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7075329 |
Signal isolators using micro-transformers
A logic signal isolator comprising a transformer having a primary winding and a secondary winding; a transmitter circuit which drives said primary winding in response to a received logic signal,...
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7075167 |
Spiral inductor formed in a semiconductor substrate
An inductor formed on a semiconductor substrate, comprising active device regions. The inductor comprises conductive lines formed on a dielectric layer overlying the semiconductor substrate. The...
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7071535 |
Integrated circuit package having inductance loop formed from a bridge interconnect
An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed...
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7067867 |
Large-area nonenabled macroelectronic substrates and uses therefor
A method and apparatus for an electronic substrate having a plurality of semiconductor devices is described. A thin film of nanowires is formed on a substrate. The thin film of nanowires is formed...
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7064411 |
Spiral inductor and transformer
A spiral inductor in which, where a spiral interconnect and an underpass interconnect intersect with each other, at least one layer of an electrically conductive film that forms the spiral...
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7061072 |
Integrated circuit inductors using driven shields
An integrated circuit is disclosed that includes a semiconductor substrate having a major body portion with a conductive layer having a predefined boundary and located on a first surface of the...
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7057241 |
Reverse-biased P/N wells isolating a CMOS inductor from the substrate
A double well structure beneath an inductor to isolate it from the substrate. Contacts are provided for the deeper well and the substrate, to reverse bias the junction between the substrate and the...
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7053461 |
Semiconductor device
A semiconductor device includes: a semiconductor substrate in which a semiconductor element is formed; a multilayer structured wiring layer that is provided on the semiconductor substrate, the...
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7053460 |
Multi-level RF passive device
A passive electrical device includes a first electrical conductor, a second electrical conductor disposed over the first conductor; and a third electrical conductor connecting the first conductor...
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7053747 |
Method for producing a spiral inductance on a substrate, and a device fabricated according to such a method
A device and a method for producing such a device is provided, whereby the windings of a spiral inductance are embedded in a membrane such that they are freely suspended over a completely...
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7053165 |
Semiconductor integrated circuit including an inductor and method of manufacturing the same
A semiconductor integrated circuit device, and method of manufacturing the same, includes an inductor with improved inductance and an improved quality factor (Q-factor) that can be miniaturized. In...
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7038294 |
Planar spiral inductor structure with patterned microelectronic structure integral thereto
Within a method for fabricating a microelectronic fabrication there is first provided a substrate. There is then formed over the substrate a spirally patterned conductor layer which terminates in a...
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7030443 |
MIM capacitor
A MIM (metal-insulator-metal) capacitor is provided with a substrate; a first metal area; a second metal area formed between the substrate and the first metal area; and a first insulating layer...
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7023315 |
High performance RF inductors and transformers using bonding technique
A method of fabricating an inductor using bonding techniques in the manufacture of integrated circuits is described. Bonding pads are provided over a semiconductor substrate. Input/output...
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7022566 |
Integrated radio frequency circuits
An RF circuit may be formed over a triple well that creates two reverse biased junctions. By adjusting the bias across the junctions, the capacitance across the junctions can be reduced, reducing...
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7012339 |
Semiconductor chip with passive element in a wiring region of the chip
When an integrated circuit is formed in a semiconductor wafer, the integrated circuit is formed only in the central part of each chip region. In a case where packaging other than a chip size...
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7005721 |
RF passive circuit and RF amplifier with via-holes
An input matching parallel inductor 114 which utilizes a spiral inductor, and an input matching parallel capacitor 115 which utilizes an MIM capacitor, both being constituting elements of an...
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7002233 |
Integrated circuit including an inductive element having a large quality factor and being highly compact
An integrated circuit including a substrate, a conductive layer, at least one inductive element superposed on the conductive layer and formed by a metallic turn having an outer contour and an inner...
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6998321 |
Method for forming inductor in semiconductor device
The present invention relates to a method for forming an inductor being a passive device in RE MEMS, RFCMOS, Bipolor/SiGe, BiCMOS semiconductor devices. According to the present method, a lower...
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6995450 |
Semiconductor device with a frequency selective guard ring
A ring-shaped P + type diffusion region is formed on the top surface of a P type substrate in such a way as to surround a single internal circuit region. A shunt wiring is formed in an area...
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6995448 |
Semiconductor package including passive elements and method of manufacture
A semiconductor package including passive elements and a method of manufacturing provide reduced package size, improved performance and higher process yield by mounting the passive elements beneath...
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6992367 |
Process for forming a buried cavity in a semiconductor material wafer and a buried cavity
The process comprises the steps of forming, on top of a semiconductor material wafer, a holed mask having a lattice structure and comprising a plurality of openings each having a substantially...
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6992366 |
Stacked variable inductor
Disclosed is a stacked variable inductors manufactured by stacking M (M≧2) metal layers on a semiconductor substrate, and provides stacked variable inductors comprising, 1 to N inductors...
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6990725 |
Fabrication approaches for the formation of planar inductors and transformers
This invention relates to the fabrication of planar inductive components whereby the design in cross-section describes a conductor surrounded by magnetic material along the length of the conductor;...
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6989578 |
Inductor Q value improvement
An inductor in an integrated circuit comprises a conductive trace disposed over an insulating layer which overlies a semiconductor substrate of a first conductivity type and at least two deep wells...
