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7305223 Radio frequency circuit with integrated on-chip radio frequency signal coupler  
A radio frequency (“RF”) circuit configured in accordance with an embodiment of the invention is fabricated on a substrate using integrated passive device (“IPD”) process technology. The RF...
7299537 Method of making an integrated inductor  
An inductor comprises a substrate comprising a semiconductor material, a first dielectric layer over the substrate, a magnetic layer over the first dielectric layer, a second dielectric layer over...
7294904 Integrated circuit package with improved return loss  
A packaged integrated circuit includes an integrated circuit and a package substrate. A trace in the package substrate includes a first portion and a second, high-inductance, portion. The...
7294525 High performance integrated inductor  
Some embodiments of the present invention include providing high performance integrated inductors.
7285841 Method of manufacturing signal processing apparatus  
In a signal processing apparatus for transmitting or processing a signal, a substrate has a recessed portion in a surface of the substrate, a first interconnecting conductor is on the substrate,...
7285840 Apparatus for confining inductively coupled surface currents  
A deep n-well is formed beneath the area of an inductor coil. The use of a deep n-well lessens the parasitic capacitance by placing a diode in series with the interlayer dielectric cap. The deep...
7279391 Integrated inductors and compliant interconnects for semiconductor packaging  
Some embodiments of the present invention include integrated inductors and compliant interconnects for semiconductor packaging.
7280024 Integrated transformer structure and method of fabrication  
A microelectronic assembly including a die substrate, a plurality of electronic components formed in and on the die substrate and connected to one another to form an integrated circuit, a first and...
7271465 Integrated circuit with low-loss primary conductor strapped by lossy secondary conductor  
Techniques for “strapping” a primary conductor with a secondary conductor in an integrated circuit (IC). The IC includes a number of circuit elements interconnected by a secondary conductor...
7268611 Semiconductor device and memory card using same  
A semiconductor device capable of achieving downsizing without reducing the power supply efficiency and capable of reducing switching noises and a memory card using the same are disclosed. The...
7268410 Integrated switching voltage regulator using copper process technology  
Improvements in the level of integration of a core buck and/or boost DC-DC voltage regulator sub-circuit lead to a lower manufacturing cost structure, an improved performance from lessened...
7268409 Spiral inductor with electrically controllable resistivity of silicon substrate layer  
A microelectronic device including, in one embodiment, a plurality of active devices located at least partially in a substrate, at least one dielectric layer located over the plurality of active...
7264986 Microelectronic assembly and method for forming the same  
According to one aspect of the present invention, a method is provided for forming a microelectronic assembly. The method comprises forming first and second trenches on a semiconductor substrate,...
7265433 On-pad broadband matching network  
A chip is provided in which an on-chip matching network has a first terminal conductively connected to a bond pad of the chip and a second terminal conductively connected to a common node on the...
7262680 Compact inductor with stacked via magnetic cores for integrated circuits  
An on-chip inductor device for Integrated Circuits utilizes coils on a plurality of metal layers of the IC with electrical connectors between the coils and a magnetic core for the inductor of...
7262480 Semiconductor device, and method and apparatus for manufacturing semiconductor device  
A high frequency power amplifying device has two amplifying lines. Each amplifying line has a configuration in which a plurality of amplifying stages are connected in cascade having two source...
7262482 Open pattern inductor  
The invention includes a stacked open pattern inductor fabricated above a semiconductor substrate. The stacked open pattern inductor includes a plurality of parallel open conducting patterns...
7262481 Fill structures for use with a semiconductor integrated circuit inductor  
A semiconductor integrated circuit includes an inductor formed by a conductive loop that is fabricated on one or more metal layers. The inductor also includes a dielectric region provided adjacent...
7250669 Process to reduce substrate effects by forming channels under inductor devices and around analog blocks  
A first method of reducing semiconductor device substrate effects comprising the following steps. O + or O 2 + are selectively implanted into a silicon substrate to form a silicon-damaged silicon...
7247542 Fabrication method of spiral inductor on porous glass substrate  
The present invention discloses a fabrication method and structure of spiral RF inductor on porous glass substrate. Thick porous silicon layer is natively formed on a silicon wafer by anodic...
7233055 Chip circuit comprising an inductor  
A chip circuit comprising a chip which comprises a semiconductor substrate and substantially plane components formed on the said substrate, among which there are an emitting component capable of...
7230316 Semiconductor device having transferred integrated circuit  
It is an object to provide a semiconductor device integrating various elements without using a semiconductor substrate, and a method of manufacturing the same. According to the present invention, a...
7227240 Semiconductor device with wire bond inductor and method  
A semiconductor device ( 10 ) includes a semiconductor die ( 20 ) and an inductor ( 30, 50 ) formed with a bonding wire ( 80 ) attached to a top surface ( 21 ) of the semiconductor die. The bonding...
7227222 Semiconductor device and manufacturing method thereof  
The present invention is related to a semiconductor device that forms an inductor on the same semiconductor substrate together with other active elements and a manufacturing method thereof. The...
7217986 Method for modifying the impedance of semiconductor devices using a focused heating source  
A method is provided for tuning (i.e. modifying, changing) the impedance of semiconductor components or devices using a focused heating source. The method may be exploited for finely tuning the...
7215000 Selectively encased surface metal structures in a semiconductor device  
The present invention provides, in one embodiment, An integrated circuit device ( 100 ). The integrated circuit device ( 100 ) comprises a circuit feature ( 105 ) located over a semiconductor...
