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6307213 |
Method for making a fuse structure for improved repaired yields on semiconductor memory devices
This invention relates to a novel fuse structure and method for deleting redundant circuit elements on integrated circuits. This fuse structure is useful for increasing the repair yield on RAM...
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6303970 |
Semiconductor device with a plurality of fuses
In the present invention, a semiconductor device includes a first insulation layer formed on a semiconductor substrate, an elevating pad formed on the first insulation layer, a second insulation...
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6294453 |
Micro fusible link for semiconductor devices and method of manufacture
An electrically activated fuse with a high melting point heater element in series with a low melting point fusible link. The heater element has a higher resistivity and larger cross-sectional area...
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6291871 |
Method of jointly forming stacked capacitors and antifuses, method of blowing antifuses, and antifuses and stacked capacitors constituting a part of integrated circuitry
A method of jointly forming stacked capacitors and antifuses includes, a) providing a common layer of electrically conductive material to form both a capacitor storage node and an inner antifuse...
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6285068 |
Antifuses and method of fabricating the same
The present invention provides antifuses that enhance the efficiency of a field programmable gate array and that decrease chip size. The antifuses comprise a plurality of first conductive layers...
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6281563 |
Laser programming of CMOS semiconductor devices using make-link structure
A CMOS semiconductor device is programmed by a laser beam which causes a PN junction in a silicon substrate to be permanently altered. This produces a leakage path between a program node and a tank...
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6278171 |
Sublithographic fuses using a phase shift mask
A method for forming an interconnect wiring structure, such as a fuse structure, comprises forming an opening in an insulating layer using a phase shift mask (the opening having vertical sidewalls...
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6274922 |
Fabrication of high power semiconductor device with a heat sink and integration with planar microstrip circuitry
A low cost highly integrated method of fabricating a heat sink on the backside of a power semiconductor device maintains device performance, improves thermal transfer, and enables reliable planar...
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6262434 |
Integrated circuit structures and methods to facilitate accurate measurement of the IC devices
The present invention relates, in one embodiment, to an integrated circuit including a first circuit structure, a first conductive bonding pad coupled to the first circuit structure, a second...
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6255700 |
CMOS semiconductor device
A semiconductor device comprises a depletion-type NMOS transistor having a source region, a drain region connected to a power supply line, and a gate electrode connected to a ground line. An...
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6255715 |
Fuse window guard ring structure for nitride capped self aligned contact processes
The present invention provides a structure and method for forming a moisture barrier guard ring structure 38 44 48 52 54 for around a fuse window 30 in a semiconductor device. The invention begins...
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6252293 |
Laser antifuse using gate capacitor
An integrated circuit laser antifuse is described which has two physical states. In the first physical state the laser antifuse has to conductive plates electrically separated by a layer of...
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6252291 |
Modifiable semiconductor circuit element
An integrated circuit chip having a substrate with several overlaying metal layers. A lower metal layer is adjacent the substrate and an upper layer is spaced above the lower layer. The chip has...
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6249472 |
Semiconductor memory device with antifuse
The objective of the invention is to provide a type of semiconductor memory device whose antifuse can be formed without any additional film manufacturing process. A first electrode is formed by a...
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6240033 |
Antifuse circuitry for post-package DRAM repair
The anti-fuse circuit includes three sub-blocks: a multiplexer having inputs of control signals and addresses and yielding the activation of a programming signal and program addresses; a...
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6222212 |
Semiconductor device having programmable interconnect layers
An integrated circuit structure is described which includes a base semiconductor structure and a programmable semiconductor structure which are fabricated separately and later joined to form the...
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6218722 |
Antifuse based on silicided polysilicon bipolar transistor
An improved antifuse which employs the base-emitter junction of a silicided single polysilicon bipolar transistor. The distance between the base metal and emitter metal is shortened and results...
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6188092 |
Solid imaging device having an antifuse element and method of making the same
A solid imaging device including a substrate voltage generating device possessing high display quality, high reliability, and method of manufacturing. The solid imaging device includes a plurality...
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6180994 |
Array of sidewall-contacted antifuses having diffused bit lines
An array of sidewall-contacted antifuses is formed by a method that reduces the sensitivity of the array to masking alignment errors. The array includes a plurality of spaced-apart bit lines which...
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6165851 |
Semiconductor nonvolatile storage and method of fabricating the same
A semiconductor nonvolatile storage that is an inter-gate insulating film breakdown type memory is configured by providing a field oxide film on a semiconductor substrate 1, a gate electrode on the...
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6163062 |
Semiconductor device having a metallic fuse member and cutting method thereof with laser light
A semiconductor device has a plurality of fuse members (1a, 1b) composed of a metal that can be cut by laser light (4), disposed over a semiconductor substrate (5). The length L of the fuse members...
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6160276 |
Double-sided programmable interconnect structure
An interconnect structure is centered around a substrate having opposite first and second surfaces. Component contacts allocated to cells in the substrate, are provided over both substrate...
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6150705 |
Dielectric-polysilicon-dielectric-polysilicon-dielectric antifuse for field programmable logic application
A novel antifuse structure includes a novel antifuse material layer comprises a first dielectric layer, a first polysilicon layer (which may optionally be lightly doped) disposed over the first...
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6144074 |
Semiconductor memory device having stack-type memory cells and a method for manufacturing the same
At least one dummy storage node is formed for a plurality of storage nodes provided in stack type memory cells in which a plate electrode is grounded through the at least one dummy storage node,...
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6140692 |
Isolated anti-fuse structure and method for fabricating same
An improved anti-fuse structure is formed on a silicon substrate of a first conductivity type. The anti-fuse has a first conductive layer formed on a surface of the substrate, a dielectric layer...
