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7627943 |
Method of manufacturing a pressure sensor
A method of manufacturing a pressure sensor is provided whereby the pressure sensor includes a joint, a diaphragm, and an adapter disposed between the joint and the diaphragm. The adapter includes...
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7586165 |
Microelectromechanical systems (MEMS) device including a superlattice
A microelectromechanical system (MEMS) device may include a substrate and at least one movable member supported by the substrate. The at least one movable member may include a superlattice...
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7579662 |
MEMS resonator and method of enhancing an output signal current from a MEMS resonator
The resonator comprises two capacitively coupled electrodes. One of the electrodes is made of a p-type doped semiconductor material, whereas the other electrode is made of an n-type doped...
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7579663 |
Hermetic packaging and method of manufacture and use therefore
A system and method for manufacturing micro cavity packaging enclosure at the wafer level using MEMS (MicroElectroMechanical Systems) process, wherein micro cavities are formed from epoxy-bonded...
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7554136 |
Micro-switch device and method for manufacturing the same
A micro device that is manufactured by semiconductor process and is electrically connected to outside for its operation. The micro device includes a circuit board, an electrode pad being provided...
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7400514 |
Non-rigid conductor link measurement sensor and method for the production thereof
The invention relates to electronic sensors comprising an electromechanical microsensor cell such as a micro-accelerometer, and it more particularly relates to the way in which the microsensor cell...
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7358579 |
Reducing the actuation voltage of microelectromechanical system switches
A microelectromechanical system switch may include a relatively stiff cantilevered beam coupled, on its free end, to a more compliant or flexible extension. A contact may be positioned at the free...
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7304358 |
MOS transistor with a deformable gate
A MOS transistor with a deformable gate formed in a semiconductor substrate, including source and drain areas separated by a channel area extending in a first direction from the source to the drain...
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7301801 |
Tuned pinned layers for magnetic tunnel junctions with multicomponent free layers
Apparatus and methods for optimizing a toggle window for a magnetic tunnel junction (MTJ) having a multicomponent free layer are provided. In accordance with an aspect of the invention, a MTJ...
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7298017 |
Actuation using lithium/metal alloys and actuator device
In one embodiment, a solid state actuator is provided having a solid state lithium storage material and a solid state volume changing material having a metal capable of changing volume in response...
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7298014 |
Use of visco-elastic polymer to reduce acoustic and/or vibration induced error in microelectromechanical devices and systems
A system and method for reducing rectification error in a MEMS device cause by noise and/or vibration. A visco-elastic polymer is situated around at least part of the MEMs device, wherein the...
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7256467 |
Materials and methods for forming hybrid organic-inorganic anti-stiction materials for micro-electromechanical systems
A micro-electromechanical device is formed on a substrate. The device has sliding, abrading or impacting surfaces. At least one of these surfaces is covered with an anti-stiction material. The...
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7214995 |
Mechanism to prevent actuation charging in microelectromechanical actuators
According to one embodiment a microelectromechanical (MEMS) switch is disclosed. The MEMS switch includes a top movable electrode, and an actutaion electrode with an undoped polysilicon stopper...
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7199448 |
Integrated circuit configuration comprising a sheet-like substrate
An integrated circuit is formed on a non-planar substrate. The integrated circuit is formed over a plurality of layers. Chemical or physical changes in the microstructure of the substrate cause the...
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7148549 |
Data storage module suspension system
A micro-electro-mechanical device includes a moveable mass supported within a frame. To support the mass within the frame, a first flexure extends between the mass and the frame. An angle softening...
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7122396 |
Semiconductor acceleration sensor and process for manufacturing the same
The present invention provides a semiconductor acceleration sensor wherein a semiconductor element is prevented from being damaged even when at least part of a weight is disposed in an internal...
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7115960 |
Nanotube-based switching elements
Nanotube-based switching elements and logic circuits. Under one embodiment of the invention, a switching element includes an input node, an output node, a nanotube channel element having at least...
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7109561 |
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to...
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7075162 |
Electrostatic/electrostrictive actuation of elastomer structures using compliant electrodes
A valve structure includes an elastomeric block formed with first and second microfabricated recesses separated by a membrane portion of the elastomeric block. The valve is actuated by positioning...
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7042056 |
Chip-size package piezoelectric component
A surface acoustic wave device includes a SAW having an IDT disposed on a piezoelectric substrate, a conductive pad connected to the IDT, and a bonding substrate, wherein the SAW is bonded to the...
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7038285 |
Very high sensitivity magnetic sensor
A magnetic sensor includes a thin deformable membrane made of a conductive material forming a first plate of a capacitor which conducts an electric current therethrough. A second capacitor plate of...
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7034370 |
MEMS scanning mirror with tunable natural frequency
In one embodiment of the invention, a MEMS structure includes a first electrode, a second electrode, and a mobile element. The first electrode is coupled to a first voltage source. The second...
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6960814 |
Reflecting device and method of fabricating the same
Reflecting layers in first, second and third regions are separated from a reflecting layer in the surrounding region by a separating groove. The first region is folded in a valley shape from a...
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6946695 |
Solid-state rotational rate sensor device and method
The present invention provides a solid-state rotational rate sensor device formed by a thin-film for generating an electrical voltage output proportional to the rate of rotational motion. The...
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6936902 |
Sensor with at least one micromechanical structure and method for production thereof
A sensor has a foundation wafer having a sensor chamber, at least one silicon-based micromechanical structure integrated with the sensor chamber of the foundation wafer, at least one covering that...
