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7619315 |
Stack type semiconductor chip package having different type of chips and fabrication method thereof
A stack type semiconductor chip package includes a first wafer mold, a protection substrate, and a second wafer mold that are stacked in a wafer level process. The first wafer mold includes a first...
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7616250 |
Image capturing device
An image capturing device is disclosed that includes a light receiving element having a light receiving surface, a plate-like transparent member provided on the light receiving surface of the light...
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7615837 |
Lithography device for semiconductor circuit pattern generation
General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and...
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7612441 |
Image-sensing chip package module adapted to dual-side soldering
An image-sensing chip package module adapted to dual-side soldering includes three substrates, an image-sensing chip and a filter lens. The three substrates are stacked together by pressing (using...
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7612385 |
High power light-emitting diode package comprising substrate having beacon
Disclosed herein is a package structure including at least one high power light-emitting diode to exhibit excellent heat release properties. In the package structure, a light-emitting diode chip...
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7612333 |
Imaging apparatus and photoelectric conversion element package retaining unit
A photoelectric conversion element package retaining unit includes a photoelectric conversion element package having electrodes formed on a rear surface of a light-receiving surface, a printed...
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7608816 |
Light receiving module incorporating shield cover
A light receiving module includes a substrate, a light receiving element mounted on the substrate, a resin package covering the light receiving element, and a shield cover into which the resin...
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7599001 |
Image capture apparatus and electronic apparatus
An image capture apparatus includes a sensor unit having a photoelectric conversion element; a holding member having a first portion for holding an optical element, and a second portion extending...
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7598582 |
Ultra low dark current pin photodetector
A photodetector and a method for fabricating a photodetector. The photodetector may include a substrate, a buffer layer formed on the substrate, and an absorption layer formed on the buffer layer...
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7598580 |
Image sensor module package structure with supporting element
An image sensor module package structure with a supporting element comprises a chip, the supporting element and a light-transmitting element. The chip has light-sensing elements arranged on a...
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7598125 |
Method for wafer level packaging and fabricating cap structures
A cap wafer with cavities is etched through areas not covered by a patterned photoresist to form a plurality of openings. The cap wafer is bonded to a transparent wafer at the surface having the...
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7595540 |
Semiconductor device and method of manufacturing the same
A semiconductor device including a package ( 2 ) having a plurality of wall portions ( 9 a ) and a plurality of conductor portions ( 4 ), a semiconductor element such as a solid-state image pickup...
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7592681 |
Solid-state imaging apparatus
A solid-state imaging apparatus including: a solid-state imaging device chip having an electrode pad provided on its front face; and a flexible board having a connecting electrode formed on an end...
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7592631 |
LED package frame and LED package having the same
An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted...
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7592536 |
Solar cell structure with integrated discrete by-pass diode
A solar cell structure has a solar cell unit structure including a heat sink, and a solar cell having a front side, a back side, and a solar-cell projected area coverage on the heat sink. The solar...
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7589388 |
Semiconductor device and method of manufacturing the same
The invention is directed to providing a package type semiconductor device with high reliability and smaller size and a method of manufacturing the same. A semiconductor substrate formed with a...
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7583862 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
A microelectronic imager having an imaging unit and an optics unit attached to the imaging unit, and methods for packaging microelectronic imagers. In one embodiment, the imaging unit can include a...
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7582954 |
Optical leadless leadframe package
Apparatuses and methods directed to a semiconductor chip package having an optical component are disclosed. Packages include a die having a light sensing region and a stress buffer on a first...
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7576402 |
Semiconductor device, method of manufacturing the same, and camera module
The invention provides a package type semiconductor device and a method of manufacturing the same where reliability and yield are enhanced without making a manufacturing process complex. A resin...
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7576401 |
Direct glass attached on die optical module
An optical module includes an image sensor having an active area and a window mounted directly to the image sensor above the active area. The optical module further includes a mount mounted to the...
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7572665 |
Microelectronics grade metal substrate, related metal-embedded devices and methods for fabricating same
Fabricating a microelectronics grade metal substrate comprises forming the metal substrate on a sacrificial substrate. An adhesion layer can be deposited on or over the surface of the sacrificial...
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7566965 |
Semiconductor module
An image sensor module is composed of a base, a CCD image sensor, a glass plate, and a frame-shaped moisture permeable member. The base has a depressed chip chamber, in which the CCD image sensor...
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7566854 |
Image sensor module
The present invention provides an image sensor module. The image sensor module has a die formed on a substrate, the die having a micro lens area, a lens holder formed on the substrate and over the...
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7564125 |
Electronic array and methods for fabricating same
A sensor array includes a substrate including a front side and a back side, a plurality of transducers fabricated on the front side of the substrate, a plurality of input/output connections...
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7564112 |
Semiconductor device, radiographic imaging apparatus, and method for manufacturing the same
A semiconductor device or a radiographic imaging apparatus includes a substrate and a supporting member, the substrate having a semiconductor element or a conversion element and being bonded to the...