7209011 Method and apparatus for synthesizing high-frequency signals for wireless communications  
A semiconductor package includes a package substrate and an integrated circuit. The package substrate has a first surface. The integrated circuit couples electrically to the first surface of the...
7205632 Anti-scattering attenuator structure for high energy particle radiation into integrated circuits  
A microelectronics device including a semiconductor device located at least partially over a substrate, a bombarded area located at least partially over the substrate and adjacent the semiconductor...
7202152 Semiconductor device with inductive component and method of making  
An integrated circuit ( 10 ) includes a semiconductor substrate ( 11 ) that has a top surface ( 32 ) for forming a dielectric region ( 14 ) with a trench ( 40 ) and one or more adjacent cavities (...
7196397 Termination design with multiple spiral trench rings  
A semiconductor device having a termination structure, which includes at least one spiral resistor disposed within a spiral trench and connected between two power poles of the device.
7194799 Process for fabricating a high density multi-layer microcoil  
A high density multi-layer microcoil includes a substrate, a multi-layer coil winding, a magnetic core and a dry film photoresist structure. The multi-layer coil winding and the magnetic core are...
7187061 Use of a down-bond as a controlled inductor in integrated circuit applications  
A Radio Frequency (RF) device includes a semi conductive die and a package in which the semi conductive die mounts. The semi conductive die includes a first portion of an RF circuit and a plurality...
7183625 Embedded MIM capacitor and zigzag inductor scheme  
A new method to form RF devices in the manufacture of an integrated circuit device is achieved. The method comprises providing a substrate. A top metal level is defined overlying the substrate. The...
7176550 Method and device for forming a winding on a non-planar substrate  
The electronic device ( 10 ) comprises a capacitor ( 12 ) and an inductor ( 11 ) and is present on a substrate ( 1 ) with an unplanarized surface ( 2 ). This is realized in winding ( 21 ) of the...
7173318 On-chip inductors  
Method for fabrication of on-chip inductors and related structure are disclosed. According to one embodiment, inductors are formed by patterning conductors within a certain dielectric layer in a...
7161248 Multi-layer wiring structure with dummy patterns for improving surface flatness  
A first area, a ring shape second area surrounding the first area, and a third area surrounding the second area are defined on the surface of a support substrate. A first wiring layer is disposed...
7161227 Structure and method for fabricating semiconductor structures and devices for detecting an object  
High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the...
7154161 Composite ground shield for passive components in a semiconductor die  
According to one exemplary embodiment, a structure situated in a semiconductor die comprises an active shield situated in a substrate, where the active shield comprises a salicide layer situated on...
7145217 Chip-type noise filter, manufacturing method thereof, and semiconductor package  
In a chip-type noise filter having a signal line of a conductor and a magnetic body disposed so as to adhere to the signal line, the magnetic body is a sintered body containing mainly Fe 2 O 3 and...
7132297 Multi-layer inductor formed in a semiconductor substrate and having a core of ferromagnetic material  
A thin-film multilayer high-Q inductor having a ferromagnetic core and spanning at least three metal layers is formed by forming a plurality of parallel first metal runners on the semiconductor...
7132727 Layout technique for C3MOS inductive broadbanding  
An improved cell layout for a C3MOS circuit with inductive broadbanding positions the inductor at a distance from the active region to improve isolation and aligns the edges of the resistor,...
7129561 Tri-metal and dual-metal stacked inductors  
A high performance inductor which has a relatively low sheet resistance that can be integrated within a semiconductor interconnect structure and can be used in RF applications, including RF CMOS...
7118925 Fabrication of a ferromagnetic inductor core and capacitor electrode in a single photo mask step  
A method of manufacturing an integrated circuit on a semiconductor wafer. The method comprising forming a bottom plate of a capacitor 50 a and a bottom portion of an induction coil 50 a ,...
7119650 Integrated transformer  
A transformer comprises a first inductor and a second inductor. The first inductor has one or more trenches and comprises a first conductor defining a signal path along the one or more trenches of...
7112870 Semiconductor integrated circuit device including dummy patterns located to reduce dishing  
A large area dummy pattern DL is formed in a layer underneath a target T 2 region formed in a scribe region SR of a wafer. A small area dummy pattern in a lower layer and a small area dummy...
7109589 Integrated circuit with substantially perpendicular wire bonds  
An integrated circuit comprises an integrated circuit package and a plurality of circuit elements disposed within the integrated circuit package. A plurality of wire bonds provide connections for...
7091576 Inductor for semiconductor integrated circuit and method of fabricating the same  
Disclosed are an inductor for a semiconductor integrated circuit, which provides a wider cross-sectional area, significantly reduces the resistance to improve the Q value and has a highly uniform...
7084481 Symmetric inducting device for an integrated circuit having a ground shield  
The present invention relates to integrated circuits having symmetric inducting devices with a ground shield. In one embodiment, a symmetric inducting device for an integrated circuit comprises a...
7078304 Method for producing an electrical circuit  
An electrical circuit is formed by forming and patterning a conductive layer on a substrate, forming and patterning a conductive layer on another substrate, depositing a dielectric layer on at...
7078998 Via/line inductor on semiconductor material  
A spiral inductor is provided including a substrate and an inductor dielectric layer over the substrate having a spiral opening provided therein. The spiral inductor is in the spiral opening with...
Matches 51 - 100 out of 435 < 1 2 3 4 5 6 7 8 9 >