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7424688 Designing and fabrication of a semiconductor device  
Designing method of an electronic device subjected to a chemical mechanical polishing process in a fabrication process thereof is conducted according to the steps of: dividing a substrate surface...
7420248 Programmable random logic arrays using PN isolation  
Disclosed are a programmable, random logic device array, and a method of forming such a device. The device comprises a substrate, and a semiconductor layer above the substrate. That semiconductor...
7420239 Dielectric layer forming method and devices formed therewith  
Embodiments in accordance with the present invention provide alternative materials, and methods of forming such materials, that are effective as dielectric layers. Such embodiments include forming...
7417297 Film or layer of semiconducting material, and process for producing the film or layer  
SOI wafers are manufactured to have very thin device layers of high surface quality. The layer is ≦20 nm in thickness, has an HF density of ≦0.1/cm 2 , and a surface roughness of 0.2 nm RMS.
7414437 Nanomechanical computer  
An electromechanical switching device employs a first nanoscale pillar shuttling charge between opposed charged electrodes. Motion of the first pillar is coupled to a second set of pillars...
7414292 Semiconductor device and its manufacturing method  
A semiconductor device manufacturing method includes, forming isolation region having an aspect ratio of 1 or more in a semiconductor substrate, forming a gate insulating film, forming a silicon...
7411270 Composite capacitor and method for forming the same  
An electronic assembly ( 98 ) includes a substrate ( 20 ), a capacitor having first and second conductors ( 38,54 ) formed over the substrate, a first set of conductive members ( 76 ) formed over...
7411267 Semiconductor integrated circuit device  
The invention provides a semiconductor integrated circuit device with improved designing efficiency while achieving higher functions. An inner circuit is surrounded by a plurality of cells in which...
7410872 Sealing method for electronic devices formed on a common semiconductor substrate and corresponding circuit structure  
A method for sealing electronic devices formed on a semiconductor substrate includes forming a plurality of first electronic devices adjacent a first portion of the semiconductor substrate, with...
7405459 Semiconductor device comprising porous film  
The present invention provides a zeolite sol which can be formed into a porous film that can be thinned to an intended thickness by a method used in the ordinary semiconductor process, that excels...
7402884 Low crosstalk substrate for mixed-signal integrated circuits  
An integrated circuit laminate with a metal substrate for use with high performance mixed signal integrated circuit applications. The metal substrate provides substantially improved crosstalk...
7402883 Back end of the line structures with liner and noble metal layer  
A back end of the line (BEOL) structure of a semiconductor device is presented. In one embodiment, the structure may include a first liner layer disposed on an intermediate interconnect structure,...
7396723 Method of manufacturing EEPROM device  
A method of manufacturing an EEPROM device can reduce the cell area. The method of manufacturing an Electrically Erasable Programmable Read-Only Memory (EEPROM) includes forming a mask pattern over...
7394143 Semiconductor integrated circuit device  
Repeaters are arranged at arbitrary positions to substantially improve transmission speed of a signal. In the semiconductor integrated circuit device 1, repeater regions 10 where repeaters are...
7394142 Bulk-isolated PN diode and method of forming a bulk-isolated PN diode  
A technique for making a bulk isolated PN diode. Specifically, a technique is provided for making a voltage clamp with a pair of bulk isolated PN diode. Another embodiment provides for a voltage...
7382015 Semiconductor device including an element isolation portion having a recess  
A non-volatile semiconductor memory device, which is intended to prevent data destruction by movements of electric charges between floating gates and thereby improve the reliability, includes...
7368798 Integrated DC/DC converter substrate connections  
Embodiments of the present invention provide an integrated circuit (IC) having an integrated DC-DC power converter therein. This IC is operable to support the distribution of combined power and...
7361966 Actuator chip for inkjet printhead with electrostatic discharge protection  
An inkjet printhead chip includes electrostatic discharge (ESD) circuits to protect the chip during ESD events, including one preventing a thin dielectric layer on a substrate from breakdown. In...
7358596 Device isolation for semiconductor devices  
Exemplary embodiments of the present invention disclose a semiconductor assembly having at least one isolation structure formed. The semiconductor assembly comprises: a first trench in a...
7358548 Semiconductor integrated circuit having layout in which buffers or protection circuits are arranged in concentrated manner  
Buffers are arranged in a concentrated manner in a region distant from pads. The region refers to a region in a main region of a semiconductor integrated circuit, except for a central processing...
7352047 Systems and methods for integration of heterogeneous circuit devices  
A heterogeneous device comprises a substrate and a plurality of heterogeneous circuit devices defined in the substrate. In embodiments, a plurality of heterogeneous circuit devices are integrated...
7349273 Access circuit and method for allowing external test voltage to be applied to isolated wells  
An access circuit selectively couples an externally accessible terminal to each of a plurality of isolated DRAM wells in which respective DRAM arrays are fabricated. The access circuit for each...
7348652 Bulk-isolated PN diode and method of forming a bulk-isolated PN diode  
A technique for making a bulk isolated PN diode. Specifically, a technique is provided for making a voltage clamp with a pair of bulk isolated PN diode. Another embodiment provides for a voltage...
7345524 Integrated circuit with low power consumption and high operation speed  
An integrated circuit includes a functional circuit module operating at a voltage range between a first voltage level and a second voltage level lower than the first voltage level. A power supply...
7345351 Coating composition for insulating film production, preparation method of insulation film by using the same, insulation film for semi-conductor device prepared therefrom, and semi-conductor device comprising the same  
The present invention relates to a coating composition for insulating film production, a preparation method of a low dielectric insulating film using the same, a low dielectric insulating film for...
