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7620931 |
Method of adding fabrication monitors to integrated circuit chips
An integrated circuit, a method and a system for designing and a method fabricating the integrated circuit. The method including: (a) generating a photomask level design of an integrated circuit...
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7618831 |
Method of monitoring the manufacture of interferometric modulators
Process control monitors are disclosed that are produced using at least some of the same process steps used to manufacture a MEMS device. Analysis of the process control monitors can provide...
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7616014 |
Pulsed I-V measurement method and apparatus
A method and apparatus for measuring a pulsed I-V characteristic of a DUT that has a signal terminal and a return terminal includes connecting a pulse unit between the signal and return terminals,...
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7615781 |
Semiconductor wafer and semiconductor device, and method for manufacturing same
There is a room for improvement in conventional semiconductor devices in terms of reducing the chip area. A semiconductor device 1 comprises an evaluation transistor 10 (first characteristic...
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7615780 |
DNA biosensor and methods for making and using the same
Disclosed herein are biosensors and methods for making and using the same. In one embodiment, the sensor for detecting an analyte comprises: a substrate, recognition elements specific for the...
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7612371 |
Structure to monitor arcing in the processing steps of metal layer build on silicon-on-insulator semiconductors
The present invention addresses detection of charge-induced defects through test structures that can be easily incorporated on a wafer to detect charge-induced damage in the back-end-of-line...
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7612370 |
Thermal interface
An apparatus including an interface having a number of nanostructures is described. The apparatus comprises heat source, a thermal management device, and an interface disposed between the thermal...
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7605434 |
Semiconductor memory device to which test data is written
A semiconductor memory device of this invention includes a first bank, a second bank, and a bank decoder that selects a bank to be activated from the first and second banks. When testing operations...
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7605398 |
Apparatus of high dynamic-range CMOS image sensor and method thereof
The present invention discloses an apparatus of high dynamic-range CMOS image sensor and method thereof. The present invention utilize a pixel circuit outputting an output signal, wherein the pixel...
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7603598 |
Semiconductor device for testing semiconductor process and method thereof
A semiconductor device for testing a semiconductor process applied to manufacturing the semiconductor device is disclosed. The semiconductor device includes at least a testing group. The testing...
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7598523 |
Test structures for stacking dies having through-silicon vias
A semiconductor die including a test structure is provided. The semiconductor die includes a loop-back formed on a surface of the semiconductor die. The loop-back structure includes a first bonding...
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7598522 |
Semiconductor substrate and production process thereof
A semiconductor substrate includes a wafer, a first stepped structure formed of plural stepped parts formed on a surface of the wafer with a first area occupation ratio, a second stepped structure...
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7595482 |
Standard component for length measurement, method for producing the same, and electron beam metrology system using the same
A standard component for length measurement includes a first diffraction grating and a second diffraction grating. Each of components of the second diffraction grating is disposed between...
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7595205 |
Using reverse arrangement for trend test in statistical process control for manufacture of semiconductor integrated circuits
A method for manufacturing semiconductor devices or other types of devices and/or entities. The method includes providing a process (e.g., etching, deposition, implantation) associated with a...
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7592623 |
Semiconductor device including wiring connection testing structure
A semiconductor device includes a substrate, a semiconductor element formed on the substrate, and a wiring connection testing structure which is formed on the substrate and which includes an...
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7587648 |
Integrated circuit having electrically isolatable test circuitry
Special test circuitry in an IC for wafer level testing selectively connects the specialized test circuitry to the functional circuitry during wafer test. Following wafer test the special test...
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7586314 |
Multi-pin CV measurement
A method for measuring electrical parameters of a DUT having at least three terminals includes applying a first AC voltage to a first terminal; separately driving a second and a third terminal each...
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7585601 |
Method to optimize grating test pattern for lithography monitoring and control
A method of making a process monitor grating pattern for use in a lithographic imaging system comprises determining minimum resolvable pitch of a plurality of spaced, adjacent line elements, and...
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7583093 |
Electrical test method of an integrated circuit
A method for testing an integrated circuit is provided comprising steps of providing at least one first conductive path stretching along an element of the integrated circuit, applying a voltage at...
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7582899 |
Semiconductor device having overlay measurement mark and method of fabricating the same
There are provided a semiconductor device having an overlay measurement mark, and a method of fabricating the same. The semiconductor device includes a scribe line region disposed on a...
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7579689 |
Integrated circuit package, and a method for producing an integrated circuit package having two dies with input and output terminals of integrated circuits of the dies directly addressable for testing of the package
An integrated circuit package ( 1 ) comprising first and second dies on a laminate ( 5 ) in a resin encapsulating housing ( 6 ) comprises a digital signal processing integrated circuit ( 8 )...
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7579616 |
Four-terminal programmable via-containing structure and method of fabricating same
A semiconductor structure that includes two programmable vias each of which contains a phase change material that is integrated with a heating material. In particular, the present invention...
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7576357 |
System for characterization of low-k dielectric material damage
A method of detecting damage to at least one dielectric layer in an IC die by determining a capacitance factor. The capacitance factor can be used to determine damage in a low-k dielectric...
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7576356 |
Solution processed crosslinkable hole injection and hole transport polymers for OLEDs
A fully solution-processed polymer electroluminescent device has a hole injection layer fabricated using a crosslinkable hole injection/transport material doped with conductivity dopants.
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7573066 |
Semiconductor substrate, substrate inspection method, semiconductor device manufacturing method, and inspection apparatus
A semiconductor substrate inspection method includes: generating a charged particle beam, and irradiating the charged particle beam to a semiconductor substrate in which contact wiring lines are...
