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6140691 |
Trench isolation structure having a low K dielectric material isolated from a silicon-based substrate
A trench isolation structure is provided which includes a dielectric material having a relatively low dielectric constant, K, that is approximately less than 3.8. The capacitance between active...
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6137152 |
Planarized deep-shallow trench isolation for CMOS/bipolar devices
The trench isolation structure in the present invention is as follows. A lower-half trench is in the substrate. An upper-half trench in the substrate is located above the lower-half trench and the...
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6133611 |
MOS semiconductor device
In a CMOS circuit including a source diffusion layer and a well region which are at the same potential, a P + -type source diffusion layer and an N + -type substrate diffusion layer are formed in...
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6127719 |
Subfield conductive layer and method of manufacture
A subfield conductive layer is provided, wherein a conductive layer is implanted beneath and laterally adjacent a field dielectric. The subfield conductive layer is placed within the silicon...
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6124623 |
Semiconductor device having channel stop regions
An object of the present invention is to manufacture a semiconductor device excellent in withstand-voltage property of each element formed in a peripheral element region portion, without incurring...
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6121668 |
Semiconductor device provided with conductor electrically connected to conducting region
A conductor crossing a trench around an electrical component is electrically connected to an isolated intermediate conducting region in order to move the field strength concentrations out of the...
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6118167 |
Polysilicon coated nitride-lined shallow trench
A polycrystalline silicon coated nitride-lined shallow trench technique for isolating active regions on an integrated circuit involves reducing the oxide encroachment and the "bird's beak"...
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6107670 |
Contact structure of semiconductor device
Disclosed is a contact structure between the bit line and the source/drain region in an EEPROM. An element region is isolated by a trench type element isolation region in a silicon substrate. The...
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6103020 |
Dual-masked field isolation
A field isolation process utilizes two or more isolation formation steps to form active areas on a semiconductor substrate. Each field isolation step forms a portion of the field isolation in a...
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6097076 |
Self-aligned isolation trench
The present invention relates to a method for forming an isolation trench structure in a semiconductor substrate without causing deleterious topographical depressions in the upper surface thereof...
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6097072 |
Trench isolation with suppressed parasitic edge transistors
An integrated circuit device includes a substrate having a planar surface and isolating trenches etched from the substrate. The isolating trenches form edges and corners with the surface of the...
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6097069 |
Method and structure for increasing the threshold voltage of a corner device
A structure for increasing the threshold voltage of a corner device, particularly for shallow trench isolation having narrow devices. An FET comprises a substrate having a channel formed therein...
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6093953 |
Isolation regions and methods of forming isolation regions
A silicon-comprising layer is employed adjacent a trench during planarization of an oxide fill within the trench. An overhanging oxide sidewall is formed along a lateral edge of a trenched...
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6091129 |
Self-aligned trench isolated structure
A trench-isolated active device and a method of forming a trench-isolated active device on a semiconductor substrate wherein the conductive layer of the device is self-aligned with an isolation...
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6087706 |
Compact transistor structure with adjacent trench isolation and source/drain regions implanted vertically into trench walls
A semiconductor integrated circuit with a transistor formed within an active area defined by side-walls of a shallow trench isolation region, and method of fabrication thereof, is described. A gate...
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6087705 |
Trench isolation structure partially bound between a pair of low K dielectric structures
A process is provided for forming dielectric structures having a relatively low dielectric constant arranged adjacent to the opposed lateral edges of a trench isolation structure. In an embodiment,...
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6077748 |
Advanced trench isolation fabrication scheme for precision polysilicon gate control
An IGFET device isolation structure fabrication scheme includes the formation of electrically insulating isolation structures that extend into the substrate and extend above the surface of the...
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6064105 |
Data retention of EEPROM cell with shallow trench isolation using thicker liner oxide
A shallow trench isolation structure and a method for forming the same for use with non-volatile memory devices is provided so as to maintain sufficient data retention thereof. An epitaxial layer...
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6064104 |
Trench isolation structures with oxidized silicon regions and method for making the same
A trench isolation structure in a semiconductor substrate includes a trench opening in the surface of the substrate and a seamless oxide layer filling the trench. The seamless oxide layer is formed...
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6054343 |
Nitride trench fill process for increasing shallow trench isolation (STI) robustness
A semiconductor device and method having shallow trench isolation. A pad oxide 24 and silicon 42 are formed on a substrate 20 to form a mask, and the pad oxide 24/silicon 42 mask is then patterned....
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6051885 |
Semiconductor device having a conductor with a wedge shaped depression
A highly integrated semiconductor device is made using a high precision manufacturing process having a comparatively small number of process steps. The device is substantially free of misalignment...
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6046483 |
Planar isolation structure in an integrated circuit
A method is provided for forming an isolation structure at a semiconducting surface of a body, and the isolation structure formed thereby. A masking layer is formed over selected regions of the...
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6046487 |
Shallow trench isolation with oxide-nitride/oxynitride liner
Disclosed is an improved process and liner for trench isolation which includes either a single oxynitride layer or a dual oxynitride (or oxide)/nitride layer. Such a process and liner has an...
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6040597 |
Isolation boundaries in flash memory cores
A wet etching process for establishing isolation grooves in a flash memory core wafer includes depositing nitride and/or oxide layers on a silicon substrate of the wafer, depositing a photoresist...
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6040233 |
Method of making a shallow trench isolation with thin nitride as gate dielectric
A semiconductor structure comprises a silicon substrate of a first conductivity type including wells of a second conductivity type disposed on a surface thereof and a dielectric layer including...
