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7629660 |
Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof
A semiconductor sensor component including a sensor chip and methods for the manufacturing thereof is disclosed. In one embodiment, the semiconductor sensor component includes a package which...
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7629659 |
Miniaturized imaging device with integrated circuit connector system
A miniaturized imaging device and method of viewing small luminal cavities are described. The imaging device can be used as part of a catheter, and can include a lens, an SSID including an imaging...
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7622785 |
Photoelectric conversion element and manufacturing method of photoelectric conversion element
An object is to provide a photoelectric conversion element having a side surface with different taper angles by conducting etching of a photoelectric conversion layer step-by-step. A pin photodiode...
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7622786 |
EMI shielding for imager devices
A module that provides EMI shielding for imager devices is disclosed which includes a die comprising an imager device and a plurality of contact pads, a stack positioned above the imager device,...
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7618486 |
Pigment dispersion composition for producing color filter and color filter for color imaging device produced using the same
Disclosed is a pigment dispersion composition for producing a color filter. The pigment dispersion composition comprises a pigment, a binder resin, a dispersant and a solvent. The pigment is a blue...
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7616904 |
Waveguide photodetector with integrated electronics
A germanium on silicon waveguide photodetector disposed on a silicon on insulator (SOI) substrate. The photodetector is incorporated into a section of a planar silicon waveguide on the substrate....
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7616250 |
Image capturing device
An image capturing device is disclosed that includes a light receiving element having a light receiving surface, a plate-like transparent member provided on the light receiving surface of the light...
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7612395 |
CMOS image sensors
CMOS image sensors and methods for fabricating the same are disclosed. A disclosed CMOS image sensor comprises: a semiconductor substrate; a photo diode; a microlens located over the photo diode;...
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7612384 |
Reflective electrode for a semiconductor light emitting apparatus
A process is disclosed for forming a reflective electrode on a semiconductor light emitting device, the light emitting device having an active layer for generating light and a cladding layer in...
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7613026 |
Apparatus and methods for optically-coupled memory systems
Optically-coupled memory systems are disclosed. In one embodiment, a system memory includes a carrier substrate, and a controller attached to the carrier substrate and operable to transmit and...
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7612441 |
Image-sensing chip package module adapted to dual-side soldering
An image-sensing chip package module adapted to dual-side soldering includes three substrates, an image-sensing chip and a filter lens. The three substrates are stacked together by pressing (using...
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7608814 |
Optical structure for localising an electromagnetic field and detector or emitter device including such a structure
An optical structure enabling properties of the surface plasmons to be used is defined from a substantially binary, parameterizable unit pattern M E . The parameters a, b, c, d and h g of the...
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7605391 |
Optically coupled resonator
An optically coupled resonator includes a resonator body having at least one resonator sidewall and a laterally offset photodiode formed in a semiconductor substrate adjacent to the resonator body....
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7605438 |
Semiconductor imaging instrument and camera
A semiconductor imaging instrument including a prescribed substrate, an imaging device array provided on the substrate and having plural semiconductor imaging devices and electrodes for outputting...
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7605013 |
Photo-detector and related methods
An apparatus comprising at least one multilayer wafer which includes a device layer adjacent to a barrier layer, and the device layer includes at least two photoconductive regions separated by an...
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7602046 |
Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof
The invention relates to a recyclable donor wafer that includes a substrate and a formed layer thereon, wherein the formed layer has a thickness sufficient to provide (a) at least two useful layers...
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7598581 |
Image sensor with decreased optical interference between adjacent pixels
An image sensor with decreased optical interference between adjacent pixels is provided. An image sensor, which is divided into a pixel region and a peripheral region, the image sensor including a...
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7598552 |
Image sensor having improved sensitivity and method of manufacturing the same
In an image sensor in which a vertical length from a photoelectric conversion element to an uppermost micro-lens is minimal, and a method of manufacturing the same, the image sensor includes a...
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7598580 |
Image sensor module package structure with supporting element
An image sensor module package structure with a supporting element comprises a chip, the supporting element and a light-transmitting element. The chip has light-sensing elements arranged on a...
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7598554 |
CMOS image sensor and method for fabricating the same
A complementary metal-oxide semiconductor (CMOS) image sensor and a method for fabricating the same are disclosed. The image sensor includes a sub-layer having a photodiode and a plurality of...
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7598582 |
Ultra low dark current pin photodetector
A photodetector and a method for fabricating a photodetector. The photodetector may include a substrate, a buffer layer formed on the substrate, and an absorption layer formed on the buffer layer...
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7595217 |
Method of manufacturing a CMOS image sensor
A CMOS image sensor may include at least one of: a semiconductor substrate over which a photodiode and transistors are formed; passivation layers formed over a semiconductor substrate; and color...
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7595540 |
Semiconductor device and method of manufacturing the same
A semiconductor device including a package ( 2 ) having a plurality of wall portions ( 9 a ) and a plurality of conductor portions ( 4 ), a semiconductor element such as a solid-state image pickup...
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7592639 |
Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device
A chip-type light-emitting semiconductor device includes: a substrate 4 ; a blue LED 1 mounted on the substrate 4 ; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor...
