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5949323 |
Non-uniform width configurable fuse structure
A radiant-energy configurable fuse structure and array are provided in which the fuse body of the fuse is wider than the fuse connection terminals. The fuse body can be circular or polygonal to...
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5945814 |
Method and apparatus for a low voltage high current bi-directional termination voltage regulator
A low voltage high current bi-directional termination voltage regulator for use in a bus termination circuit in a repeater stack is disclosed that includes an operational amplifier, a bipolar...
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5936296 |
Integrated circuits having metallic fuse links
An integrated circuit includes a metallic fuse link blown by a laser beam which may enhance the long term reliability of the metallic fuse link. The integrated circuit includes an insulating layer...
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5929505 |
Inter-metal-wiring antifuse device provided by self-alignment
A first electrode layer is formed on a semiconductor substrate, and surfaces other than a top surface thereof are buried in an insulation film, and the top surface makes the same surface as that of...
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5920110 |
Antifuse device for use on a field programmable interconnect chip
This interconnect chip provides the function of an antifuse device. The interconnect chip is initially disconnected. Application of a high voltage applied across two terminals on the chip causes...
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5917229 |
Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect
Two types of programmable elements, fuses and antifuses, are disclosed for interconnecting the terminals of electronic components mounted on printed circuit boards (PCBs), multichip modules (MCMs)...
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5914524 |
Semiconductor device
A semiconductor device has a semiconductor substrate on which are formed semiconductor devices. A wiring is provided to make electrical connection between the devices. First fuse elements are...
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5910678 |
Raised fuse structure for laser repair
A novel raised polycide fusible link structure is described. This structure enables a highly reliable laser-cutting process to be used in which the fuse can be easily and totally severed over a...
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5903041 |
Integrated two-terminal fuse-antifuse and fuse and integrated two-terminal fuse-antifuse structures incorporating an air gap
A two-terminal fuse-antifuse structure comprises a horizontal B-fuse portion and a vertical A-fuse portion disposed between two metallization layers of an integrated circuit device. The...
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5895962 |
Structure and a method for storing information in a semiconductor device
A semiconductor device includes a plurality of conductive layers that are formed on the substrate. Two electrically intercoupled sections of a read-only storage element, such as a fuse element,...
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5895963 |
Semiconductor device having opening portion for fuse breakage
A semiconductor device according to the present invention comprises a fuse provided on a substrate, a first insulating layer formed on the substrate and the first insulating layer, a first wiring...
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5895942 |
Fuse selectable modules
A semiconductor device according to the present invention is formed on a semiconductor chip and has a common module and a plurality of selectable modules. Each selectable module on the...
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5882998 |
Low power programmable fuse structures and methods for making the same
Disclosed is a semiconductor fuse structure having a low power programming threshold and anti-reverse engineering characteristics. The fuse structure includes a substrate having a field oxide...
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5883437 |
Method and apparatus for inspection and correction of wiring of electronic circuit and for manufacture thereof
A method and apparatus for inspecting wirings of an electronic circuit substrate to detect a defect in the wiring and for enabling correction thereof. The inspection method and apparatus include...
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5879966 |
Method of making an integrated circuit having an opening for a fuse
An improved structure and method of forming a protective layer over an opening in insulation layers over a fuse is presented. The protective layer prevents contaminates from entering the exposed...
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5872390 |
Fuse window with controlled fuse oxide thickness
A fuse window structure and method for forming the same for a semiconductor device with a fuse and a cutting site on the fuse, the structure having (1) a first oxide region substantially in...
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5872389 |
Semiconductor device having a fuse layer
Burst pressure P of an insulating layer positioned immediately on a fuse layer is defined by using planar width W of fuse layer and thickness t of insulating layer. The value of the planar width W...
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5861641 |
Customizable logic array device
A customizable logic array device including an array of identical multiple input, function selectable logic cells comprising a first conductive layer, application configurable interconnection...
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5844295 |
Semiconductor device having a fuse and an improved moisture resistance
An interlayer insulating layer is formed to cover a fuse layer. A concave portion is provided on the surface of interlayer insulating layer located directly above fuse layer. A nitride layer as a...
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5844296 |
Space saving laser programmable fuse layout
A compact laser programmable fuse structure has a central line and two sets of fuses extending from opposite sides of the central line. An opening through a passivation layer exposes the fuses and...
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5828081 |
Integrated semiconductor device
A power IC is provided which facilitates applying a high voltage to the gate electrode of the MOS semiconductor element for the power output of the power IC to break down defects around the gate...
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5814876 |
Semiconductor fuse devices
A semiconductor fuse device is formed of a conductive semiconductor substrate (11) having a top surface and a bottom surface. A layer (12) of dielectric material is provided on a portion of the top...
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5813881 |
Programmable cable and cable adapter using fuses and antifuses
Two types of programmable elements, fuses and antifuses, are disclosed for forming an electrically programmable cable in one embodiment and a cable adapter in another embodiment. The cable and the...
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5808351 |
Programmable/reprogramable structure using fuses and antifuses
Two types of programmable elements, fuses and antifuses, are disclosed for forming an electrically programmable burn-in board in one embodiment and an electrically programmable device-under-test...
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5789794 |
Fuse structure for an integrated circuit element
A programmable fuse element disposed between integrated circuit elements that may be selectively joined during the manufacture or programming of an integrated circuit. The fuse element is a...