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6034403 |
High density flat cell mask ROM
A high-density flat cell mask ROM is disclosed. The mask ROM comprises: a semiconductor substrate having a plurality of trenches and each of the trenches is separated to keep a space with each...
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6033941 |
Method of forming a thin film transistor with asymmetrically arranged gate electrode and offset region
A thin film transistor which includes an oxide layer containing a trench; a semiconductor layer formed on the oxide layer, including the trench; a buffer layer formed on the semiconductor layer in...
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6034393 |
Nonvolatile semiconductor memory device using trench isolation and manufacturing method thereof
A nonvolatile semiconductor memory device with trench isolation having sufficient capability of isolating memory cells is provided. A trench formed as a line in the main surface of semiconductor...
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6034410 |
MOSFET structure with planar surface
A method is provided for a planar surface of a semiconductor integrated circuit, and an integrated circuit formed according to the same. A conductive layer is formed over a substrate. A silicon...
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6018180 |
Transistor formation with LI overetch immunity
An integrated circuit transistor and a method for making the same are provided. The transistor is resistant to junction shorts due to the overetch of local interconnect trenches. The transistor...
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6015985 |
Deep trench with enhanced sidewall surface area
The present invention includes a method and system to increase the deep trench sidewall surface area in a storage node on a DRAM chip. By tilting the trenches the capacitance is increased without...
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6008521 |
Integrated circuit employing simultaneously formed isolation and transistor trenches
A semiconductor fabrication process in which a transistor trench and an isolation trench are simultaneously formed in a semiconductor substrate. The transistor trench is laterally displaced from...
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6005279 |
Trench edge spacer formation
An insulating trench isolation structure is formed in a semiconductor substrate with a spacer overlying the trench edge to prevent oxide loss during subsequent etching, thereby preventing junction...
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5998868 |
Very dense chip package
An integrated circuit package or arrangement includes a carrier having a surface topography of projections or recesses for supporting individual semiconductor circuit chips having conversely...
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5998848 |
Depleted poly-silicon edged MOSFET structure and method
A field effect transistor with reduced corner device problems comprises source and drain regions formed in a substrate, a channel region between the source and drain regions, isolation regions in...
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5994756 |
Substrate having shallow trench isolation
A semiconductor substrate having a shallow trench isolation (STI) structure and a method of manufacturing the same are provided, i.e., an isolation substrate in which grooves are selectively formed...
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5990536 |
Integrated circuit arrangement having at least two mutually insulated components, and method for its production
An integrated circuit arrangement having at least two components has in a substrate, an insulation structure (4', 5) between the components which covers at least one side of a trench (3) and is...
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5982017 |
Recessed structure for shallow trench isolation and salicide processes
A shallow trench isolated FET LDD structure that has a low probability of short circuiting at the silicon to trench interface or between the source or drain and the gate (because of a titanium...
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5977609 |
Method and apparatus for insulating material using trenches
An island of material has an insulating trench structure. The trench structure includes a first insulating trench surrounded by a second insulating trench. The trenches are joined together by at...
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5959322 |
Isolated SOI memory structure with vertically formed transistor and storage capacitor in a substrate
A semiconductor device and method for manufacturing the same includes a plurality of memory cells, each cell having a transistor formed on a first semiconductor substrate and comprising first and...
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5952707 |
Shallow trench isolation with thin nitride as gate dielectric
A semiconductor structure comprises a silicon substrate of a first conductivity type including wells of a second conductivity type disposed on a surface thereof and a dielectric layer including...
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5949126 |
Trench isolation structure employing protective sidewall spacers upon exposed surfaces of the isolation trench
A shallow trench isolation structure and method for making the same are presented. In an embodiment, a trench dielectric is formed within a shallow trench that is disposed in a semiconductor...
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5949125 |
Semiconductor device having field isolation with a mesa or mesas
Narrow and wide, planar field isolation region (72, 74, 152, 172, 182) is formed by forming trenches (52, 54) within a substrate (10). For wide, planar field isolation regions (72, 152, 172, 182),...
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5945724 |
Trench isolation region for semiconductor device
Shallow trench isolation regions in a semiconductor device are formed by utilizing sacrificial spacers such as polysilicon spacers having a rounded shape to form trench isolation areas. The spacer...
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5939765 |
Sidewall profile
A shallow trench isolation structure and method for forming such structure. In one embodiment, the semiconductor device isolating structure of the present invention includes a trench formed into a...
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5925894 |
Thin film transistor with asymmetrically arranged gate electrode and offset region
A thin film transistor which includes an oxide layer containing a trench; a semiconductor layer formed on the oxide layer, including the trench; a buffer layer formed on the semiconductor layer in...
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5914499 |
High voltage silicon carbide semiconductor device with bended edge
The invention relates to a method in which proton or ion implantation is used for restructuring a silicon carbide region from being conductive to being resistive and wherein this implantation...
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5903040 |
Trench isolated integrated circuits including voids
A trench isolated integrated circuit includes at least one void in the trench at the trench corner. The trench comprises a trench wall, a trench floor and a trench corner between the trench wall...
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5886391 |
Antireflective structure
Inventive antireflective structures comprise a semiconductor substrate having thereon a combination of a plurality of layers that either that absorb reflected light or that dissipate reflected...
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5874769 |
Mosfet isolation structure with planar surface
A method is provided for a planar surface of a semiconductor integrated circuit, and an integrated circuit formed according to the same. A conductive layer is formed over a substrate. A silicon...
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