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7564111 |
Imaging apparatus
In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible...
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7560743 |
Electro-optical device, method of manufacturing the same, and image forming apparatus
An electro-optical device in which a plurality of light-emitting elements including a first electrode layer, a second electrode layer, and a light-emitting functional layer emitting light in...
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7550831 |
Electronic device and semiconductor device
An electronic device has a substrate, a conductive layer and a substrate mounted portion. The substrate has a circuit portion used from 60 GHz to 80 GHz. The conductive layer is provided directly...
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7550812 |
Camera module and method of fabricating the same
Example embodiments may provide a camera module including a high-resolution lens member and/or an image sensor chip that may be integrally formed, and a method of fabricating a camera module....
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7550778 |
System and method for providing access to an encapsulated device
A method for providing access to a feature on a device wafer, and located outside an encapsulation region is described. The method includes forming a cavity in the lid wafer, aligning the lid wafer...
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7547955 |
Semiconductor imaging device and method for manufacturing the same
A semiconductor imaging device includes: a semiconductor imaging element including an imaging region, a peripheral circuit region, and an electrode region, the imaging region including a plurality...
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7547583 |
Light emitting diode package with direct leadframe heat dissipation
A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has...
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7544884 |
Manufacturing method for large-scale production of thin-film solar cells
A method of manufacturing improved thin-film solar cells entirely by sputtering includes a high efficiency back contact/reflecting multi-layer containing at least one barrier layer consisting of a...
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7541669 |
Semiconductor device package with base features to reduce leakage
A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of...
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7541658 |
Optically interactive device package array
An image sensor package and methods for simultaneously fabricating a plurality of such packages. A layer of barrier material comprising a matrix of raised walls is formed around chip attachment...
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7538311 |
Image sensor and digital camera
The present invention provides an image sensor that includes a plurality of light-receiving elements and a charge output component. The plurality of light-receiving elements are disposed inside the...
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7535097 |
Semiconductor device and method of manufacturing the same
A semiconductor device includes a semiconductor chip having at least an electrode pad and a device formed on a semiconductor layer on its surface, a seal cap having a recess portion facing the...
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7534635 |
Getter precursors for hermetically sealed packaging
Hermetically sealed packages include a getter precursor disposed within an interior region of the package. The getter precursor includes a cation portion and a non-oxidizing anion portion, which is...
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7531844 |
Light emitting element
A light emitting element includes: a box-shaped case formed by an insulation material and having a space inside; a lead frame formed by a conductive material and fixed to the case; and a light...
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7531842 |
Method for etching a tapered bore in a silicon substrate, and a semiconductor wafer comprising the substrate
A semiconductor wafer comprises an SOI comprising a device layer on an oxide layer supported on a handle layer. Micro-mirrors are formed in the device layer, and access bores extend through the...
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7531375 |
Solid image-pickup device and method for manufacturing the solid image pickup device
It is an object of the invention to provide an improved solid image-pickup device which is compact in size and low in production cost. The solid image-pickup device is so formed that its...
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7528422 |
Package for a light emitting element with integrated electrostatic discharge protection
A package includes a substrate with a recess in which a light emitting element is mounted. A surface of the substrate forms an exterior surface of the package. A lid may be attached to the...
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7528420 |
Image sensing devices and methods for fabricating the same
Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device includes a first substrate having a first side and a second side opposing each other. A...
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7528415 |
Semiconductor laser
A semiconductor laser improved in heat sinkability of portions in the vicinity of a light-emitting end face of a main body in order to prevent occurrence of COD is provided. A main body 150 ...
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7527990 |
Solid state imaging device and producing method thereof
A semiconductor substrate of a solid state imaging device is connected to a cover glass, and then a backgrind is performed so as to make the thickness smaller. On a first face of the semiconductor...
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7521770 |
Image capturing device
An image capturing device includes an image sensor package and a lens module aligned with the image sensor package. The image sensor package includes a substrate, at least one passive component, an...
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7520679 |
Optical device package with turning mirror and alignment post
An optoelectronic package or sub-assembly includes an edge-emitting laser and a reflector that directs a beam from the laser through a sub-mount. The sub-mount contains passive or active circuit...
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7518206 |
Semiconductor device with a photoelectric converting portion and a light-shading means
The semiconductor device according to this invention is characterized by a package structure of a semiconductor substrate 100 equipped with a photoelectric converting portion, wherein a...
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7518205 |
Semiconductor package and method for manufacturing the same
A semiconductor package has a substrate made of WCu, WAg, MoCu or MoAg. A plurality of leads are fixed to the substrate by hermetic sealing without an intervening nickel plating layer. A cover is...
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7514666 |
Composite receiver assembly having a circuit board on which multiple receiver devices that operate on different sets of wavelengths are mounted
Multiple devices that operate at different wavelengths of light are incorporated into a single composite assembly to reduce the amount of space that is needed to incorporate the assembly into a...
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