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6133570 |
Semiconductor photovoltaic diffractive resonant optical cavity infrared detector
An infrared detector cell includes a plurality of uniformly spaced linear segments, which make up an optical grating. Each segment is selectively doped across its width to form a photovoltaic...
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6130469 |
Electrically alterable antifuse using FET
An integrated circuit and fabrication method for an antifuse structure that includes a shallow trench oxide isolation region disposed in a silicon substrate, the oxide in the trench having a top...
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RE36893 |
Anti-fuse structure for reducing contamination of the anti-fuse material
An anti-fuse structure formed in accordance with the present invention includes a conductive layer base. A layer of anti-fuse material overlies the conductive base layer. On top of the anti-fuse...
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6127721 |
Soft passivation layer in semiconductor fabrication
The use of an etch stop layer to define a terminal via opening to access a device feature after formation of a photosensitive soft-passivation layer. The etch stop layer allows the size of the...
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6124194 |
Method of fabrication of anti-fuse integrated with dual damascene process
A method of fabricating an anti-fuse module and dual damascene interconnect structure comprises the following steps. A semiconductor structure having at least two exposed metal lines covered by a...
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6104079 |
Closely pitched polysilicon fuses and method of forming the same
A method for decreasing the pitch of polysilicon fuses uses tungsten barriers formed adjacent to the fuse elements. The tungsten barriers are made compatible with the process to form a crack stop...
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6097077 |
Programmable interconnect structures and programmable integrated circuits
Antifuses and gate arrays with antifuses are disclosed that have high thermal stability, reduced size, reduced leakage current, reduced capacitance in the unprogrammed state, improved manufacturing...
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6087677 |
High density self-aligned antifuse
The present invention is an antifuse structure comprising an insulation layer between a top conductor and a bottom conductor. The insulation layer has a via. A resistive layer is adjacent the via...
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6087707 |
Structure for an antifuse cell
A structure for an antifuse cell which comprises: (a) field oxide between the bottom plate of the antifuse element and its access transistor; and (b) an implanted region underlying the antifuse...
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6081021 |
Conductor-insulator-conductor structure
An integrated circuit device including a conductor-insulator-conductor structure and a method of manufacturing the structure simultaneously while forming a dual damascene via. A first interconnect...
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6057589 |
Method for over-etching to improve voltage distribution
An over-etched (OE) antifuse includes a lower electrode, an antifuse layer contacting the lower electrode by an over-etched via, and a second conductive layer formed on the antifuse layer. This...
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6054749 |
Thin film device repaired using enhanced repair process
A process for partially repairing defective Multi-Chip Module (MCM) Thin-Film (TF) wiring nets. The process comprises the steps of locating a short circuit between any two nets of the MCM,...
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6051851 |
Semiconductor devices utilizing silicide reaction
Cheap semiconductor memory devices are provided so as to enable high-speed writing and reading but rarely to malfunction, thus being high in reliability. In a semiconductor device which comprises a...
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6046488 |
Semiconductor device having conductive layer and manufacturing method thereof
A semiconductor device allowing the manufacturing process to be simplified and fine structures therein to be readily formed and a manufacturing method thereof are provided. In the semiconductor...
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6031275 |
Antifuse with a silicide layer overlying a diffusion region
The large voltage required to program a conventional antifuse is substantially reduced by forming the antifuse with a diffusion region and an overlying layer of silicide. The silicide layer is...
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6025637 |
Spacer-based antifuse structure for low capacitance and high reliability and method of fabrication thereof
The present antifuse includes a base having a first electrode thereon which defines a top surface and a side surface. Antifuse material is disposed on the first electrode on at least a portion of...
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6016001 |
Metal to amorphous silicon to metal anti-fuse structure
An anti-fuse structure and method for forming such structure. In one embodiment, the anti-fuse structure of the present invention includes a dielectric layer which is deposited over a metal layer....
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6008716 |
Fuse structure connecting first level and second level interconnections in inter-layer insulator
The present invention provides a fuse structure formed in an inter-layer insulator having a first level interconnection and a second level interconnection isolated by the inter-layer insulator from...
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6002261 |
Trimming circuit
To monitor the state of an antifuse capacitor, a transistor is connected to the capacitor such that it saturates only when the capacitor is not blown. Monitoring the base current of the transistor...
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5994757 |
Electronic circuit device capable for use as a memory device
An electronic circuit device includes first and second conductors and a high-resistance member arranged therebetween. The high-resistance member consists of a material which changes from a high...
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5986322 |
Reduced leakage antifuse structure
An antifuse comprises an antifuse material disposed between a lower conductive electrode and an upper conductive electrode. The antifuse material comprises a layer of amorphous silicon disposed...
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5973380 |
Semiconductor junction antifuse circuit
An integrated semiconductor junction antifuse is formed from either adjacent regions of opposite doping types or spaced apart regions of similar doping type within a substrate. In its unblown...
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5969386 |
Aluminum gates including ion implanted composite layers
An aluminum gate for a thin film transistor is fabricating by implanting ions into the exposed surface of the aluminum gate. The ions are preferably selected from the group consisting of nitrogen,...
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5969403 |
Physical fuse for semiconductor integrated circuit
A fuse for an integrated circuit is constituted by a shallow NP junction, covered with a metal contact, the semiconductor region being not excessively doped. For the blowing of the fuse, the...
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5965270 |
Metal/amorphous material/metal antifuse structure with a barrier enhancement layer
An amorphous-silicone-based antifuse structure has been invented for VLSI (Very Large Scale Integration circuits) FPGA's (Fields Programmable Gate Array) applications. The structure comprises from...
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