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9041162 Wafer and a method of dicing a wafer  
A wafer includes a plurality of chips, each of the chips being spaced from each other by kerf-line regions including a reduced width.
9043743 Automated residual material detection  
Methods, systems, and structures for detecting residual material on semiconductor wafers are provided. A method includes scanning a test structure including topographic features on a surface of a...
9040986 Three dimensional integrated circuit having a resistance measurement structure and method of use  
A three-dimensional integrated circuit (3DIC) including a top chip having at least one active device and an interposer having conductive routing layers and vias. The 3DIC further includes a...
9035308 Semiconductor package and method of fabricating the same  
A semiconductor package, comprising: a semiconductor substrate; a mold layer on the semiconductor substrate; and a marking formed on a surface of the mold layer, the marking comprising dot...
9035307 Microphone component  
A 2-chip MEMS microphone component includes: at least one first MEMS microphone structural component having at least one first microphone structure formed in the front side of the structural...
9035306 Adjusting configuration of a multiple gate transistor by controlling individual fins  
In a sophisticated semiconductor device, FINFET elements may be provided with individually accessible semiconductor fins which may be connected to a controllable interconnect structure for...
9029855 Layout for reticle and wafer scanning electron microscope registration or overlay measurements  
A method and a resulting device are provided for forming stack overlay and registration monitoring structures for FEOL layers including implant layers and for forming BEOL SEM overlay and...
9029854 Bulk silicon wafer product useful in the manufacture of three dimensional multigate MOSFETs  
A method for preparing a semiconductor structure for use in the manufacture of three dimensional transistors, the structure comprising a silicon substrate and an epitaxial layer, the epitaxial...
9024315 Daisy chain connection for testing continuity in a semiconductor die  
An integrated circuit product package configured to continuity testing is described. The integrated circuit product package includes a package substrate. The package substrate includes internal...
9024428 Semiconductor device and stacked semiconductor device  
A semiconductor device includes a package substrate, and a stack of semiconductor chips over the package substrate, each of the semiconductor chips including first and second surfaces, each of the...
9018627 Inspection apparatus  
In semiconductor surface inspection apparatus, foreign matter that sticks to the wafer can reduce the quality of the wafer. The present invention is directed to improving the internal cleanliness...
9018628 Semiconductor device and method of manufacturing semiconductor device  
A semiconductor device including: a base material portion that includes a semiconductor substrate and an insulating film that is formed on one face of the semiconductor substrate and on which a...
9012911 Protection of an integrated circuit against attacks  
An integrated circuit, including: a semiconductor substrate of a first conductivity type; a plurality of regions of the first conductivity type vertically extending from the surface of the...
9006739 Semiconductor test and monitoring structure to detect boundaries of safe effective modulus  
A method of testing an integrated circuit (IC) chip and a related test structure are disclosed. A test structure includes a monitor chain proximate to at least one solder bump pad, the monitor...
9007081 Jig for use in semiconductor test and method of measuring breakdown voltage by using the jig  
A jig for use in a semiconductor test of the present invention includes; a base on which a probe pin and an insulating material are provided such that the probe pin is surrounded by the insulating...
9006738 Reducing capacitive charging in electronic devices  
The invention relates to an electronic device for measuring and/or controlling a property of an analyte (100). The electronic device comprises: i) an electrode (Snsr) forming an interface with the...
9006740 Built-in self test for silicon photonics device  
In an example, the present invention includes an integrated system on chip device. The device has a self test block configured on the silicon photonics device and to be operable during a test...
9000785 Transistor test structure  
A test structure may characterize the properties of a transistor including a DC test structure for testing DC properties of the transistor, and an AC test structure for testing AC properties of...
9000433 Spin-polarised charge-carrier device  
A device comprising a channel for charge carriers comprising non-ferromagnetic semiconducting in which charge carriers exhibit spin-orbit coupling, a region of semiconducting material of opposite...
9000434 Visual indicator for semiconductor chips for indicating mechanical damage  
A semiconductor device including a semiconductor substrate having a surface including an active semiconductor device including one of a laser and a photodiode; and a visual indicator disposed on...
9000435 Display device and testing line repairing method thereof  
A display device and a testing line repairing method thereof is provided herein and the method comprises steps of: cutting off a connection between a first input end of a first thin film...
8994394 Test carrier  
A test carrier includes a film-shaped base film which has first bumps which contact test pads of a die; and a cover film which is superposed over the base film, and the test carrier holds the die...
8994022 Method of evaluating a semiconductor wafer dicing process  
Embodiments of the disclosure relate to a method of evaluating a semiconductor wafer dicing process, comprising providing evaluation lines extending in at least one scribe line of the wafer,...
8987009 Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product  
A method for tracking an interposer die of a stacked silicon interconnect technology (SSIT) product includes forming a plurality of dummy components on the interposer die, and modifying one or...
8987735 Semiconductor device  
A semiconductor device includes at least two semiconductor chips each including a plurality of data input/output pads, a data memory portion structured so as to read/write data through the...
8987013 Method of inspecting misalignment of polysilicon gate  
A method of inspecting misalignment of a polysilicon gate is disclosed, characterized in forming only NMOS devices in P-wells in a test wafer and utilizing an advanced electron beam inspection...
