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7612441 |
Image-sensing chip package module adapted to dual-side soldering
An image-sensing chip package module adapted to dual-side soldering includes three substrates, an image-sensing chip and a filter lens. The three substrates are stacked together by pressing (using...
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7612385 |
High power light-emitting diode package comprising substrate having beacon
Disclosed herein is a package structure including at least one high power light-emitting diode to exhibit excellent heat release properties. In the package structure, a light-emitting diode chip...
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7612333 |
Imaging apparatus and photoelectric conversion element package retaining unit
A photoelectric conversion element package retaining unit includes a photoelectric conversion element package having electrodes formed on a rear surface of a light-receiving surface, a printed...
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7608816 |
Light receiving module incorporating shield cover
A light receiving module includes a substrate, a light receiving element mounted on the substrate, a resin package covering the light receiving element, and a shield cover into which the resin...
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7599001 |
Image capture apparatus and electronic apparatus
An image capture apparatus includes a sensor unit having a photoelectric conversion element; a holding member having a first portion for holding an optical element, and a second portion extending...
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7598582 |
Ultra low dark current pin photodetector
A photodetector and a method for fabricating a photodetector. The photodetector may include a substrate, a buffer layer formed on the substrate, and an absorption layer formed on the buffer layer...
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7598580 |
Image sensor module package structure with supporting element
An image sensor module package structure with a supporting element comprises a chip, the supporting element and a light-transmitting element. The chip has light-sensing elements arranged on a...
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7598125 |
Method for wafer level packaging and fabricating cap structures
A cap wafer with cavities is etched through areas not covered by a patterned photoresist to form a plurality of openings. The cap wafer is bonded to a transparent wafer at the surface having the...
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7595540 |
Semiconductor device and method of manufacturing the same
A semiconductor device including a package ( 2 ) having a plurality of wall portions ( 9 a ) and a plurality of conductor portions ( 4 ), a semiconductor element such as a solid-state image pickup...
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7592681 |
Solid-state imaging apparatus
A solid-state imaging apparatus including: a solid-state imaging device chip having an electrode pad provided on its front face; and a flexible board having a connecting electrode formed on an end...
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7592631 |
LED package frame and LED package having the same
An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted...
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7592536 |
Solar cell structure with integrated discrete by-pass diode
A solar cell structure has a solar cell unit structure including a heat sink, and a solar cell having a front side, a back side, and a solar-cell projected area coverage on the heat sink. The solar...
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7589388 |
Semiconductor device and method of manufacturing the same
The invention is directed to providing a package type semiconductor device with high reliability and smaller size and a method of manufacturing the same. A semiconductor substrate formed with a...
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7583862 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
A microelectronic imager having an imaging unit and an optics unit attached to the imaging unit, and methods for packaging microelectronic imagers. In one embodiment, the imaging unit can include a...
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7582954 |
Optical leadless leadframe package
Apparatuses and methods directed to a semiconductor chip package having an optical component are disclosed. Packages include a die having a light sensing region and a stress buffer on a first...
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7576402 |
Semiconductor device, method of manufacturing the same, and camera module
The invention provides a package type semiconductor device and a method of manufacturing the same where reliability and yield are enhanced without making a manufacturing process complex. A resin...
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7576401 |
Direct glass attached on die optical module
An optical module includes an image sensor having an active area and a window mounted directly to the image sensor above the active area. The optical module further includes a mount mounted to the...
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7572665 |
Microelectronics grade metal substrate, related metal-embedded devices and methods for fabricating same
Fabricating a microelectronics grade metal substrate comprises forming the metal substrate on a sacrificial substrate. An adhesion layer can be deposited on or over the surface of the sacrificial...
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7566965 |
Semiconductor module
An image sensor module is composed of a base, a CCD image sensor, a glass plate, and a frame-shaped moisture permeable member. The base has a depressed chip chamber, in which the CCD image sensor...
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7566854 |
Image sensor module
The present invention provides an image sensor module. The image sensor module has a die formed on a substrate, the die having a micro lens area, a lens holder formed on the substrate and over the...
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7564125 |
Electronic array and methods for fabricating same
A sensor array includes a substrate including a front side and a back side, a plurality of transducers fabricated on the front side of the substrate, a plurality of input/output connections...
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7564112 |
Semiconductor device, radiographic imaging apparatus, and method for manufacturing the same
A semiconductor device or a radiographic imaging apparatus includes a substrate and a supporting member, the substrate having a semiconductor element or a conversion element and being bonded to the...
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7564111 |
Imaging apparatus
In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible...
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7560743 |
Electro-optical device, method of manufacturing the same, and image forming apparatus
An electro-optical device in which a plurality of light-emitting elements including a first electrode layer, a second electrode layer, and a light-emitting functional layer emitting light in...
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7550831 |
Electronic device and semiconductor device
An electronic device has a substrate, a conductive layer and a substrate mounted portion. The substrate has a circuit portion used from 60 GHz to 80 GHz. The conductive layer is provided directly...