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7573065 |
Semiconductor device evaluation method
An apparatus for evaluating a field-effect transistor includes a pulse generator, a current/voltage converter, a switch and a first constant-voltage source. The pulse generator can be electrically...
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7573064 |
Dielectric actuator or sensor structure and method of making it
The present invention relates to dielectric actuators or sensors of the kind wherein electrostatic attraction between two electrodes located on an elastomeric body leads to a compression of the...
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7569853 |
Test pads on leads unconnected with die pads
Timely testing of die on wafer reduces the cost to manufacture ICs. This disclosure describes a die test structure and process to reduce test time by adding test pads on the top surface of the die....
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7566900 |
Integrated metrology tools for monitoring and controlling large area substrate processing chambers
Embodiments of an apparatus and method of monitoring and controlling a large area substrate processing chamber are provided. Multiple types of metrology tools can be installed in the substrate...
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7561853 |
Radio frequency switch
A switch that selectively changes radio frequency signals includes at least three FETs, which are connected in series. The source electrodes or drain electrodes arranged at an intermediate stage...
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7560801 |
Rewiring substrate strip with several semiconductor component positions
A rewiring substrate strip and a method of producing a rewiring substrate strip is disclosed. In one embodiment, the rewiring substrate strip has several semiconductor component positions for...
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7560351 |
Integrated circuit arrangement with low-resistance contacts and method for production thereof
An integrated circuit arrangement and fabrication method is presented. The integrated circuit arrangement contains a semiconductor and a metal electrode. The contact area between a semiconductor...
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7553681 |
Carbon nanotube-based stress sensor
An embodiment of the present invention is a technique to form stress sensors on a package in situ. A first array of carbon nanotubes (CNTs) aligned in a first orientation is deposited at a first...
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7550855 |
Vertically spaced plural microsprings
A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited,...
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7550763 |
Semiconductor integrated circuit device and manufacture thereof
In a semiconductor integrated circuit device, testing pads ( 209 b ) using a conductive layer, such as relocation wiring layers ( 205 ) are provided just above or in the neighborhood of terminals...
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7550762 |
Isolation circuit
An isolation circuit includes a first pad adapted to receive a control signal and a second pad adapted to receive another signal. A third pad is coupled to a microelectronic die and a device is...
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7550382 |
Manufacturing method of semiconductor device, evaluation method of semiconductor device, and semiconductor device
A semiconductor element formed over the same substrate as a TFT, includes a semiconductor film having an impurity region; an insulating film formed over the semiconductor film; an electrode divided...
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7549097 |
Semiconductor integrated circuit device and method of testing the same
Functional circuits such as a processor, an SRAM, a DRAM and a flash-EEPROM are mounted on a semiconductor chip. Of these functional circuits, for example, the flash-EEPROM which fluctuates a...
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7541815 |
Electronic device, testing apparatus, and testing method
A testing apparatus tests the performance of an electronic device having an operation circuit for providing a useful output signal. A demodulator configured to provide a phase or frequency...
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7541613 |
Methods for reducing within chip device parameter variations
A method of reducing parametric variation in an integrated circuit (IC) chip and an IC chip with reduced parametric variation. The method includes: on a first wafer having a first arrangement of...
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7541612 |
Multi-chip package semiconductor device and method of detecting a failure thereof
A semiconductor chip may include at least one power supply pad for receiving an external power voltage, at least one input/output pad, an internal function block that may be configured to operate...
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7541611 |
Apparatus using Manhattan geometry having non-Manhattan current flow
A device is described, including a first diffusion region having a first terminal, a second diffusion region having a second terminal, and a channel region disposed between the first diffusion...
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7538346 |
Semiconductor device
A semiconductor device is disclosed. The device includes a substrate and a first wiring layer overlying the substrate. The first wiring layer comprises a first wiring area surrounded by a first...
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7538345 |
Inspection method of contact failure of semiconductor device and semiconductor device to which inspection method is applied
A substrate inspection method includes forming, along a route extending from a peripheral portion to a central portion of an inspection area, a conducting path built up by combining a plurality of...
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7538344 |
Overlay and CD process window structure
The present invention provides photolithographic device and method for photolithography process window. The photolithography device comprises a substrate; and a pattern layer having radiant energy...
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7535021 |
Calibration technique for measuring gate resistance of power MOS gate device at water level
This invention discloses a method for calibrating a gate resistance measurement of a semiconductor power device that includes a step of forming a RC network on a test area on a semiconductor wafer...
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7535020 |
Systems and methods for thermal sensing
Systems and methods for positioning thermal sensors within an integrated circuit in a manner that provides useful thermal measurements corresponding to different parts of the integrated circuit. In...
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7528491 |
Semiconductor components and assemblies including vias of varying lateral dimensions
Methods for forming vias are disclosed. The methods include providing a substrate having a first surface and an opposing, second surface. A first opening, a second opening, and a third opening are...
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7527987 |
Fast localization of electrical failures on an integrated circuit system and method
Fast localization of electrically measured defects of integrated circuits includes providing information for fabricating a test chip having test structures configured for parallel electrical...
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7525118 |
Test element group, method of manufacturing a test element group, method of testing a semiconductor device, and semiconductor device
To provide a TEG capable of early stage feedback of testing contents and a method of testing using the TEG. TFTs for TEG are manufactured on a different substrate than actual panel TFTs by using...
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