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6730841 |
Method and apparatus for mounting a photovoltaic roofing material
A web of photovoltaic roofing material exhibited by an elongated, substantially thin, and flexible web including a central photovoltaic area encapsulated within a polymeric material, the polymeric...
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6730935 |
Anti-penetration structure of EL device
An anti-penetration structure of EL device includes a transparent substrate, a front electrode layer, a lighting layer, an inducing layer, a back electrode layer and an insulating packaging layer...
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6727431 |
Optical module, circuit board and electronic device
An optical chip having an optical section and an electrode is formed above a substrate. The optical chip is surrounded by a body. The optical section is sealed by a first seal section. An...
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6724061 |
Optical device and method of manufacture thereof, and electronic instrument
The invention provides an optical device having an optical element, a substrate, and a flexible member. A first portion of the flexible member is disposed so as to be spaced from the substrate, a...
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6720581 |
Mounting plate for a laser chip in a semiconductor laser device
A method of manufacturing a semiconductor laser device includes the steps of: providing a laser chip, in which a semiconductor layer is formed on a substrate, a supporting plate which supports the...
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6713868 |
Semiconductor device having leadless package structure
A semiconductor device according to one embodiment includes a substrate, a semiconductor chip arranged on the substrate, a first electrode formed in the substrate and connected to the semiconductor...
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6713788 |
Opto-electric mounting apparatus
An integrated circuit is provided with one or more connectors which allow an opto-electric device to be mounted on the integrated circuit directly on top of or underneath of it. Multiple...
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6707124 |
HID land grid array packaged device having electrical and optical interconnects
A high density interconnect device which creates a thin, electrically and thermally high performance package for semiconductor devices having a mechanically stable and high thermal conductivity...
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6706960 |
Coating material and photovoltaic element
The present invention provides a coating material that resin-coats a light-receiving plane side of a photovoltaic element, and which can increase a conversion efficiency by effectively using light...
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6707161 |
Optical module package of flip chip bonding
A flip-chip-bonded optical module package using flip chip bonding is provided. The flip-chip-bonded optical module package includes an optical device chip which has an input/output pad formed on a...
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6707069 |
Light emission diode package
An LED package, made of ceramic substrates and having a reflective metal plate, has a first ceramic substrate, which has a chip mounting area on its top surface, and is provided with a...
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6703598 |
Semiconductor photo-detecting apparatus
A semiconductor photodetecting apparatus 1 comprises a base 2 and a CCD chip 4 . The CCD chip 4 is secured to the base 2 when a resin 8 is supplied and cured. The base 2 is formed with...
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6700136 |
Light emitting device package
A light emitting device (LED) package comprises: a thermally conductive layer; an electrically insulating layer having openings extending therethrough; LEDs situated within the openings of the...
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6700055 |
Self tracking, wide angle, solar concentrators
A solar concentrator system includes a collector lens for collecting and at least partially focusing incident solar rays, a solar cell and a lens array positioned generally between the collector...
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6696738 |
Miniaturized image sensor
An image sensor includes a substrate, a frame layer, a photosensitive chip and a transparent layer. The substrate is composed of spaced metal sheets. Each metal sheet includes a first board, a...
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6696636 |
By-pass rectifier element and terminal housing for solar battery modules using a by-pass rectifier element
A by-pass diode includes a first lead plate and a second lead plate respectively arranged on the top face and the bottom face of a rectifier laminate and extending therefrom in opposite directions...
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6693336 |
Intergrated circuit chip package with reduced parameter offsets
A semiconductor encapsulated package is provided with buffer chambers established through external openings aligned with stress sensitive circuitry sites, wherein the viscosity of the encapsulating...
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6693237 |
Sealing composition for sealing solar cell, and solar cell module and building material-integral type solar cell module using said composition
The present invention relates to a solar cell module and a building-integrated solar cell module having a sealing composition made of a polymer blend or a polymer alloy. The blend or alloy is made...
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6686580 |
Image sensor package with reflector
An image sensor package includes a substrate and an image sensor coupled to the substrate. The image sensor includes an upper surface having an active area. A reflector lid is coupled to the...
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6686609 |
Package structure of surface mounting led and method of manufacturing the same
This specification discloses a package structure of surface mounting light emitting diodes (LEDs) and the method of manufacturing the same. The package of the surface mounting LEDs is achieved by...
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6674143 |
Hermetically sealing package for optical semiconductor and optical semiconductor module
A hermetically sealing package for an optical semiconductor equipped with a light transmitting window whose light transmitting surface is inclined at least six degrees from the vertical line of the...
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6674159 |
Bi-level microelectronic device package with an integral window
A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed...
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6670541 |
Solar battery, solar generating apparatus, and building
When a plurality of solar battery modules are to be connected, terminals formed on the rear surfaces of these solar battery modules are connected by electric wires. This wiring is very cumbersome...
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6664573 |
Avalanche photodiode
An avalanche photodiode capable of generating a minimal surface leakage current as well as achieving a uniform electrical field. The avalanche photodiode includes a semiconductor substrate provided...
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6665016 |
Mounting structure of a solid-state image pick-up device
A mounting structure includes a fixing plate to which an image pick-up device is fixed; screw holes formed on a supporting member; a first female threaded portion and a second female threaded...
