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5962910 |
Metal-to-metal via-type antifuse
A metal-to-metal antifuse disposed between two aluminum metallization layers in a CMOS integrated circuit or similar structure includes an antifuse material layer having a substantially...
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5955762 |
Microelectronic package with polymer ESD protection
A semiconductor package having positioned therein a protection layer which protects the integrated circuit chip from electrostatic discharge (ESD) damage. The protection layer is made of a material...
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5936288 |
Semiconductor integrated circuit device and low breakdown voltage zener diode
Anode and cathode regions at a principal surface of a semiconductor substrate have the same characteristics as source and drain regions of a P type MOS transistor. A cathode region is superposed...
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5936297 |
Programmable semiconductor element having an antifuse structure
A programmable semiconductor element having an antifuse structure is disclosed. A first insulation film is formed on a silicon substrate. First and second conductors are formed on the first...
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5937281 |
Method to form metal-to-metal antifuse for field programmable gate array applications using liquid phase deposition (LPD)
A method of fabricating an antifuse structure for field programmable gate array (FPGA) applications is described. First, a field oxide layer for isolation is grown on the semiconductor silicon...
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5929505 |
Inter-metal-wiring antifuse device provided by self-alignment
A first electrode layer is formed on a semiconductor substrate, and surfaces other than a top surface thereof are buried in an insulation film, and the top surface makes the same surface as that of...
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5920110 |
Antifuse device for use on a field programmable interconnect chip
This interconnect chip provides the function of an antifuse device. The interconnect chip is initially disconnected. Application of a high voltage applied across two terminals on the chip causes...
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5917229 |
Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect
Two types of programmable elements, fuses and antifuses, are disclosed for interconnecting the terminals of electronic components mounted on printed circuit boards (PCBs), multichip modules (MCMs)...
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5915171 |
Process of fabricating an antifuse structure
An antifuse structure for semiconductor programmable logic devices and the process of fabrication are described. The antifuse structure has its bottom electrically conductive layer featuring sharp...
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5913137 |
Process ESD protection devices for use with antifuses
A process electrostatic discharge ("ESD") protection device is incorporated on a chip with the antifuses that it is designed to protect and is formed as close in time as possible to the deposition...
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5909049 |
Antifuse programmed PROM cell
An antifuse based PROM cell design allows large currents to be sinked during cell programming to ensure low programmed resistance of the cell while using minimum-geometry select devices. This is...
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5903041 |
Integrated two-terminal fuse-antifuse and fuse and integrated two-terminal fuse-antifuse structures incorporating an air gap
A two-terminal fuse-antifuse structure comprises a horizontal B-fuse portion and a vertical A-fuse portion disposed between two metallization layers of an integrated circuit device. The...
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5903042 |
Self-aligned antifuse with base
A method of integrating a low aspect ratio antifuse into low capacitance interconnect levels which involves fabrication of an antifuse base which is self-aligned to either a lower interconnect...
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5886392 |
One-time programmable element having controlled programmed state resistance
A one-time non-conductive programmable element which is programmable to conduct current is provided. The programmable element comprises several anti-fuses connected in parallel with each other....
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5869869 |
Microelectronic device with thin film electrostatic discharge protection structure
Microelectronic devices are formed on a substrate of an integrated circuit. An electrically conductive ground or power plane, and an ElectroStatic Discharge (ESD) protection layer are formed on the...
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5866938 |
Semiconductor device equipped with antifuse elements and a method for manufacturing an FPGA
A semi conductor device is provided having the following arrangement. A first electrode is formed on the major surface of a semiconductor substrate and comprises a first Al connection layer formed...
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5866937 |
Double half via antifuse
An antifuse comprises a substantially planar conductive lower electrode covered by a first layer of silicon nitride. A layer of amorphous silicon is disposed over the silicon nitride layer. A first...
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5852323 |
Electrically programmable antifuse using metal penetration of a P-N junction
An antifuse is described that can be formed without masks or mask steps beyond those required for a conventional CMOS process. The antifuse includes adjacent p-type and n-type diffusion regions...
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5844298 |
Method and apparatus for programming anti-fuses
A programming circuit programs an anti-fuse having first and second terminals with the programming circuit and the anti-fuse being fabricated in the same integrated circuit. The programming circuit...
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5838530 |
Applications of protective ceramics
It is beneficial for an FPGA, PROM, DRAM and superconductive circuit to use a protective ceramic as its insulating material. This protective ceramic can densely cover metal surface and is free of...
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5834824 |
Use of conductive particles in a nonconductive body as an integrated circuit antifuse
A novel antifuse includes a composite of conductive particles dispersed throughout a nonconductive matrix, which composite is located inside an antifuse via. The antifuse via is defined by a...
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5831325 |
Antifuse structures with improved manufacturability
An antifuse structure of the present invention comprises an antifuse layer and a bottom electrode which are immune to the damages caused by harmful processing environment. The three major...
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5825072 |
Circuits for ESD Protection of metal to-metal antifuses during processing
A static-charge protection device for an antifuse includes an additional second-sized aperture smaller in area than the antifuse apertures disposed in the same inter-electrode dielectric layer....
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5821558 |
Antifuse structures
An antifuse structure includes a first electrode, a layer of enhanced amorphous silicon over the first electrode, and a second electrode over the layer of enhanced amorphous silicon. The layer of...
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5813881 |
Programmable cable and cable adapter using fuses and antifuses
Two types of programmable elements, fuses and antifuses, are disclosed for forming an electrically programmable cable in one embodiment and a cable adapter in another embodiment. The cable and the...
