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8174085 |
Method of manufacturing MEMS sensor and MEMS sensor
A method of manufacturing an MEMS sensor according to the present invention includes the steps of: forming a first sacrificial layer on one surface of a substrate; forming a lower electrode on the...
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8173471 |
Method for fabricating micro-electro-mechanical system (MEMS) device
A method for fabricating MEMS device includes providing a substrate having a first side and a second side. Then, a structural dielectric layer is formed over the substrate at the first side,...
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8163584 |
Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure
The beam bending of a MEMS device is minimized by reducing interfacial strength between a sacrificial layer and a MEMS structure.
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8154094 |
Micromechanical component having a cap having a closure
A micromechanical component having a substrate, having a cavity and having a cap that bounds the cavity. The cap has an access opening to the cavity. The cap has a diaphragm for closing the access...
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8138791 |
Stressed transistors with reduced leakage
Integrated circuits with stressed transistors are provided. Stressing transistors may increase transistor threshold voltage without the need to increase channel doping. Stressing transistors may...
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8138556 |
Pre-released structure device
A pre-released structure device comprising: at least one first stacking, comprising at least one first layer based on at least one first material, arranged against a second stacking comprising at...
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8138560 |
Microstructure, micromachine, and manufacturing method of microstructure and micromachine
Without sacrificial layer etching, a microstructure and a micromachine are manufactured. A separation layer 102 is formed over a substrate 101, and a layer 103 to be a movable electrode is formed...
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8120125 |
MEMS devices having overlying support structures
Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in...
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8115266 |
MEMS device having a movable electrode
A microelectromechanical system (MEMS) device includes a semiconductor substrate, a MEMS including a fixed electrode and a movable electrode formed on the semiconductor substrate through an...
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8106471 |
Semiconductor dynamic quantity sensor and method of producing the same
A semiconductor dynamic quantity sensor includes a sensor part and a cap connected to the sensor part. Dynamic quantity is detected based on a capacitance of a capacitor defined between a movable...
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8072081 |
Microelectromechanical system package
A microelectromechanical system package includes a chip carrier, a first microelectromechanical system chip, a silicon cover, a layer of metal, a plurality of first bonding wires and a sealant. The...
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8044472 |
Nanotube and graphene semiconductor structures with varying electrical properties
Nanotube and graphene transducers are disclosed. A transducer according to the present invention can include a substrate, a plurality of semiconductive structures, one or more metal pads, and a...
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8039912 |
Systems and methods for reduced stress anchors
Anchor systems and methods anchor components of a Micro-Electro-Mechanical Systems (MEMS) device to a substrate. An exemplary embodiment has a trace anchor bonded to a substrate, a device anchor...
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8033091 |
Quantum tunnelling transducer device
A monolithic micro or nano electromechanical transducer device includes a pair of substrates (20, 25) respectively mounting one or more elongate electrical conductors (40) and resilient solid state...
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8035176 |
MEMS package and packaging method thereof
Provided are a Micro Electro-Mechanical System (MEMS) package and a method of packaging the MEMS package. The MEMS package includes: a MEMS device including MEMS structures formed on a substrate,...
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8030690 |
Device sensitive to a movement comprising at least one transistor
The invention relates to a detection device using at least one transistor (2) with a vertical channel, comprising a mechanical structure (14), free to move relative to the transistor, in a plane...
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8013404 |
Folded lead-frame packages for MEMS devices
The MEMS package comprises a first and a second pre-molded lead-frame substrate, at least one of them having a cavity formed by plastic sidewalls along its periphery. The first and second...
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8012785 |
Method of fabricating an integrated CMOS-MEMS device
An embodiment of a method is provided that includes providing a substrate having a frontside and a backside. A CMOS device is formed on the substrate. A MEMS device is also formed on the substrate....
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8008737 |
Semiconductor device
A micromachine includes a microstructure and a semiconductor element formed over one insulating substrate. The micromachine includes including a movable layer containing polycrystalline silicon and...
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8003537 |
Method for the production of planar structures
A method for the production of a planar structure is disclosed. The method comprises producing on a substrate a plurality of structures of substantially equal height, and there being a space in...
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8004053 |
Micromechanical device and method of manufacturing micromechanical device
A micromechanical device according to an aspect of the present invention includes, a substrate, a micromachine which is mounted on the substrate, is provided with a mechanism deformed by a function...
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7989905 |
MEMS device having a movable electrode
A microelectromechanical system (MEMS) device includes a semiconductor substrate, a MEMS including a fixed electrode and a movable electrode formed on the semiconductor substrate through an...
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7973373 |
Microminiature moving device
A microminiature moving device has disposed on a single-crystal silicon substrate movable elements such as a movable rod and a movable comb electrode that are displaceable in parallel to the...
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7968958 |
Semiconductor device and manufacturing method of the same
A semiconductor device includes: a sensor element having a plate shape with a surface and including a sensor structure disposed in a surface portion of the sensor element; and a plate-shaped cap...
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7964954 |
Integrated circuit having a semiconductor sensor device with embedded column-like spacers
An integrated circuit having a semiconductor sensor device including a sensor housing partly filled with a rubber-elastic composition is disclosed. One embodiment has a sensor chip with sensor...
