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6072115 |
Solar cell module and solar cell integrated cladding assembly
A jacket material of electrical conductive leads for electrically connecting solar cell modules to each other is comprised of a polyvinyl chloride type resin containing either one of a polyester...
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6069405 |
High capacitance mirror driver cell
A high capacitance mirror driver cell provides reduced photocurrent leakage and includes a metal 1 layer comprising integrated circuit elements and a metal 2 layer comprising additional integrated...
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6066797 |
Solar cell module
The object of this invention is to provide a solar cell module having a terminal extracting structure for it, with high adhesion workability, high productivity, and high reliability. The solution...
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6057569 |
Diode limiter device
The present invention provides a diode limiter device in which a first penetration hole is formed on a wall surface of an H surface; the PIN diode is supported by the PIN diode mounting side of the...
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6051848 |
Optical device packages containing an optical transmitter die
An optical device package (18) includes an optical transmitter die (10) encapsulated within mold material (20). The mold material (20) allows light emitted from the optical transmitter (10) to pass...
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6043508 |
Photodetector involving a MOSFET having a floating gate
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6043545 |
MOSFET device with two spacers
A MOSFET device protects the device from the short channel effect and decrease the resistance of a gate of the device. The MOSFET device includes a gate formed on a substrate and two source/drain...
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6040612 |
Image pickup apparatus for endoscope having reduced diameter
An image pickup apparatus or method of the present invention decreases the diameter of an image pickup device assembly by decreasing the thickness of the assembly. A conductor lead (inner lead of...
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6037641 |
Optical device package including an aligned lens
An optical device package. The optical device package includes a first substrate. The first substrate includes a light sensitive electronic device and several solder bumps. The electronic devices...
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6037642 |
Radiation sensitive transducer wherein deformation due to temperature fluctuations is avoided
A radiation-sensitive transducer with a doped semiconductor sensor is to be constructed on a mounting plate such that it does not deform during temperature fluctuations. On the back side of the...
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6034424 |
Package and optoelectronic device
A low-capacitance package having a wide hole, an L-shaped lead pin, other linear lead pins, an insulating material filling in the hole for fixing the L-shaped lead pin and another pin in the hole....
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6031253 |
Package for housing photosemiconductor device
A package for housing a photosemiconductor device includes: a substrate having a mounting portion for mounting a photosemiconductor device thereon; a frame attached onto the substrate so as to...
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6025555 |
Solar cell module and method for manufacturing the same
In a solar cell module in which a solar cell element is mounted on a four-sided metal plate, two opposite sides of the metal plate are bent, and a reinforcement member is provided on at least one...
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6020646 |
Intergrated circuit die assembly
An integrated circuit (IC) die carrier assembly includes a thinned IC die mounted to a substrate or carrier. The IC die is mounted to the carrier via a thin layer of glass. The carrier facilitates...
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6015951 |
Photoelectric transfer device
This invention relates to a photoelectric transfer device which comprises a photoelectric transfer element, a cholesteric liquid crystal layer and an ultraviolet cut-off layer, said cholesteric...
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6013871 |
Method of preparing a photovoltaic device
A method of creating a photovoltaic device for the conversion of light to electrical current comprises the steps of: (a) providing a layer of glue on a substrate; (b) laying down one or more...
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6011215 |
Point contact photovoltaic module and method for its manufacture
A large area photovoltaic device includes a plurality of photovoltaic regions electrically interconnected in parallel. The regions are defined by a plurality of conductive channels which establish...
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6005276 |
Solid state photodetector with light-responsive rear face
A semiconductor photodiode is configured to have its rear face light responsive with electrical contacts formed on the front face. The photodiode can be surface mounted, such as by solder, upon a...
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5998878 |
Image sensor assembly and packaging method
An image sensor assembly is mounted in an optical system having a plurality of reference locators. The image sensor assembly includes an image sensing device having photolithographically generated...
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5990505 |
Solid-state image pickup device
A highly reliable solid-state image pickup device with one- or two-dimensionally arranged connecting portions, capable of avoiding corrosion of wirings resulting from chipping of the substrates and...
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5986317 |
Optical semiconductor device having plural encapsulating layers
A data access arrangement (DAA) that includes a substrate and an optically-active component disposed on the substrate. The component is encapsulated with a radiation-transmissive material to form...
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5986203 |
Solar cell roof tile and method of forming same
A solar cell roof tile includes a front support layer, a transparent encapsulant layer, a plurality of interconnected solar cells and a backskin layer. The front support layer is formed of light...
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5973337 |
Ball grid device with optically transmissive coating
A semiconductor device (10) coupled to ball grid array substrate (11) and encapsulated by an optically transmissive material (29, 31). The ball grid array substrate (11) has conductive...
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5949655 |
Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device
A mounting for a flip chip integrated circuit device having a light sensitive cell is disclosed. The mounting includes an insulating substrate having an aperture between its first and second...
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5936263 |
Wear-resistant optical coupling module
An optical module having a simple construction and excellent wear resistance that can be manufactured at low cost and high accuracy, and a method of manufacturing the same. The optical module has...
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5932875 |
Single piece integrated package and optical lid
A lid for protecting and covering an integrated circuit provided in a chip-on-board package is disclosed. The lid has a wall surrounding the integrated circuit, and a top cover covering the...