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6987307 |
Stand-alone organic-based passive devices
The present invention provides for low cost discrete inductor devices in an all organic platform. The inductor devices can utilize virtually any organic material that provides the desired...
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6980075 |
Inductor having high quality factor and unit inductor arranging method thereof
A method for arranging unit inductors of an inductor having metal wiring that can make a full use of self-inductance and mutual-inductance which are determined based on the proportion of the area...
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6972658 |
Differential inductor design for high self-resonance frequency
A differential inductor is formed from branch coils that are staggered with respect to one another rather than concentrically coiled within one another. Each coil is formed from conductive strips....
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6969902 |
Integrated circuit having antenna proximity lines coupled to the semiconductor substrate contacts
An embodiment of the invention is an integrated circuit 2 having antenna proximity lines 3 coupled to the semiconductor substrate 5 . Another embodiment of the invention is a method of...
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6958526 |
Electronic structures with reduced capacitance
An apparatus and method is described incorporating one or more layers of SiCOH and one or more layers of patterned conductors in an integrated circuit chip. The invention overcomes the problem of...
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6958522 |
Method to fabricate passive components using conductive polymer
A method and structure for an integrated circuit chip has a logic core which includes a plurality of insulating and conducting levels, an exterior conductor level and passive devices having a...
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6951794 |
Semiconductor device with spiral inductor and method for fabricating semiconductor integrated circuit device
A spiral inductor comprising: a substrate; a protruding portion which is formed on the top face of the substrate and the top of which serves as a dummy element for controlling a chemical mechanical...
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6949810 |
Active phase cancellation for power delivery
An apparatus and a method for active phase cancellation for an inductor/capacitor network have been disclosed. One embodiment of the apparatus includes a package and a die mounted on the package....
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6940383 |
Method for increasing the operating frequency of a magnetic circuit and corresponding magnetic circuit
A process for increasing the frequency of operation of a magnetic circuit. In the process, gaps are formed in at least one section of the magnetic circuit. The gaps lower the permeability of the...
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6940147 |
Integrated inductor having magnetic layer
A dielectric layer is formed over a substrate comprising a semiconductor material. A magnetic layer is formed over the dielectric layer. The magnetic layer comprises an amorphous alloy comprising...
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6936921 |
High-frequency package
A high-frequency package comprises a dielectric substrate, on an upper face of which a mounting portion of a high-frequency circuit component is formed, a first line conductor formed on the upper...
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6933596 |
Ultra wideband BGA
An electronic device packaging assembly ( 10 ) that includes a ball grid array ( 60 ) and specialized construction to be able to operate from DC up to 50 GHz with minimal parasitic losses. The...
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6922128 |
Method for forming a spiral inductor
A method for forming a spiral inductor ( 11 ) or component of a transformer, compatible with very large scale integrated processing, that achieves a higher Q value without occupying more space by...
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6914331 |
Semiconductor device having an inductor formed on a region of an insulating film
A semiconductor device has a semiconductor chip, a first insulating film and an inductor. The semiconductor chip includes an integrated circuit formed on the main surface of the chip and a...
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6903438 |
Low-impedance decoupling device
A decoupling device for decoupling a high-frequency noise wave in a digital circuit is formed as a line device including a portion of a semiconductor substrate, an insulator film formed thereon as...
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6890829 |
Fabrication of on-package and on-chip structure using build-up layer process
The invention relates to a process of forming an on-chip package inductor. The process includes providing a substrate with at least one microelectronic device packaged therewith. As part of the...
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6888714 |
Tuneable ferroelectric decoupling capacitor
A voltage supply bypass capacitor for use with a semiconductor integrated circuit chip or module comprising a ferroelectric dielectric having electromechanical properties designed to provide...
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6885069 |
Semiconductor device in which occurrence of slips is suppressed
A substrate contains dissolved oxygen at a concentration of not more than 8×10 17 atoms/cm 3 and an impurity which is used as an acceptor or donor at a concentration of not more than 1×10 15 ...
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6885275 |
Multi-track integrated spiral inductor
An integrated circuit inductor includes a spiral pattern disposed upon a substrate. The track of the spiral is divided into multiple tracks to form a multi-track inductor. The individual tracks are...
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6879022 |
Inductance device formed on semiconductor substrate
According to a first aspect of the present invention, a plurality of PN junctions are formed at the surface of a semiconductor substrate under a belt-like conductive film having a spiral shape...
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6873065 |
Non-optical signal isolator
A non-optical isolator having a driver circuit for providing an input signal to one or more first passive components which are coupled across a galvanic isolation barrier to one or more...
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6872579 |
Thin-film coil and method of forming same
A method of forming a patterned thin film comprises the steps of forming a first plating layer and a second plating layer. Each of the steps of forming the plating layers includes: the step of...
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6870260 |
Semiconductor module
Wiring part 12 is provided on one side 11 a of semiconductor device 11 . Wiring part 12 has at least one of interface circuit 13 connecting terminals on semiconductor device 11 and...
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6870241 |
High frequency switch circuit device
A high frequency switch circuit device includes an FET to be a switching element on a semiconductor substrate. The FET includes an n-type well, a gate electrode, a source layer and a drain layer....
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6867475 |
Semiconductor device with an inductive element
There is provided a semiconductor device able to prevent performance degradation of an inductor element provided thereon. A high resistance region is provided below the inductor element formed on...
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