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7629665 |
Semiconductor component with a channel stop zone
A semiconductor component has a semiconductor body ( 100 ) having a basic doping and a first and second side, an inner region ( 103 ) arranged between the first and second sides, and an edge region...
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7595532 |
Semiconductor memory devices and methods of forming the same
A semiconductor memory device includes a semiconductor substrate including an insulating layer, a charge storage region of a first conductivity type on the insulating layer, and an insulating film...
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7592683 |
Semiconductor device with improved electrostatic tolerance
A semiconductor device comprises a P − -type semiconductor substrate ( 15 ), an N − -type semiconductor substrate ( 21 ) formed on the P − -type semiconductor substrate ( 15 ), an upper...
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7589393 |
Semiconductor structure of a high side driver for two high voltage nodes with partially linked deep wells and method for manufacturing the same
A semiconductor structure of a high side driver includes an ion-doped junction. The ion-doped junction includes a substrate, a first deep well and a second deep well, a first heavy ion-doped region...
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7560787 |
Trench field plate termination for power devices
In accordance with an embodiment of the invention, a semiconductor power device includes an active region configured to conduct current when the semiconductor device is biased in a conducting...
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7521342 |
Semiconductor structure with high-voltage sustaining capability and fabrication method of the same
A semiconductor structure with high-voltage sustaining capability. A semiconductor structure with high-voltage sustaining capability includes a first well region of a first conductivity type. A...
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7521774 |
Semiconductor diode and method for the production thereof
In a semiconductor system 20 made up of multiple sublayers, a sublayer over the largest part of a cross-sectional area BC in the interior of the semiconductor system borders immediately on the...
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7411272 |
Semiconductor device and method of forming a semiconductor device
A power semiconductor device has an active region that includes a drift region. At least a portion of the drift region is provided in a membrane which has opposed top and bottom surfaces. In one...
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7355261 |
Thin film device, thin film device module, and method of forming thin film device module
A thin film device includes a thin film element disposed on a surface of a substrate for high voltage formed of a material having an electric resistivity in the range of 10 8 Ω·cm to 10 10 ...
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7355257 |
Semiconductor superjunction device
A semiconductor superjunction device has a superjunction structure formed in a drift region of the device. The superjunction structure has alternately arranged n-type regions and p-type...
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7327008 |
Structure and method for mixed-substrate SIMOX technology
The present invention provides a semiconductor structure that includes a substrate having a crystal lattice; a first structure formed in a first region of the substrate, the first structure...
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7327007 |
Semiconductor device with high breakdown voltage
A technique is provided which allows easy achievement of a semiconductor device with desired breakdown voltage. In a high-potential island region defined by a p impurity region, an n + impurity...
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7321142 |
Field effect transistor
On an SiC single crystal substrate, an electric field relaxation layer and a p− type buffer layer are formed. The electric field relaxation layer is formed between the p− type buffer layer and...
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7304356 |
IGBT or like semiconductor device of high voltage-withstanding capability
A multiple-cell insulated-gate-bipolar-transistor chip is disclosed which includes a semiconductor substrate having formed therein a p + -type collector region and an n − -type base region, with...
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7301179 |
Semiconductor device having a high breakdown voltage transistor formed thereon
An ion-through region 100, 102 is provided as a first opening in a passivation film 90 on a source electrode 70 and a drain electrode 80 . The passivation film 90 is coated with a sealing...
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7279768 |
Semiconductor device for overvoltage protection
In a semiconductor device of the present invention, an N-type buried diffusion layer is formed across a substrate and an epitaxial layer. A P-type buried diffusion layer is formed across an upper...
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7259440 |
Fast switching diode with low leakage current
A fast switching diode includes an n− layer having an upper surface and a lower surface and a first edge and a second edge, the second edge provided on an opposing side of the first edge. A...
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7244975 |
High-voltage device structure
A high-voltage device structure includes a high-voltage device disposed on a semiconductor substrate. The semiconductor includes an active region and an isolation region, and the high-voltage...
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7230310 |
Super-junction voltage sustaining layer with alternating semiconductor and High-K dielectric regions
A semiconductor power device includes a device feature layer, a substrate contact layer and a voltage-sustaining layer between them. The voltage-sustaining layer includes alternating semiconductor...
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7180133 |
Method and structure for addressing hot carrier degradation in high voltage devices
In a method and structure for a high voltage LDMOS with reduced hot carrier degradation, the thick field oxide is eliminated and a reduced surface field achieved instead by including adjacent p+...
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7135751 |
High breakdown voltage junction terminating structure
A high breakdown voltage junction terminating structure having a loop-like RESURF structure formed on a SOI substrate is disclosed. A lateral IGBT, a lateral FWD, an output stage element and a...
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7106628 |
Semiconductor device having enhanced breakdown voltage
A semiconductor device has: a main circuit including a plurality of MOS transistors operating at a first voltage; a memory requiring an operation at a second voltage higher than the first voltage;...
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7081656 |
CMOS constructions
The invention includes methods of forming circuit devices. A metal-containing material comprising a thickness of no more than 20 Å (or alternatively comprising a thickness resulting from no more...
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7049663 |
ESD protection device with high voltage and negative voltage tolerance
An electrostatic discharge protection device with high voltage and negative voltage tolerance is provided. The electrostatic discharge protection device comprises: a first type substrate; a first...
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6989566 |
High-voltage semiconductor device including a floating block
A high-voltage semiconductor device includes: a semiconductor region; a doped contact region; an isolating region; a metal electrode which is electrically connected with the doped contact region;...