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6855996 |
Electronic device substrate structure and electronic device
An electronic device substrate structure including a substrate 2, a metal thin film 4 as a (111)-oriented film of a face-centered cubic structure or as a (0001)-oriented film of a hexagonal...
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6848306 |
Semiconductor dynamic sensor
A semiconductor dynamic sensor such as an acceleration sensor is composed of a sensor chip having electrodes movable in response to acceleration applied thereto and a circuit chip having a circuit...
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6849910 |
Systems and methods for improving the performance of sensing devices using oscillatory devices
Microelectromechanical (MEMS) oscillatory devices are placed adjacent a face of a microelectronic sensor platform and configured to oscillate to improve transport to the sensor of substances to be...
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6841840 |
Capacitive dynamic quantity sensor
A capacitive dynamic quantity sensor includes a substrate, a weight, a movable electrode, an anchor, a fixed electrode, a spring, and a strain buffer. The weight is displaced by a dynamic quantity....
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6828640 |
Integrated electromechanical microstructure comprising pressure adjusting means in a sealed cavity and pressure adjustment process
The integrated electromechanical microstructure comprises a base substrate and a cavity closed by a protective cover. Means for adjusting the pressure in the cavity after the protective cover has...
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6825539 |
Integrated circuit-integrated flexible shear-stress sensor skin and method of fabricating the same
An IC-integrated, flexible, shear-stress sensor skin is made by providing a wafer with integrated circuits and sensor elements which are fabricated in the wafer, disposing a first polymer layer on...
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6825512 |
Micromachined sensor with insulating protection of connections
An active part of a sensor is formed, for example, by micro-machined silicon wafers bearing electronic elements, electrical conductors, connection pads, and pins. The pads are electrically...
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6815782 |
Miniature electrostatic actuation device and installation comprising such devices
The invention relates to a miniature electrostatic actuation device ( 100 ) capable of generating movements along a determined direction (F), comprising pairs of electrodes ( 4 ) of which the...
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6806545 |
MEMS device having flexures with non-linear restoring force
A MEMS device having flexure elements with non-linear restoring force. The MEMS device has a substrate, support elements formed on the substrate, a moveable element positioned over the substrate by...
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6800912 |
Integrated electromechanical switch and tunable capacitor and method of making the same
A monolithically integrated, electromechanical microwave switch, capable of handling signals from DC to millimeter-wave frequencies, and an integrated electromechanical tunable capacitor are...
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6787804 |
Semiconductor acceleration sensor
A semiconductor acceleration sensor includesa non-single-crystal-silicon-based substrate, an insulating beam structure having a movable section and a stationary section, at least one piezoresistor...
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6774445 |
Actuator
The invention aims at suppressing an amount of deformation of a central portion of a movable part in a micro-miniature semiconductor actuator. A boundary portion is provided between a central...
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6756248 |
Pressure transducer and manufacturing method thereof
A pressure transducer designed to transform static pressure or dynamic pressure applied to a diaphragm into a corresponding electrical signal and a method of manufacturing the same are provided....
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6750999 |
Reconfigurable quasi-optical unit cells
A quasi-optical system is provided. More specifically, a quasi-optical system is provided comprising various embodiments of quasi-optical grids (such as arrays or layers and the like) with...
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6727551 |
MOS semiconductor device and method of manufacturing the same
The object of the present invention is to suppress a short channel effect on a threshold voltage. A channel region 5, a pair of source-drain regions and an isolating film 2 having a trench...
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6724023 |
Field effect transistor, especially for use as a sensor element or acceleration sensor
A field effect transistor suited for use as a sensor element or in an acceleration sensor is described. For this purpose, the field effect transistor within a planar substrate has a drain area and...
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6710417 |
Armor coated MEMS devices
A method of improving the robustness of microcomponents formed of silicon by armor coating the microcomponent with a ductile material, such as a metal. The armored coating may comprise either...
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6707121 |
Micro electro mechanical systems and devices
Structures and methods are disclosed to produce mechanical strength in Micro Electro Mechanical Systems by increasing the moment of inertia of some of the composing elements. In one aspect, a...
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6665110 |
Diagonal to rectangular pixel mapping for spatial light modulator
A method of mapping diagonal rows and columns of two-dimensional grid elements to rectangular rows and columns of two-dimensional grid elements. The method is of particular use with a spatial light...
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6661070 |
Micromechanical and microoptomechanical structures with single crystal silicon exposure step
The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated...
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6653702 |
Semiconductor pressure sensor having strain gauge and circuit portion on semiconductor substrate
A semiconductor pressure sensor includes a SOI substrate composed of first and second silicon substrates. A diaphragm portion is formed by the first silicon substrate as a bottom of a recess...
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6649988 |
Semiconductor pressure sensor decreasing creep stress in <110> crystalline axis direction
Metal wiring segments, which are located at peripheral positions of a diaphragm, are formed on a main surface of a thick portion of a semiconductor substrate. A ratio S/d is larger than 100, where...
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6632698 |
Microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in MEMS
A microelectromechanical device (MEMD) defined within a substrate of a MEMS includes a mass element defining an area of interest. The device also includes a support beam supporting the mass element...
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6614064 |
Transistor having a gate stick comprised of a metal, and a method of making same
The present invention is generally directed to a transistor having a gate stack comprised of a metal, and a method of making same. In one illustrative embodiment, the transistor is comprised of a...
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6597048 |
Electrostatically charged microstructures
A process and apparatus for injecting electrostatic charges into opposing elements of MEMS structures to produce repulsing forces between the elements. These forces tend to produce controlled...
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