8987733 Array substrate for flexible display device  
An array substrate for a flexible display device, the array substrate including a mother substrate, a plurality of display units separated on the mother substrate, in which the plurality of...
8987014 Semiconductor wafer and method of forming sacrificial bump pad for wafer probing during wafer sort test  
A semiconductor wafer contains a plurality of semiconductor die. A plurality of interconnect bump pads is formed over the semiconductor die. A plurality of sacrificial bump pads is formed in...
8987734 Semiconductor wafer, semiconductor process and semiconductor package  
The present invention provides a semiconductor wafer, semiconductor package and semiconductor process. The semiconductor wafer includes a substrate, at least one metal segment and a plurality of...
8976310 Array substrate for fringe field switching mode liquid crystal display device  
An array substrate for a fringe field switching mode liquid crystal display, and the display are discussed. According to an embodiment, the array substrate includes a display area including pixel...
8975715 Photodetector and method for manufacturing the same  
A photodetector includes a substrate and an insulating arrangement formed in the substrate. The insulating arrangement electrically insulates a confined region of the substrate. The confined...
8975095 Integrated nanowire/nanosheet nanogap and nanopore for DNA and RNA sequencing  
A technique is provided for base recognition in an integrated device is provided. A target molecule is driven into a nanopore of the integrated device. The integrated device includes a nanowire...
8975094 Test structure and method to facilitate development/optimization of process parameters  
A test structure and method are provided to facilitate developing or optimizing a fabrication process by determining values of one or more lithography process parameters for use in semiconductor...
8969978 TMAP sensor systems and methods for manufacturing those  
A pressure sensor system comprising a pressure sensor chip is disclosed. The pressure sensor chip comprises a sensing side where pressure sensing is performed and one or more interconnections...
8969870 Pattern for ultra-high voltage semiconductor device manufacturing and process monitoring  
A pattern for use in the manufacture of semiconductor devices is provided which, according to an example embodiment, may comprise at least one second field region comprising a main array of dies,...
8969869 Integrated circuit wafer and integrated circuit die  
An integrated circuit wafer and integrated circuit dice are provided. The integrated circuit wafer includes a wafer substrate, a plurality of integrated circuits, a plurality of test-keys, an...
8963150 Semiconductor device having a test pad connected to an exposed pad  
A semiconductor device includes a circuit board including a ground portion, and a semiconductor package disposed on the circuit board. The semiconductor package includes an external connecting pad...
8963157 Thin film transistor, array substrate, and manufacturing method thereof  
A thin film transistor, an array substrate, and a manufacturing method thereof. The manufacturing method comprises: forming a buffer layer and an active layer sequentially on a substrate, and...
8957695 Semiconductor device having plural semiconductor chip stacked with one another  
Disclosed herein is a device that includes: external terminals; a first chip including a first control circuit that generates a first control signal; and a second chip stacked with the first chip....
8957419 Organic light emitting display apparatus having inspection thin film transistors  
An organic light emitting display apparatus and a method of inspecting the same, the organic light emitting display apparatus including a plurality of sub-pixels; a plurality of conductive line...
8957694 Wafer level package resistance monitor scheme  
An integrated circuit includes a monitoring circuit and a monitored circuit connected with the monitoring circuit. The monitoring circuit is operable to determine during fabrication if a...
8952383 Test carrier  
A test carrier which can suppress the occurrence of contact defects while securing positional precision of the terminals is provided. A test carrier 10 comprises: a base film 40 which has one main...
8951814 Method of fabricating a flip chip semiconductor die with internal signal access  
A device and method for providing access to a signal of a flip chip semiconductor die. A hole is bored into a semiconductor die to a test probe point. The hole is backfilled with a conductive...
8952716 Method of detecting defects in a semiconductor device and semiconductor device using the same  
A method of detecting a defect of a semiconductor device includes forming test patterns and unit cell patterns in a test region a cell array region of a substrate, respectively, obtaining...
8946706 Test pattern of semiconductor device, method of manufacturing test pattern and method of testing semiconductor device by using test pattern  
A test pattern of a semiconductor device includes a plurality of active regions defined in a semiconductor substrate and arranged in parallel with each other, a plurality of gate patterns formed...
8946627 Three-dimensional mapping using scanning electron microscope images  
A method includes irradiating a surface of a sample, which is made-up of multiple types of materials, with a beam of primary electrons. Emitted electrons emitted from the irradiated sample are...
8946705 Semiconductor device  
A technique is provided that can prevent cracking of a protective film in the uppermost layer of a semiconductor device and improve the reliability of the semiconductor device. Bonding pads formed...
8946859 Device for detecting an attack in an integrated circuit chip  
An integrated circuit chip including a plurality of parallel wells of alternated conductivity types formed in the upper portion of a semiconductor substrate of a first conductivity type, and a...
8941109 Test output buffer functional output input, test output, enable input  
Timely testing of die on wafer reduces the cost to manufacture ICs. This disclosure describes a die test structure and process to reduce test time by adding test pads on the top surface of the...
8940553 Flat panel display device and method for manufacturing flat panel display  
A flat panel display device includes a pixel circuit provided on a substrate, a pixel wiring, an inspection pad connected to the pixel circuit through the pixel wiring, a main wiring separated...