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5811870 |
Antifuse structure
According to the preferred embodiment, an antifuse structure and method for personalizing a semiconductor device is provided that overcomes the limitations of the prior art. The preferred...
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5807786 |
Method of making a barrier layer to protect programmable antifuse structure from damage during fabrication sequence
A method for forming an antifuse interconnect structure, for a one-time fusible link, to be used with field-programmable gate arrays, has been developed. The process features the use of an...
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5808351 |
Programmable/reprogramable structure using fuses and antifuses
Two types of programmable elements, fuses and antifuses, are disclosed for forming an electrically programmable burn-in board in one embodiment and an electrically programmable device-under-test...
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5801399 |
Semiconductor device with antireflection film
A stress relaxation layer is inserted between an electrode layer and an antireflection layer to relax a stress imparted from one of the electrode and antireflection layers to the other. A...
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5793094 |
Methods for fabricating anti-fuse structures
A method for substantially reducing variations in a programming voltage of an anti-fuse structure formed on an integrated circuit wafer. The anti-fuse structure has a metal-one layer, an anti-fuse...
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5789794 |
Fuse structure for an integrated circuit element
A programmable fuse element disposed between integrated circuit elements that may be selectively joined during the manufacture or programming of an integrated circuit. The fuse element is a...
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5789796 |
Programmable anti-fuse device and method for manufacturing the same
The present invention relates to a technology of an electrically programmable anti-fuse device. The anti-fuse device comprises a semiconductor substrate provided with a plurality of functional...
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5789764 |
Antifuse with improved antifuse material
According to the present invention, an antifuse comprises first and second conductors separated by an antifuse material having a thickness selected to impart a desired target programming voltage to...
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5789795 |
Methods and apparatus for fabricationg anti-fuse devices
An integrated circuit having a semiconductor substrate and an anti-fuse structure formed on the semiconductor substrate. The anti-fuse structure includes a metal-one layer and an anti-fuse layer...
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5780919 |
Electrically programmable interconnect structure having a PECVD amorphous silicon element
In one method for forming amorphous silicon antifuses with significantly reduced leakage current, a film of amorphous silicon is formed in a antifuse via between two electrodes. The amorphous...
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RE35828 |
Anti-fuse circuit and method wherein the read operation and programming operation are reversed
The invention features a circuit wherein a serially connected transistor and anti-fuse element are biased for current to flow in a first direction or the current flows in the first direction during...
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5770885 |
Electrically programmable antifuse incorporating dielectric and amorphous silicon interlayers
An antifuse may be fabricated as a part of an integrated circuit in a layer located above and insulated from the semiconductor substrate. The antifuse includes a lower first metal electrode, a...
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5768179 |
Antifuse load sram cell
An antifuse functions as a resistive element in an SRAM cell. The antifuse layer, typically amorphous silicon, is formed to a thickness commensurate with the resistance required for proper...
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5763898 |
Above via metal-to-metal antifuses incorporating a tungsten via plug
According to a first aspect of the present invention an antifuse structure capable of high density fabrication comprises an antifuse material layer under a plug of an electrically conductive...
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5764563 |
Thin film load structure
A resistive load structure and method for making a resistive load structure for an integrated circuit includes the use of an amorphous silicon "antifuse" material. The resistive load structure can...
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5756367 |
Method of making a spacer based antifuse structure for low capacitance and high reliability
The present antifuse includes a base having a first electrode thereon which defines a top surface and a side surface. Antifuse material is disposed on the first electrode on at least a portion of...
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5751012 |
Polysilicon pillar diode for use in a non-volatile memory cell
There is described a memory cell having a vertically oriented polysilicon pillar diode for use in delivering large current flow through a variable resistance material memory element. The pillar...
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5741720 |
Method of programming an improved metal-to-metal via-type antifuse
A metal-to-metal antifuse disposed between two aluminum metallization layers in a CMOS integrated circuit or similar structure includes an antifuse material layer having an aluminum-free conductive...
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5726484 |
Multilayer amorphous silicon antifuse
Antifuses are provided which include first and second conductive layers and an antifuse layer positioned between the first and second conductive layers. The antifuse layer includes at least one...
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5717230 |
Field programmable gate array having reproducible metal-to-metal amorphous silicon antifuses
A field programmable gate array has a programmable interconnect structure comprising metal signal conductors and metal-to-metal PECVD amorphous silicon antifuses. The metal-to-metal PECVD amorphous...
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5714795 |
Semiconductor device utilizing silicide reaction
A semiconductor storage device capable of high-speed writing and reading and having extremely high reliability. The semiconductor device includes a plurality of cells each having a semiconductor...
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5705849 |
Antifuse structure and method for manufacturing it
An improved antifuse design has been achieved by providing a structure comprising pair of alternating layers of silicon nitride and amorphous silicon sandwiched between two dual damascene...
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5694047 |
Method and system for measuring antifuse resistance
A method and system for measuring programmed antifuse resistance in an FPGA without disturbing the antifuse resistance. The method includes estimating a plurality of subparts of the programming...
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5693556 |
Method of making an antifuse metal post structure
A method of forming an antifuse device. According to the preferred method of the present invention, a first metal layer comprising a first bulk conductive layer and the top capping layer is formed....
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5682049 |
Method and apparatus for trimming an electrical value of a component of an integrated circuit
An integrated circuit and method for using same is constructed on a semiconductor substrate (15) with a structure (24) in the substrate (15) having an electrical value desired to be trimable and...
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