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7550812 |
Camera module and method of fabricating the same
Example embodiments may provide a camera module including a high-resolution lens member and/or an image sensor chip that may be integrally formed, and a method of fabricating a camera module....
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7550778 |
System and method for providing access to an encapsulated device
A method for providing access to a feature on a device wafer, and located outside an encapsulation region is described. The method includes forming a cavity in the lid wafer, aligning the lid wafer...
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7547955 |
Semiconductor imaging device and method for manufacturing the same
A semiconductor imaging device includes: a semiconductor imaging element including an imaging region, a peripheral circuit region, and an electrode region, the imaging region including a plurality...
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7547583 |
Light emitting diode package with direct leadframe heat dissipation
A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has...
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7544884 |
Manufacturing method for large-scale production of thin-film solar cells
A method of manufacturing improved thin-film solar cells entirely by sputtering includes a high efficiency back contact/reflecting multi-layer containing at least one barrier layer consisting of a...
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7541669 |
Semiconductor device package with base features to reduce leakage
A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of...
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7541658 |
Optically interactive device package array
An image sensor package and methods for simultaneously fabricating a plurality of such packages. A layer of barrier material comprising a matrix of raised walls is formed around chip attachment...
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7538311 |
Image sensor and digital camera
The present invention provides an image sensor that includes a plurality of light-receiving elements and a charge output component. The plurality of light-receiving elements are disposed inside the...
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7535097 |
Semiconductor device and method of manufacturing the same
A semiconductor device includes a semiconductor chip having at least an electrode pad and a device formed on a semiconductor layer on its surface, a seal cap having a recess portion facing the...
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7534635 |
Getter precursors for hermetically sealed packaging
Hermetically sealed packages include a getter precursor disposed within an interior region of the package. The getter precursor includes a cation portion and a non-oxidizing anion portion, which is...
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7531844 |
Light emitting element
A light emitting element includes: a box-shaped case formed by an insulation material and having a space inside; a lead frame formed by a conductive material and fixed to the case; and a light...
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7531842 |
Method for etching a tapered bore in a silicon substrate, and a semiconductor wafer comprising the substrate
A semiconductor wafer comprises an SOI comprising a device layer on an oxide layer supported on a handle layer. Micro-mirrors are formed in the device layer, and access bores extend through the...
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7531375 |
Solid image-pickup device and method for manufacturing the solid image pickup device
It is an object of the invention to provide an improved solid image-pickup device which is compact in size and low in production cost. The solid image-pickup device is so formed that its...
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7528422 |
Package for a light emitting element with integrated electrostatic discharge protection
A package includes a substrate with a recess in which a light emitting element is mounted. A surface of the substrate forms an exterior surface of the package. A lid may be attached to the...
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7528420 |
Image sensing devices and methods for fabricating the same
Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device includes a first substrate having a first side and a second side opposing each other. A...
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7528415 |
Semiconductor laser
A semiconductor laser improved in heat sinkability of portions in the vicinity of a light-emitting end face of a main body in order to prevent occurrence of COD is provided. A main body 150 ...
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7527990 |
Solid state imaging device and producing method thereof
A semiconductor substrate of a solid state imaging device is connected to a cover glass, and then a backgrind is performed so as to make the thickness smaller. On a first face of the semiconductor...
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7521770 |
Image capturing device
An image capturing device includes an image sensor package and a lens module aligned with the image sensor package. The image sensor package includes a substrate, at least one passive component, an...
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7520679 |
Optical device package with turning mirror and alignment post
An optoelectronic package or sub-assembly includes an edge-emitting laser and a reflector that directs a beam from the laser through a sub-mount. The sub-mount contains passive or active circuit...
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7518206 |
Semiconductor device with a photoelectric converting portion and a light-shading means
The semiconductor device according to this invention is characterized by a package structure of a semiconductor substrate 100 equipped with a photoelectric converting portion, wherein a...
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7518205 |
Semiconductor package and method for manufacturing the same
A semiconductor package has a substrate made of WCu, WAg, MoCu or MoAg. A plurality of leads are fixed to the substrate by hermetic sealing without an intervening nickel plating layer. A cover is...
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7514666 |
Composite receiver assembly having a circuit board on which multiple receiver devices that operate on different sets of wavelengths are mounted
Multiple devices that operate at different wavelengths of light are incorporated into a single composite assembly to reduce the amount of space that is needed to incorporate the assembly into a...
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7511261 |
Image sensor module structure with lens holder having vertical inner and outer sidewalls
An image sensor module structure includes a substrate, a photosensitive chip, a lens holder, and a lens barrel. The substrate has an upper surface on which first electrodes are formed, and a lower...
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7508044 |
End face sensor and method of producing the same
An end face sensor device and a method of producing the sensor device, where the sensor device has flexibility or bendability independent of its shape and is suitable for constructing various...
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7508002 |
Surface-mountable light-emitting diode structural element
A surface-mountable light emitting diode structural element in which an optoelectronic chip is attached to a chip carrier part of a lead frame, is described. The lead frame has a connection part...
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