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7960200 |
Orientation-dependent etching of deposited AlN for structural use and sacrificial layers in MEMS
In accordance with the present invention, accurate and easily controlled sloped walls may be formed using AlN and preferably a heated TMAH for such purpose as the fabrication of MEMS devices, wafer...
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7956430 |
Semiconductor device including groove width variation portion for inspection
An accelerator sensor includes a semiconductor substrate having a main front surface and a main rear surface, a first groove portion being formed along a front surface pattern, in the main front...
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7923792 |
MEMS sensor comprising a deformation-free back electrode
An MEMS sensor constructed on a base chip and having a capacitive mode of operation is disclosed. The MEMS sensor has a patterned layer construction applied on the base chip. A cutout is produced...
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7906823 |
MEMS apparatus and method of manufacturing the same
A MEMS apparatus includes a MEMS unit formed on a semiconductor substrate and a cover provided with a pore and serving to seal the MEMS unit. The pore is sealed with a sealing material shaped in a...
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7888710 |
CMOS fabrication process utilizing special transistor orientation
Complementary metal oxide semiconductor transistors are formed on a silicon substrate. The substrate has a {100} crystallographic orientation. The transistors are formed on the substrate so that...
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7884431 |
MEMS device having a movable electrode
A microelectromechanical system (MEMS) device includes a semiconductor substrate, a MEMS including a fixed electrode and a movable electrode formed on the semiconductor substrate through an...
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7884429 |
Impact sensor and method for manufacturing the impact sensor
An impact sensor comprises a silicon substrate; an insulating layer formed over the silicon substrate; a plurality of beams having flexibility that are formed of conductive silicon material; a...
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7875484 |
Monolithic IC and MEMS microfabrication process
Monolithic IC/MEMS processes are disclosed in which high-stress silicon nitride is used as a mechanical material while amorphous silicon serves as a sacrificial layer. Electronic circuits and...
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7872320 |
Micro-electro-mechanical device and method of manufacturing the same
The present invention improves mechanical strength of a micro-electro-mechanical device (MEMS) having a movable portion to improve reliability. In a micro-electro-mechanical device (MEMS) having a...
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7868390 |
Method for fabricating strained-silicon CMOS transistor
First, a semiconductor substrate having a first active region and a second active region is provided. The first active region includes a first transistor and the second active region includes a...
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7858424 |
Method for manufacturing a sensor array including a monolithically integrated circuit
A method for producing a sensor array including a monolithically integrated circuit is described as well as a sensor array. This sensor array has a micromechanical sensor structure, in which a...
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7851876 |
Micro electro mechanical system
Embodiments of a micro electro mechanical system are disclosed.
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7847318 |
Multilayer build-up wiring board including a chip mount region
Mesh holes 35a and 59a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50 are not...
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7843024 |
Method and structure for improving device performance variation in dual stress liner technology
A method and semiconductor structure that overcome the dual stress liner boundary problem, without significantly increasing the overall size of the integrated circuit, are provided. In accordance...
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7821085 |
Physical quantity sensor and method for manufacturing the same
A physical quantity sensor includes: a sensor substrate including a first support substrate, a first insulation film and a first semiconductor layer, which are stacked in this order; a cap...
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7812410 |
Suspended-gate MOS transistor with non-volatile operation
A microelectronic device, including at least one transistor including: on a substrate, a semiconductor zone with a channel zone covered with a gate dielectric zone, a mobile gate, suspended above...
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7811849 |
Placing a MEMS part on an application platform using a guide mask
A method for fabricating a micro-electro-mechanical system (MEMS) device. The method comprises placing a guiding mask on an application platform, the guiding mask including an opening that defines...
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7808061 |
Multi-die apparatus including moveable portions
An electronic apparatus includes a first die, a second die, a third die, and a fourth die, wherein a portion of the second die and a portion of the third die are movably connected between the first...
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7785912 |
Piezo-TFT cantilever MEMS fabrication
A piezo-TFT cantilever microelectromechanical system (MEMS) and associated fabrication processes are provided. The method comprises: providing a substrate, such as glass for example; forming...
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7781851 |
Semiconductor device having reduced die-warpage and method of manufacturing the same
A semiconductor device and a method of manufacturing the same reduce die-warpage. The semiconductor device includes a substrate and a first layer of material extending substantially over the entire...
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7777285 |
Semiconductor device having a suspended micro-system
A method is provided for fabricating a semiconductor device that includes a suspended micro-system. According to the method, a silicon porous layer is formed above a silicon substrate, and the...
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7768821 |
Non-volatile SRAM memory cell equipped with mobile gate transistors and piezoelectric operation
The present application relates to a non-volatile random-access memory cell equipped with a suspended mobile gate and with piezoelectric means for operating the gate.
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7737514 |
MEMS pressure sensor using area-change capacitive technique
A micro-electro-mechanical system (MEMS) pressure sensor includes a silicon spacer defining an opening, a silicon membrane layer mounted above the spacer, and a silicon sensor layer mounted above...
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7714421 |
Small structure and method for fabricating the same
A small structure which uses bonding wires to prevent disturbance and provide support and a method of fabricating the same are provided. The small structure includes a floating body having a...
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7705413 |
Micromechanical component and method for producing a micromechanical component
A micromechanical component, in particular a micromechanical sensor, having a first wafer and a second wafer is provided, the first wafer having at least one structural element, and the second...
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