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7592680 |
Wafer level image module
A wafer level image module includes a photo sensor for outputting an electrical signal upon receiving light, a lens set for focusing incident light onto the photo sensor, and an adjustment member...
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7592654 |
Reduced crosstalk CMOS image sensors
CMOS image sensor having high sensitivity and low crosstalk, particularly at far-red to infrared wavelengths, and a method for fabricating a CMOS image sensor. A CMOS image sensor has a substrate,...
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7592651 |
Low dark current photodiode for imaging
A photodiode and method of forming a photodiode has a substrate. An absorption layer is formed on the substrate to absorb lightwaves of a desired frequency range. A multiplication structure is...
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7591780 |
Miniaturized imaging device with integrated circuit connector system
A miniaturized imaging device and method of viewing small luminal cavities are described. The imaging device can be used as part of a catheter, and can include a lens, an SSID including an imaging...
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7589306 |
Image sensor with buried self aligned focusing element
An image sensor includes an optical sensor region, a stack of dielectric and metal layers, and a buried focusing layer. The optical sensor is disposed within a semiconductor substrate. The stack of...
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7586169 |
Image sensor and method for manufacturing the same
An image sensor that can include a photodiode formed on one side of a substrate to receive light and then generate signal charges based on the light; and a transistor converting the signal charges...
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7582944 |
Optical apparatus and optical module using the same
An optical apparatus includes an optical device (LED device or semiconductor imaging device) having a photoreceptor/light-emitting region, a peripheral circuit region and an electrode region, a...
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7582943 |
Color light receiving device and image pickup device
The invention provides a light receiving device having a single semiconductor substrate and a short-wavelength light receiving section. The single semiconductor substrate has regions of a first...
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7579625 |
CMOS image sensor and method for manufacturing the same
A CMOS image sensor is provided. The CMOS image sensor can include: a plurality of photodiodes formed on a semiconductor substrate; an interlayer dielectric layer formed on an entire surface of the...
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7576402 |
Semiconductor device, method of manufacturing the same, and camera module
The invention provides a package type semiconductor device and a method of manufacturing the same where reliability and yield are enhanced without making a manufacturing process complex. A resin...
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7576401 |
Direct glass attached on die optical module
An optical module includes an image sensor having an active area and a window mounted directly to the image sensor above the active area. The optical module further includes a mount mounted to the...
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7575949 |
Semiconductor photo-detector, semiconductor photo-detection device, and production method thereof
In a semiconductor photo-detector of the present invention, a first semiconductor layer, a second semiconductor layer having, and a photo-absorption part composed of a photo-absorption layer...
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7566942 |
Multi-spectral pixel and focal plane array
A novel detection pixel micro-structure allowing the simultaneous and continuous detection of several discrete optical frequencies. A focal plane array comprises a plurality of multi-spectral...
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7564496 |
Camera device, method of manufacturing a camera device, wafer scale package
The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image...
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7564111 |
Imaging apparatus
In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible...
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7560681 |
Image sensor and manufacturing method thereof
An image sensor may include a plurality of photodiodes for performing a photo-electric conversion and a plurality of microlenses. Each of the microlenses is formed over one of the photodiodes. The...
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7560748 |
Light emitting diode unit
A light emitting diode unit including a base ( 100 ) made of anodized aluminum and a printed board ( 101 ) attached to the base ( 100 ) and the printed board ( 101 ) including a predetermined...
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7560744 |
Package optical chip with conductive pillars
A package structure and a fabricating method thereof are provided. The package structure includes a soft board and an optical chip. The soft board has a surface with a bump disposed thereon. The...
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7557418 |
Semiconductor photoreceptor device
A semiconductor light detecting device includes an n-contact layer selectively disposed on an Fe—InP substrate. An optical waveguide layer is disposed on the n-contact layer and includes an...
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7557419 |
Method and apparatus for preventing or reducing color cross-talk between adjacent pixels in an image sensor device
An image sensor device formed in an integrated circuit (IC) with one or more shading structures configured to provide a predetermined shading pattern to control the locations at which light...
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7554143 |
CMOS image sensor and method of fabricating the same
A complementary metal-oxide semiconductor (CMOS) image sensor and a method of fabricating the same arc disclosed. In a complementary metal-oxide semiconductor (CMOS) image sensor including a...
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7554142 |
Ultrashallow photodiode using indium
The invention provides an imager having a p-n-p photodiode with an ultrashallow junction depth. A p+ junction layer of the photodiode is doped with indium to decrease transient enhanced diffusion...
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7550811 |
Image pickup device and method of manufacturing the same
The present invention relates to an image pickup device, etc., having a structure such that electrostatic discharge is unlikely to occur when an FOP and a CCD reading part are joined. This image...
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7550319 |
Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers...
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7550812 |
Camera module and method of fabricating the same
Example embodiments may provide a camera module including a high-resolution lens member and/or an image sensor chip that may be integrally formed, and a method of fabricating a camera module....
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7547954 |
Electronic systems using optical waveguide interconnects formed through a semiconductor wafer
An integrated circuit with a number of optical waveguides that are formed in high aspect ratio holes. The high aspect ratio holes extend through a semiconductor wafer. The optical waveguides...
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