Matches 301 - 350 out of 435 < 1 2 3 4 5 6 7 8 9 >
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6194248 Chip electronic part  
The present invention is a chip electronic part having: a ceramic member; a conductor pattern formed on the surface of the ceramic member; an insulating protective layer formed on the conductor...
6180995 Integrated passive devices with reduced parasitic substrate capacitance  
A method of forming high quality inductors and capacitors in semiconductor integrated circuits utilizes one or more sealed air-gaps in a supporting substrate under the passive devices. The process...
6177715 Integrated circuit having a level of metallization of variable thickness  
An integrated circuit comprising at least one level of metallization, the level of metallization being provided with tracks and comprising metal portions having at least two different thicknesses....
6177732 Multi-layer organic land grid array to minimize via inductance  
The present invention is a method and apparatus to minimize via inductance in a multi-layer organic land grid array (OLGA) packaging. A plurality of layers are staggered vertically. The plurality...
6175124 Method and apparatus for a wafer level system  
An improved wafer scale integrated circuit is described which includes non-contact power and data transmission coupling. Wireless power and data coupling reduces the mechanical stresses and strains...
6169008 High Q inductor and its forming method  
A high Q inductor and its forming method is disclosed. In this forming method, a semiconductor substrate is first provided with a trench formed thereon. The trench is defined by dry etching and...
6166422 Inductor with cobalt/nickel core for integrated circuit structure with high inductance and high Q-factor  
An integrated circuit structure is provided with an inductor formed therein which comprises a metal coil on an insulated surface over a semiconductor substrate, and a high magnetic susceptibility...
6157043 Solenoid comprising a compound nanotube and magnetic generating apparatus using the compound nanotube  
A compound nanotube (17) is made of carbon nitride (CN). Another compound nanotube (19) is made of boron carbide (BC 3 ) with alkali metal doped. Each of the nanotubes has a distorted configuration...
6140197 Method of making spiral-type RF inductors having a high quality factor (Q)  
A new method of fabricating an inductor utilizing air as an underlying barrier in the manufacture of integrated circuits is described. A metal line is provided overlying a dielectric layer on a...
6124624 Q inductor with multiple metallization levels  
In an integrated circuit, such as an RF oscillator device, having multiple mutually separated levels of electrically conducting material, each level comprises a plurality of adjacently arranged...
6114938 Variable inductor device  
A variable inductor device has at least two coils. The at least two coils are disposed on an insulating substrate with an inductance adjusting element located therebetween. The inductance adjusting...
6111303 Non-contact electronic card and its manufacturing process  
The card comprises an insulating support (1) supporting a winding (4) which is used as an antenna, and an integrated circuit (9) electrically connected to the ends (7, 8) of the winding. According...
6093957 Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof  
A lead frame structure and semiconductor package using the same and fabrication method thereof is provided that decreases noise by providing prescribed impedances for leads of a lead frame. The...
6091607 Resonant tag with a conductive composition closing an electrical circuit  
Briefly stated a tag includes a dielectric substrate having first and second opposite principal surfaces. An electrical circuit having an electrically conductive pattern is formed on at least one...
6081030 Semiconductor device having separated exchange means  
A semiconductor device having separated exchange mechanism comprises a chip forming an integrated circuit; a connection substrate; device connection points or balls; and at least one exchange...
6072205 Passive element circuit  
A passive element circuit is formed by a spiral inductor, a high-dielectric-constant thin-film capacitor, a via hole, and a bonding pad. By using SrTiO 3 as the high-dielectric-constant thin-film,...
6069397 Integrable using amorphous magnetic material circuit inductor  
An integrable circuit inductor (220) is formed from a patterned conductive material (110) that has a major portion completely encapsulated by a material (221, 223) that is substantially...
6060759 Method and apparatus for creating improved inductors for use with electronic oscillators  
The present invention relates, in general, to a method and apparatus for creating improved inductors which can be adapted for use with electronic oscillators. The method includes at least the...
6057202 Method for manufacturing an inductor with resonant frequency and Q value increased in semiconductor process  
A method for manufacturing an inductor with resonant frequency and Q value increased in semiconductor process can reduce substrate coupling effect, because (an) air layer(s) is/are formed just...
6037649 Three-dimension inductor structure in integrated circuit technology  
A three-dimension inductor structure formed in a conventional integrated circuit technology has a direction of magnetic field perpendicular to the normal direction of the substrate of an applied...
6030877 Electroless gold plating method for forming inductor structures  
The present invention provides a method of manufacturing an inductor element 46 using an electroless Au plating solution. The invention has three embodiments for forming the inductor. In the first...
6013935 Solid-state switch driven by thermovoltaic generator  
This invention relates to a high-transimpedance solid-state switch manufactured by micromachining technology. A thermopile is formed by a thin-film structure capable of producing sufficient...
6008102 Method of forming a three-dimensional integrated inductor  
A three-dimensional inductor coil is fabricated on top of a semiconductor substrate. The fabrication process includes the steps of depositing a first photoresist layer (406), forming a trench...
6005281 Apparatus for the non-contact manipulation of a semiconductor die  
An apparatus and method are presented for non-contact manipulation of a semiconductor die during semiconductor device manufacturing. Multiple die manipulation circuits are formed within specific...
6002161 Semiconductor device having inductor element made of first conductive layer of spiral configuration electrically connected to second conductive layer of insular configuration  
The semiconductor device includes an inductor element which includes a first conductive film pattern of a spiral configuration formed on a major face of a semiconductor substrate, and second...
