication therefor
A series of plated through hole (PTH) vias are interconnected by traces that alternate between a top surface and a bottom surface of a dielectric board. The PTH vias in the series can be positioned...
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7511356 |
Voltage-controlled semiconductor inductor and method
A voltage-controlled semiconductor inductor and method is provided. According to various embodiments, the voltage-controlled inductor includes a conductor configured with a number of inductive...
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7511351 |
Semiconductor device and method for fabricating the same
In a semiconductor device having a WCSP type construction package, to increase inductance without increasing further an area conventionally occupied by a coil. A pseudo-post part 27 comprising a...
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7498656 |
Electromagnetic shielding structure
An improved electromagnetic shielding structure has been discovered. In one embodiment of the invention, an apparatus includes an inductor and an electrically conductive enclosure that...
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7470968 |
T-coil apparatus and method for compensating capacitance
A passive matching network is connected to an input/output line for an automatic test equipment drive channel to compensate for capacitances associated with a receiver circuit connected to the...
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7468543 |
Semiconductor device, communication device, and semiconductor device inspecting method
A semiconductor device comprises a semiconductor switching element having a first electrode, a second electrode and a third electrode, and permitting a high-frequency signal to pass through between...
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7453142 |
System and method for implementing transformer on package substrate
A transformer system includes a package substrate having a surface. A plurality of electrically conductive pads are arranged in spaced apart relationship relative to each other on the substrate...
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7451415 |
Method for predicting inductance and self-resonant frequency of a spiral inductor
In this invention, a closed-form integral model for on-chip suspended rectangular spiral inductor is presented. The model of this invention bases on the Kramers-Kronig relations, field theory, and...
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7446388 |
Integrated thin film capacitor/inductor/interconnect system and method
A system and method for the fabrication of high reliability capacitors ( 1011 ), inductors ( 1012 ), and multi-layer interconnects ( 1013 ) (including resistors ( 1014 )) on various thin film...
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7427801 |
Integrated circuit transformer devices for on-chip millimeter-wave applications
Methods are provided for building integrated circuit transformer devices having compact and optimized architectures for use in MMW (millimeter-wave) applications. The integrated circuit transformer...
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7417301 |
Semiconductor component with coreless transformer
The invention relates to a semiconductor component having a coreless first transformer ( 71, 72 ) which comprises a first ( 71 ) and a second ( 72 ) planar winding, is arranged on a semiconductor...
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7411279 |
Component interconnect with substrate shielding
An example of a circuit structure may include a first dielectric layer having first and second surfaces, and a channel extending at least partially between the first and second surfaces and along a...
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7400025 |
Integrated circuit inductor with integrated vias
Integrated circuit inductors ( 5 ) are formed by interconnecting various metal layers ( 10 ) in an integrated circuit with continuous vias ( 200 ). Using continuous vias ( 200 ) improves the Q...
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7397107 |
Ferromagnetic capacitor
An integrated circuit capacitor having a bottom plate 50 a , a dielectric layer 250 ′, and a ferromagnetic top plate 20 a .
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7390736 |
EMI and noise shielding for multi-metal layer high frequency integrated circuit processes
A circuit element that may generate or be affected by noise or electromagnetic interference may be substantially surrounded by one or more encircling plugs. The encircling plug may be closed by an...
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7380328 |
Method of forming an inductor
The invention includes a stacked open pattern inductor fabricated above a semiconductor substrate. The stacked open pattern inductor includes a plurality of parallel open conducting patterns...
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7378718 |
Fuse element with adjustable resistance
A fuse element has a first region, a second region and a third region. The first region is a portion for isolating circuitry. The second region and the third region are respectively connected to...
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7375411 |
Method and structure for forming relatively dense conductive layers
A region of high metal density may be placed in metal layers proximate to an area of low metal density below an inductor on an integrated circuit without violating manufacturing design rules for...
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7372139 |
Semiconductor chip package
A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for...
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7355264 |
Integrated passive devices with high Q inductors
The specification describes flip bonded dual substrate inductors wherein a portion of the inductor is constructed on a base IPD substrate, a mating portion of the inductor is constructed on a cover...
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7350292 |
Method for affecting impedance of an electrical apparatus
A method for affecting an impedance of a portion of an electrical circuit loop in an electrical circuit apparatus includes providing an electrical circuit apparatus having at least a portion of an...
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7342300 |
Integrated circuit incorporating wire bond inductance
The invention relates to the field of electronics, more particularly to the wire bonds incorporated into an integrated circuit package such as a quad flat pack, a ball grid array or hybrid style...
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7336147 |
Inductance variable device
A inductance variable device includes a first inductor, a second inductor magnetically coupled to the first inductor, a current source whose current is variable, electrically connected to the first...
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7332793 |
Semiconductor device
A transistor region is a region where a plurality of MOS transistors, including an MOS transistor, are formed, and a dummy region is a region lying under a spiral inductor. In the dummy region, a...
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7332792 |
Magnetic layer processing
A dielectric layer is formed over a substrate comprising a semiconductor material. A magnetic layer is formed over the dielectric layer. The magnetic layer comprises an amorphous alloy comprising...
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7327010 |
Inductors for integrated circuits
An inductor for an integrated circuit or integrated circuit package comprises a three-dimensional structure. In one embodiment the inductor is arranged on an integrated circuit substrate in at...
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7310595 |
Numerically modeling inductive circuit elements
A method of determining electrical parameters of inductive elements includes a novel technique of inverting an impedance matrix representative of said inductive circuit element. The method reduces...
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7305223 |
Radio frequency circuit with integrated on-chip radio frequency signal coupler
A radio frequency (“RF”) circuit configured in accordance with an embodiment of the invention is fabricated on a substrate using integrated passive device (“IPD”) process technology. The RF...
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7299537 |
Method of making an integrated inductor
An inductor comprises a substrate comprising a semiconductor material, a first dielectric layer over the substrate, a magnetic layer over the first dielectric layer, a second dielectric layer over...
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