7321158 Method of manufacturing variable capacitance diode and variable capacitance diode  
In a method of manufacturing a variable capacitance diode according to the present invention, a mask is formed on a semiconductor substrate of a first conductive type having a low impurity...
7312505 Semiconductor substrate with interconnections and embedded circuit elements  
A semiconductor substrate integrated with interconnections and circuit components. A silicon backplane is processed with silicon processing to provide electrical connectivity for circuit elements....
7310259 Access circuit and method for allowing external test voltage to be applied to isolated wells  
An access circuit selectively couples an externally accessible terminal to each of a plurality of isolated DRAM wells in which respective DRAM arrays are fabricated. The access circuit for each...
7309622 Integrated circuit package system with heat sink  
An integrated circuit package system includes providing a substrate. An integrated circuit is attached to the substrate. A plurality of support bars is formed on the substrate. A plurality of...
7307331 Integrated radio front-end module with embedded circuit elements  
A highly integrated radio front-end module. In one embodiment a semiconductor substrate is processed with various circuit components in the substrate, as well as interconnections for the various...
7306959 Methods of fabricating integrated optoelectronic devices  
This disclosure concerns methods for fabrication of integrated high speed optoelectronic devices. In one example of such a method, a device region that includes a top surface and a bottom surface...
7304364 Embossed mask lithography  
Disclosed are layered groupings and methods for constructing digital circuitry, such as memory known as Permanent Inexpensive Rugged Memory (PIRM) cross point arrays which can be produced on...
7302660 Standard cell, standard cell library, semiconductor device, and placing method of the same  
Of a plurality of standard cells in which an N-well region and a P-well region are vertically formed, some standard cells have a border line between the N-well region and the P-well region which is...
7291894 Vertical charge control semiconductor device with low output capacitance  
In accordance with an embodiment of the present invention, a MOSFET includes at least two insulation-filled trench regions laterally spaced in a first semiconductor region to form a drift region...
7285839 Coating of copper and silver air bridge structures to improve electromigration resistance and other applications  
An improved electrical interconnect for an integrated circuit and methods for providing the same are disclosed. The electrical interconnect includes an air bridge extending through a gaseous medium...
7274050 Packaging and manufacturing of an integrated circuit  
Apparatus, packaging, and methods of manufacture of an integrated circuit are provided. The integrated circuit includes a component of a first type fabricated on a first substrate containing a...
7268059 Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components  
A method for securing a semiconductor device component to another element is provided. An adhesive material includes a pressure-sensitive component and a curable component is used to at least...
7264753 High resistance poly(3,4-ethylenedioxythiophene)/poly(styrene sulfonate) for use in high efficiency pixellated polymer electroluminescent devices  
High resistance PEDT/PSS buffer layers are provided for use in electroluminescent devices such as, e.g., OLEDs. In accordance with another embodiment, there are provided OLEDs comprising high...
7253496 Antifuse circuit with current regulator for controlling programming current  
In one embodiment, an antifuse cell includes a select transistor, a blocking transistor, and an antifuse. The select transistor allows for selection of the antifuse cell among an array of antifuse...
7251385 Wavelength multiplexing on-chip optical interconnection circuit, electro-optical device, and electronic apparatus  
To provide a wavelength multiplexing on-chip optical interconnection circuit, an electro-optical device, and an electronic apparatus, wherein a signal transmission speed can be enhanced, fineness...
7250667 Selectable open circuit and anti-fuse element  
An integrated circuit is provided with a semiconductor substrate that is doped with a set concentration of an oxidizable dopant of a type that segregates to the top surface of a silicide when the...
7250353 Method and system of releasing a MEMS structure  
A MEMs (microelectromechanical systems) structure is provided. In one implementation, the MEMs structure includes a substrate wafer including a MEMs device formed on a surface of the substrate...
7248131 Monolithic vertical integration of an acoustic resonator and electronic circuitry  
Monolithic devices that include an acoustic resonator vertically integrated with electronic circuitry are described. In one aspect, a monolithic integrated device includes a substrate, electronic...
7242823 Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatus  
An optical transmission board is provided. The optical transmission board includes an optical transmission channel, a retention board for retaining the optical transmission channel and circuit...
7238605 Circuit structures and methods of forming circuit structures with minimal dielectric constant layers  
An apparatus including a contact point formed on a device layer of a circuit substrate or an interconnect layer on the substrate; a first dielectric material; and a different second polymerizable...
7235855 Semiconductor device having a layout configuration for minimizing crosstalk  
Over a memory cell array region of a static RAM (random access memory), dummy wire patterns are formed such that each dummy wire pattern covers 2×2 horizontally and vertically-adjacent...
7233024 Three-dimensional memory device incorporating segmented bit line memory array  
A three-dimensional (3D) high density memory array includes multiple layers of segmented bit lines (i.e., sense lines) with segment switch devices within the memory array that connect the segments...
7230326 Semiconductor device and wire bonding chip size package therefor  
A semiconductor device incorporated in a wire bonding chip size package (WBCSP) is designed such that a plurality of pads are formed on the surface of a semiconductor substrate and are connected to...
7230312 Transistor having vertical junction edge and method of manufacturing the same  
Techniques for forming devices, such as transistors, having vertical junction edges. More specifically, shallow trenches are formed in a substrate and filled with an oxide. Cavities may be formed...
7230311 Silicon substrate having an insulating layer  
A silicon substrate includes plural partial areas defined on the silicon substrate such that adjacent partial areas are orientated in different directions. The plural partial areas define an...
Matches 1 - 50 out of 293 1 2 3 4 5 6 >