5994759 Semiconductor-on-insulator structure with reduced parasitic capacitance  
In a SOI structure according to the invention, a substrate region directly adjacent and underlying the buried oxide layer is doped with a dopant having a conductivity type opposite that of the...
5969405 Integrated circuit structure having an active microwave component and at least one passive component  
Integrated circuit structure having an active microwave component and at least one passive component. A high-resistance silicon substrate (11) comprises an active microwave component (16) and at...
5952704 Inductor devices using substrate biasing technique  
Inductors used for impedance matching in the radio frequency integrated circuits is disclosed. In the integrated inductor device according to the present invention, an additional electrode is...
5952893 Integrated circuit inductors for use with electronic oscillators  
An integrated circuit having at least the following: a substrate; a composite inductor formed within the substrate having at least a first coil with an associated first coil inductance and first...
5945725 Spherical shaped integrated circuit utilizing an inductor  
An apparatus and method for forming an inductor on a spherical shaped integrated circuit for use in a rectifier circuit and/or an antenna. The integrated circuit is formed around a spherical...
5946198 Contactless electronic module with self-supporting metal coil  
An electronic module to be installed in a data carrier is described, the electronic module having an integrated circuit disposed on a carrier of the module and connected electrically with a coil...
5939753 Monolithic RF mixed signal IC with power amplification  
A monolithic integrated circuit die (10) is fabricated to include unilateral FETs (113, 114, 115), RF passive devices such as a double polysilicon capacitor (57), a polysilicon resistor (58), and...
5936298 Method for realizing magnetic circuits in an integrated circuit  
Inductive structures make highly efficient use of the magnetic flux generd, and are consistent with integrated circuit manufacturing techniques. The structures include electrically conductive...
5936299 Substrate contact for integrated spiral inductors  
An inductor structure includes an inductor spiral coil formed on a substrate; and a substrate contact connected to the substrate and disposed within a predetermined distance to the inductor spiral...
5930637 Method of fabricating a microwave inductor  
Isolation regions are formed on a top surface of a wafer. An ion implantation is performed to implant ions into the wafer. Then, an thermal anneal process is used to form an implanted layer on the...
5918121 Method of reducing substrate losses in inductor  
A method for making planar silicon-based inductor structure with improved Q is disclosed. This method includes the steps of: (a) providing a lightly-doped P-type substrate as a starting wafer; (b)...
5915188 Integrated inductor and capacitor on a substrate and method for fabricating same  
An integrated inductor-capacitor (L-C) structure can be formed on a semiconducting substrate (10) by depositing a metal layer in a pattern that contains an inductor coil (14) and a capacitor bottom...
5912495 High voltage driver circuit with diode  
The invention relates to a structure for and the method of manufacturing a driver circuit for an inductive load monolithically integrated on a semiconductor substrate doped with a first type of...
5886394 Device comprising an integrated coil  
The invention relates to a device comprising an integrated coil L on a substrate, which coil L includes a first conductor track (1) in the form of a spiral having windings (2, 3), with an outer end...
5886393 Bonding wire inductor for use in an integrated circuit package and method  
An integrated circuit package assembly is disclosed herein and includes at least one integrated circuit chip having a plurality of chip input/output terminals, an arrangement for providing...
5883382 Photo-detecting device having optical axis orienting variable direction  
A movable plate 5 and torsion bars 6 are monolithically formed in a semiconductor substrate 2. A flat coil 7 is formed on peripheries of the movable plate 5 while a photodiode 8 is formed on a...
5880517 Microwave power transistor having matched impedance with integrated DC blocking capacitor and manufacturing method therefor  
A microwave power transistor device (20) is formed with impedance matching circuitry from a single elongated transistor die (70). Each of one or more transistor elements (56) is integrally formed...
5872489 Integrated tunable inductance network and method  
An integrated, tunable inductance network features a number of fixed inductors fabricated on a common substrate along with a switching network made up of a number of micro-electromechanical (MEM)...
5861647 VLSI capacitors and high Q VLSI inductors using metal-filled via plugs  
Disclosed are methods of making inductors and capacitors, comprising filling a via in a dielectric disposed between two metal layers with a metal plug. The plug comprises tungsten, aluminum or...
5847451 Multi-layered printed circuit board, and grid array package adopting the same  
In a multi-layered printed circuit board on which an LSI having a plurality of power supply pins and a plurality of signal pins is mounted, and a grid array package which adopts the printed circuit...
5844299 Integrated inductor  
An integrated inductor with filled etch includes a substrate of semiconductor material which includes a surface and a cavity disposed therein, a mass of dielectric material disposed within the...
5834825 Semiconductor device having spiral wiring directly covered with an insulating layer containing ferromagnetic particles  
A spiral conductive layer formed over a semiconductor substrate is covered with a ferromagnetic particle containing photo-sensitive polyimide layer, and the ferromagnetic particle containing...
5831331 Self-shielding inductor for multi-layer semiconductor integrated circuits  
An inductive structure for an integrated circuit. The inductor has a first turn that shields the other turns of the inductor from a proximate ground plane. Multiple turns are disposed one above...
5828122 Semiconductor body with a substrate glued to a support body  
A semiconductor device comprises a substrate (1) with a plane surface (4) on which a layer structure (2) is formed in a number of layers (5, 7, 9, 13, 15, 17). The side of the substrate on which...
5793096 MOS transistor embedded inductor device using multi-layer metallization technology  
An inductor device with a MOS transistor internally installed is disclosed, in which an inductor can be arbitrarily connected in series or in parallel to the respective terminals of MOS transistors...
Matches 301 - 350 out of 435 < 1 2 3 4 5 6 7 8 9 >