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5789764 |
Antifuse with improved antifuse material
According to the present invention, an antifuse comprises first and second conductors separated by an antifuse material having a thickness selected to impart a desired target programming voltage to...
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5789788 |
Semiconductor device with first and second wells which have opposite conductivity types and a third well region formed on one of the first and second wells
Wells of n- and p-type are formed in a p-type substrate. Wells of p-type are also formed in the n-type well. Both the p-type wells are formed by the same process at the same time to make MOS...
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5780918 |
Semiconductor integrated circuit device having a programmable adjusting element in the form of a fuse mounted on a margin of the device and a method of manufacturing the same
An input part of a semiconductor integrated circuit includes a fuse element formed from a metal wiring layer and connected between an input pad and a source line is formed from wiring material. The...
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5777360 |
Hexagonal field programmable gate array architecture
Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclose. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or...
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5760674 |
Fusible links with improved interconnect structure
The fuse link includes a first and second interconnect, with interconnects each being substantially longer than deep. The interconnects are disposed toward each other with a insulator region...
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5760453 |
Moisture barrier layers for integrated circuit applications
The structure and method is provided which prevents moisture and contamination from diffusing through openings (e.g., fuse windows) in insulating layers to product devices. Three moisture barrier...
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5760464 |
Semiconductor device
A semiconductor device has a semiconductor chip with a plurality of pads, an inner lead which is connected to a plurality of pads by a plurality of bonding wires and which has a broken part...
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5757264 |
Electrically adjustable resistor structure
A resistor structure which resistance value is electrically adjusted after fabrication by a tester during the test operation so that its equivalent resistance closely approximates a desired nominal...
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5757060 |
Contamination guard ring for semiconductor integrated circuit applications
The guard ring is a barrier which prevents contaminates from diffusing through a window opening through insulating layers to adjacent semiconductor devices. The guard ring is formed surrounding a...
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5754089 |
Fuse structure and method for manufacturing it
A fuse structure is described in which a metallic frame is inserted between the insulation layers, through which the fuse window passes, and the final passivation layer. This frame is used as a...
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5747868 |
Laser fusible link structure for semiconductor devices
An improved laser fusible link structure for semiconductor devices (200) and method of manufacturing thereof (10) is disclosed. A first conductive layer is patterned to create a laser fuse (202)...
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5736777 |
Method and apparatus for fast self-destruction of a CMOS integrated circuit
A method and apparatus for fast electronic self-destruction of a CMOS integrated circuit. The present invention electrically destroys devices containing semiconductor components, securing the...
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5729041 |
Protective film for fuse window passivation for semiconductor integrated circuit applications
An integrated circuit includes a conductive fusible link that may be blown by heating with laser irradiation, The integrate circuit comprises a silicon substrate; a first insulating layer; a...
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5726482 |
Device-under-test card for a burn-in board
A device-under-test card includes a matrix of fuses and/or antifuses formed as part of a multi-layered structure. The matrix of fuses and/or antifuses can be electrically programmed to connect any...
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5723898 |
Array protection devices and method
The present disclosure sets forth an improved integrated circuit in which circuit elements, adjacent to a fuse, are protected by barriers positioned adjacent the fuse. In the improved integrated...
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5712206 |
Method of forming moisture barrier layers for integrated circuit applications
The structure and method is provided which prevents moisture and contamination from diffusing through openings (e.g., fuse windows) in insulating layers to product devices. Three moisture barrier...
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5698887 |
Semiconductor protection circuit
In a semiconductor protection circuit, a current fuse and a transistor are connected in series between a power supply terminal and a ground. A bias circuit is provided between the base and the...
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5698894 |
Double mask hermetic passivation structure
A passivation structure is formed using two passivation layers and a protective overcoat layer using two masking steps. The first passivation layer is formed over the wafer and openings are...
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5682057 |
Semiconductor device incorporating a temperature fuse
A semiconductor device is provided which comprises a semiconductor chip including at least one semiconductor element and at least two surface electrodes, at least two lead terminals one of which is...
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5680353 |
EPROM memory with internal signature concerning, in particular, the programming mode
Electrically programmable memories, in particular EPROMs, generally have an internal signature which can be read by the memory-programming device. This internal signature indicates the origin of...
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5679967 |
Customizable three metal layer gate array devices
Three metal layer customizable gate array devices and techniques to customize them are disclosed. Such a device incorporates an integrated circuit blank having a plurality of transistors and at...
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5675174 |
Method for using fuse structure in semiconductor device
This invention provides a semiconductor device wherein a fuse structure can be formed of a normal metal wiring material and the fuse structure can be cut easily and surely. A laser beam is applied...
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5672905 |
Semiconductor fuse and method
A semiconductor fuse and method for fabricating the same An insulating layer is provided and a trench formed therein. A fusible link is then formed across the insulating layer and trench and...
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5665638 |
Method for repairing a defect generated cell using a laser
The invention provides a method for repairing a defect-generated cell using a laser for disconnecting a defect-generated portion of a fuse conductive line in the fabricating process of...
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5663590 |
Product of process for formation of vias (or contact openings) and fuses in the same insulation layer with minimal additional steps
A process and resulting product are described for forming an integrated circuit structure with horizontal fuses on an insulation layer formed over other portions of the integrated circuit structure...
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