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6660930 |
Solar cell modules with improved backskin
A laminated solar cell module comprises a front light transmitting support, a plurality of interconnected solar cells encapsulated by a light-transmitting encapsulant material, and an improved...
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6660929 |
Electrical power module and system
Light sources are mounted within a light-proof enclosure in which photovoltaic panels are mounted to produce electrical power irrespective of weather conditions outside the enclosure.
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6652904 |
Methods to manufacture single cell and multi-cell regenerative photoelectrochemical devices
The present invention relates to manufacturing of regenerative photovolatic photoelectrochemical (RPEC) devices. The invention describes a method for manufacturing RPEC devices in a production...
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6649991 |
Image sensor semiconductor package
A non-ceramic image sensor semiconductor package with improved moisture resistance, lower cost, higher reliability, and lower profile is provided. A semiconductor chip with a vision chip active...
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6646316 |
Package structure of an image sensor and packaging
A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image...
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6635941 |
Structure of semiconductor device with improved reliability
A semiconductor device formed by cutting a first substrate and a second substrate bonded together by a spacer, wherein: the spacer is disposed at an end of the first substrate after cutting; the...
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6627864 |
Thin image sensor package
A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The...
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6628339 |
Image sensor mount for a digital camera
In a digital camera having an image sensor and a lens defining an optical axis for focusing an image upon a focal plane, an image sensor mount includes the digital camera having a housing for...
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6624351 |
Folding photovoltaic strip device
A folding photovoltaic strip device is provided comprising a plurality of photovoltaic modules joined to form a strip and pleated by flexible, transverse creases so that the device may be stored...
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6624447 |
Low skew signal distribution for integrated circuits
An integrated circuit device ( 10 ) comprises a semiconductor die ( 14 ) and an optical signal emitting diode ( 18 ) for communicating an optical signal, such as a clock or trigger signal, to...
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6613980 |
Environmental protection for an optical assembly and method therefor
A package for an optical assembly of a type that uses bulk optics in an optical path will require environmental protection from contaminants. It is common to construct a substantially hermetically...
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6611064 |
Semiconductor device and method for manufacturing the same
In the present invention, provided are a semiconductor device having a semiconductor-element-mounting substrate on which a semiconductor element has been mounted via an adhesive having an...
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6608725 |
Optical module
An optical module, in which an optical device can be mounted and repaired without damaging an electrode on an electronic device side, is provided. A photodiode ( 1 ) and a pre-amplifier IC ( 2 )...
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6590152 |
Electromagnetic shield cap and infrared data communication module
An electromagnetic shield cap ( 3 ) includes a projection ( 34 ) which is pressed against an electronic component ( 1 ) with an elastic force when the cap is mounted to the electronic component ( 1...
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6583401 |
Optoelectronic component with a conductor strip element
A further miniaturization of known optoelectronic components with internal screening is not possible. In addition, inhomogeneities occur in the embedding material. Separate screening plates cause...
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6583349 |
Solar energy converter using a solar cell in a shallow liquid layer
Solar cells operating in liquid have an increased operating efficiency resulting from two independent physical phenomena, an increase in output current from the solar cells from simply wetting the...
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6583481 |
Electrostatic-erasing abrasion-proof coating and method for forming the same
An abrasion-proof and static-erasing coating is formed on the contact surface of a contact image sensor. The coating comprises a first film having a high hardness and a low conductivity, a second...
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6583444 |
Semiconductor packages having light-sensitive chips
A method of making a microelectronic package includes providing a sacrificial layer having a first surface and providing an optoelectronic element having a front face including one or more contacts...
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6583419 |
Solid state radiation detector with enhanced life duration
A solid state photosensitive detector including a solid state photosensitive sensor associated with a converter designed to convert radiation to be detected into radiation to which the...
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6579737 |
Optical semiconductor module, its manufacture, reflection film, its manufacture, and laser and optical devices using reflection film
An optical semiconductor element and an optical element having an optical coupling facet are disposed on a support surface of a platform. The optical element is optically coupled to the optical...
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6570084 |
Pressure equalizing photovoltaic assembly and method
Each PV assembly of an array of PV assemblies comprises a base, a PV module and a support assembly securing the PV module to a position overlying the upper surface of the base. Vents are formed...
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6566745 |
Image sensor ball grid array package and the fabrication thereof
The present invention is related to an image sensor packaging technique based on a Ball Grid Array (BGA) IC packaging technique, further referred to as image sensor ball grid array (ISBGA). A...
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6561666 |
Organic electroluminescent (EL) device
An organic electroluminescent (EL) device includes a first electrode, a second electrode, an electroluminescent (EL) light-emitting layer, and a printed circuit board. The first electrode is formed...
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6559512 |
Adjustable in-line leads for light emitting device package
The leads of a light emitting device package are extended is flexible pins. These pins can be bent with respect to a motherboard so that the direction of the light entitled from the light emitting...
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6555904 |
Electrically shielded glass lid for a packaged device
A packaged device includes a package substrate and a plurality of optical structures formed on a semiconductive substrate and positioned on the package substrate, forming an active area. The...
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