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6921945 |
Semiconductor device with structure for improving breakdown voltage
A semiconductor layer ( 10 ) provided on a BOX (buried oxide) layer ( 2 ) includes a first P-type region ( 11 ), an N + -type region ( 12 ), and an N − type region ( 13 ) which together form a...
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6900518 |
Semiconductor device
A power semiconductor device has an active region that includes a drift region. At least a portion of the drift region is provided in a membrane which has opposed top and bottom surfaces. In one...
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6873012 |
SOI component
A semiconductor component has a semiconductor substrate, an insulation layer located on the semiconductor substrate, and a semiconductor layer that is arranged on the insulation layer. A first...
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6847080 |
Semiconductor device with high and low breakdown voltage and its manufacturing method
The objective of this invention is to provide a semiconductor device and its manufacturing method with which the offset can be kept fixed even in high breakdown voltage MOS transistors, and that...
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6828605 |
Field-effect-controlled semiconductor component and method of fabricating a doping layer in a vertically configured semiconductor component
A field-effect-controllable semiconductor component has at least one source zone and at least one drain zone of a first conductivity type, and at least one body zone of a second conductivity type....
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6815793 |
Body of a semiconductor material with a reduced mean free path length
A body ( 1 ) consisting of a doped semiconductor material with a pn junction ( 10 ) and an area ( 2 ) of reduced mean free path length (λr) for free charge carriers is disclosed. Said area ( 2 )...
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6768170 |
Superjunction device with improved avalanche capability and breakdown voltage
A superjunction device has a plurality of equally spaced P columns in an N − epitaxial layer. The concentration of the P type columns is made greater than that needed for maintaining charge...
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6740952 |
High withstand voltage semiconductor device
A semiconductor device includes a stable high withstand voltage lateral MISFET device which suppresses a gradual withstand voltage drop under high voltage and humidity conditions. In a MISFET...
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6724021 |
Semiconductor devices and their peripheral termination
A semiconductor device, such as a power MOSFET, Schottky rectifier or p-n rectifier, has a voltage-sustaining zone ( 20 ) between a first ( 21, 23, 31 a ) and second ( 22 ) device regions adjacent...
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6717230 |
Lateral device with improved conductivity and blocking control
An LDMOS device is made on a semiconductor substrate 112 . It has an N+ source and drain regions 120, 132 are formed within a P well region 122 . An interlevel dielectric layer 140 ...
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6696741 |
High breakdown voltage PN junction structure, and related manufacturing process
PN junction structure including a first junction region of a first conductivity type, and a second junction region of a second conductivity type, wherein between said first and second junction...
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6683363 |
Trench structure for semiconductor devices
A MOS trench structure integrated with a semiconductor device for enhancing the breakdown characteristics of the semiconductor device, comprises a semiconductor substrate, a plurality of parallel...
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6653669 |
Device for the adjustment of circuits after packaging
An integrated circuit includes an adjustment resistor, and at least one control transistor connected to a first voltage reference. An adjustment element is connected in parallel with the adjustment...
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6649995 |
Semiconductor device and method of manufacturing the same
A Schottky diode that achieves a predetermined reverse-direction breakdown voltage even if a state of a surface in a vicinity of a Schottky junction interface changes due to a welding of a bonding...
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6621116 |
Enhanced EPROM structures with accentuated hot electron generation regions
An EPROM structure includes a NMOS transistor integrated with a capacitor. The terminal names of the NMOS transistor follow the conventional nomenclature: drain, source, body and gate. The gate of...
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6607972 |
Method for producing an edge termination suitable for high voltages in a basic material wafer prefabricated according to the principle of lateral charge compensation
An edge termination is produced that is capable of handling high voltages. The edge termination is produced in a base material wafer that is produced in accordance with the principle of lateral...
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6600206 |
High voltage semiconductor device having high breakdown voltage isolation region
A high voltage semiconductor device is provided. The high voltage semiconductor device includes a tow voltage region, a high voltage region, and a high breakdown voltage isolation region. The high...
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6583453 |
Semiconductor device having a voltage-regulator device
A semiconductor device providing an improved effect of suppressing variation with time of reverse breakdown voltage applied to PN junction, particularly, a voltage-regulator device, is provided....
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6486541 |
Semiconductor device and fabrication method
A thin-film semiconductor device comprising at least a semiconductor element and a wiring is disclosed. A thin film of a protective insulating material is formed on the lower surface of the...
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6476457 |
Semiconductor device with drift layer
A semiconductor device includes a semiconductor substrate having a first conductive type impurity, a well having a second conductive type impurity formed in a predetermined region of the...
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6469359 |
Semiconductor device and a method for production thereof
A semiconductor device of planar structure has a pn-junction ( 10 ) formed by a first layer ( 1 ) doped according to a first conductivity type, n or p, and on top thereof a second layer ( 2 ) doped...
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6462382 |
MOS type semiconductor apparatus
A MOS type semiconductor apparatus is provided which includes a main MOS type semiconductor device, an internal control circuit connected between a control input terminal (G) and a control input...
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6445054 |
Semiconductor device
A semiconductor device comprises an active area with a voltage termination structure located adjacent to the active area at an edge portion of the device. The edge portion comprises a substrate...
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6439514 |
Semiconductor device with elements surrounded by trenches
Pch-MOS transistors to which a power supply potential is applied are respectively surrounded by first trenches, and Nch-MOS transistors to which a ground potential is applied are respectively...
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6429501 |
Semiconductor device having high breakdown voltage and method for manufacturing the device
A power device has its main junction formed in a central portion of an N-type substrate. A P-type layer is formed in a peripheral surface portion of the substrate. A P − -type RESURF layer of a...
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