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5929518 |
Circuit board and method
A circuit board (10, 50, 70) and method transport a conduction medium (75) through the circuit board for operating a semiconductor device (16, 60, 77, 79) supported on a surface (15, 62, 82) of the...
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5925898 |
Optoelectronic transducer and production methods
An optoelectronic transducer configuration has a radiation-emitting and/or receiving semiconductor component fastened to a carrier plate in such a way that its beam exit/entry face is directed...
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5907178 |
Multi-view imaging apparatus
An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor...
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5894172 |
Semiconductor device with identification function
A bare chip (1) is rectangular, and has a front surface (1a) on the center of which semiconductor elements are integrated and a back surface. Notches (2) are formed on a side of the bare chip (1)...
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5883386 |
Light-receiving apparatus having a position detectable portion on a sealing frame and its manufacturing method
A light-receiving apparatus comprises a light-receiving device positioned relative to an external component with increased accuracy. A sealing frame is mounted on a printed circuit board. One...
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5877517 |
Thin film actuated mirror array in an optical projection system
Thin film AMA in an optical projection system and a method for manufacturing the same are disclosed. The thin film AMA has a substrate having an electrical wiring and a connecting terminal, a...
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5867368 |
Mounting for a semiconductor integrated circuit device
A mounting for a semiconductor integrated circuit device, such as a charge coupled device ("CCD") or an erasable programmable read only memory device ("EPROM"), includes an insulating substrate...
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5861637 |
Surface-mounted module which permits the light output of an optical semiconductor device mounted thereon to be increased, and a method of producing the surface-mounted module
A surface-mounted module (1) having an optical semiconductor device (5) and an optical fiber (6) mounted on a substrate (2) and a method of producing the surface mounted-module. The substrate (2)...
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5861654 |
Image sensor assembly
An image sensor assembly is mounted in an optical system having a plurality of reference locators. The image sensor assembly includes an image sensing device having photolithographically generated...
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5856699 |
Photoelectric conversion apparatus with level photoreceiving surface
In a photoelectric conversion apparatus obtained by arranging and fixing a plurality of semiconductor element substrates onto a base with an adhesive, the levels of the upper surfaces of the...
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5841565 |
Semiconductor device, light-receiving module and method for manufacturing same
It is an object of the invention to provide a light-receiving module, in which characteristic of a semiconductor amplifier unit mounted thereon is inspected on the course of fabrication and an...
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5841178 |
Optical component package
Disclosed is an optical package which is economical to manufacture. An optical component, such as a PIN photodiode, is bonded to a substrate such as silicon with no metallization on its side...
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5837995 |
Wavelength-controllable voltage-phase photodiode optoelectronic switch ("opsistor")
A wavelength-portion controllable optoelectronic switch ("Opsistor") capable of rapid switch frequencies fabricated as a monolithic integrated circuit is disclosed. The Opsistor is comprised of two...
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5828172 |
Diode mount for an led with a plug connector and compensating resistor, and a method of its manufacture
A diode mount for an LED (2) with a plug connector (3) and compensating resistor (4) is manufactured by injection molding a one piece housing and mounting an LED and plug connector therein. An...
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5821597 |
Photoelectric conversion device
A photoelectric conversion device taking the form of a thin film and having a substrate exhibiting poor thermal resistance. The device prevents thermal deformation which would normally be caused by...
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5821532 |
Imager package substrate
An image head assembly comprising: a substrate with at least a pair of apertures formed in the substrate; an optical assembly having at least a pair of pins that mate with the apertures within the...
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5818035 |
Optically coupled large-format solid state imaging apparatus having edges of an imaging device
A large-format solid state imaging device which can detect optical images without loss of sharpness or resolution is provided and includes a solid state imaging device supported by and secured to a...
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5818094 |
Package for housing a semiconductor element
A semiconductor element-housing package which hermetically houses a semiconductor element for protection against moisture in the atmosphere by bonding an insulating substrate and a lid by means of...
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5814870 |
Semiconductor component
A semiconductor component has at least one semiconductor chip mounted on a carrier part of its housing. The semiconductor chip is electrically connected to at least two electrode connectors which...
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5814871 |
Optical semiconductor assembly having a conductive float pad
An optical semiconductor assembly including a metal stem, a hermetic glass substrate fixed to the stem, and a conductive float pad formed on the hermetic glass substrate. The first to third leads...
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5811799 |
Image sensor package having a wall with a sealed cover
An image sensor chip is mounted on a printed wiring frame over a substrate, which is plated with a spider web of plated conductors connecting the IC through via holes to the bottom of the substrate...
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5808322 |
Faster switching GaAs FET switches by illumination with high intensity light
The present invention relates to GaAs FET switches for use in microwave test equipment. For many microwave applications, particularly GSM (Global System for Mobile Telecommunications) basestation...
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5804865 |
Package for optical semiconductor element and method for manufacturing the same
A package for optical semiconductor device comprising a metallic frame having a side wall provided with an optical fiber-securing portion for securing an optical fiber to be introduced through the...
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5800631 |
Solar cell module having a specific back side covering material and a process for the production of said solar cell module
A solar cell module which comprises a stacked body including a photovoltaic element interposed between a front side covering material and a back side covering material having a foamed material...
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