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7627943 |
Method of manufacturing a pressure sensor
A method of manufacturing a pressure sensor is provided whereby the pressure sensor includes a joint, a diaphragm, and an adapter disposed between the joint and the diaphragm. The adapter includes...
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7629603 |
Strain-inducing semiconductor regions
A method to form a strain-inducing semiconductor region comprising three or more species of charge-neutral lattice-forming atoms is described. In one embodiment, formation of a strain-inducing...
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7625773 |
Anti-stiction technique for electromechanical systems and electromechanical device employing same
A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion...
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7615834 |
Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane
Structure for capacitive micromachined ultrasonic transducer (CMUT) device or other vibrating membrane device having non-uniform membrane so that membrane mass and stiffness characteristics may be...
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7615835 |
Package for semiconductor acceleration sensor
A semiconductor device comprises a package having a cavity in the interior thereof, a chip having a semiconductor element, a board having the chip fixed to a first region on the upper face thereof,...
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7612423 |
Signal-carrying flexure structure for micro-electromechanical devices
A signal-carrying flexure structure for a MEM device comprises at least two conductive flexure segments having respective cross-sectional areas, and at least one crosspiece affixed to the flexure...
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7608900 |
Semiconductor device and method of manufacturing and inspection thereof
An accelerator sensor includes a semiconductor substrate having a main front surface and a main rear surface, a first groove portion being formed along a front surface pattern, in the main front...
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7603910 |
Micro-electromechanical capacitive strain sensor
A micro-electromechanical capacitive strain sensor. The micro-electromechanical capacitive strain sensor comprises a first bent beam, a second bent beam, and a straight center beam. The first bent...
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7582969 |
Hermetic interconnect structure and method of manufacture
A hermetic interconnect is fabricated on a substrate by forming a stud of conductive material over a metallization layer, and then overcoating the stud of conductive material and the metallization...
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7582940 |
Semiconductor device using MEMS technology
A semiconductor device using a MEMS technology according to an example of the present invention comprises a cavity, a lower electrode positioned below the cavity, a moving part positioned in the...
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7579662 |
MEMS resonator and method of enhancing an output signal current from a MEMS resonator
The resonator comprises two capacitively coupled electrodes. One of the electrodes is made of a p-type doped semiconductor material, whereas the other electrode is made of an n-type doped...
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7572660 |
Electrical through-plating of semiconductor chips
A method for manufacturing a micromechanical component and a micromechanical component manufactured using this method are described, the micromechanical component having a first substrate, which in...
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7572659 |
Semiconductor dynamic sensor and method of manufacturing the same
A semiconductor sensor includes an adhesive film for suppressing thermal stress transfer to a semiconductor sensor chip. More specifically, the adhesive film includes a first layer and a second...
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7566939 |
Fabrication of silicon micro-mechanical structures
A method for protecting a material of a microstructure comprising the material and a noble metal layer against undesired galvanic etching during manufacture, the method comprises forming on the...
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7554168 |
Semiconductor acceleration sensor device
A semiconductor device comprises a package having a cavity in the interior thereof, a chip having a semiconductor element, and an adhesive portion comprised of a silicone or fluorine resin and...
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7554136 |
Micro-switch device and method for manufacturing the same
A micro device that is manufactured by semiconductor process and is electrically connected to outside for its operation. The micro device includes a circuit board, an electrode pad being provided...
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7550810 |
MEMS device having a layer movable at asymmetric rates
A microelectromechanical (MEMS) device includes a substrate and a movable layer mechanically coupled to the substrate. The movable layer moves from a first position to a second position at a first...
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7540191 |
Angular rate sensor and method of manufacturing the same
An angular rate sensor 100 comprises a first structure 110 which includes a fixed portion 111 having an opening 114, a displacing portion 112 placed in the opening 114, and a connecting...
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7524693 |
Method and apparatus for forming an electrical connection to a semiconductor substrate
A device ( 100 ) may use one or more conductive elements ( 112 ) to electrically couple a substrate ( 116 ) and a cap ( 114 ). In one embodiment, an acceleration sense element may be formed on the...
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7518202 |
Mechanical quantity measuring apparatus
A semiconductor mechanical quantity measuring apparatus in which the reverse surface of a strain-detecting semiconductor element is bonded to an object of measurement, and a member having a small...
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7514283 |
Method of fabricating electromechanical device having a controlled atmosphere
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of fabricating or manufacturing MEMS having mechanical structures that...
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7495301 |
Thin film accelerometer
A thin film structure including a conductive thin film provided on a substrate and configured to be displaced in response to an applied acceleration, a pair of electrode pads formed on the...
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7491566 |
Method of forming a device by removing a conductive layer of a wafer
A method of forming a MEMS device provides a wafer having a base, a first conductive layer, a second conductive layer, and an intermediate conductive layer. After it provides the wafer, the method...
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7491567 |
MEMS device packaging methods
A method of packaging a MEMS device that includes, for example, the steps of providing a MEMS die that has a MEMS device, a seal ring and bond pads disposed thereon, providing a MEMS package that...
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7489013 |
Destructor integrated circuit chip, interposer electronic device and methods
A semiconductor device. The device includes a substrate and an integrated circuit chip. The device also includes an electrically or thermally reactive layer located between a top surface of the...
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7476948 |
Microminiature moving device and method of making the same
In a microminiature moving device that has disposed, on a single-crystal silicon substrate, movable elements (a movable rod 46, a movable comb electrode 49, etc.) displaceable in parallel to...
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7466000 |
Semiconductor device having multiple substrates
A semiconductor device includes a first substrate including first, second and third layers; a second substrate; and a loop bump. The first and second substrates provides an electric device and...
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7462918 |
Pressure sensor having gold-silicon eutectic crystal layer interposed between contact layer and silicon substrate
A pressure sensor includes a gold-silicon eutectic crystal layer interposed between the contact layer and the silicon substrate. Because the contact layer and the silicon substrate are electrically...
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7453129 |
Image sensor comprising isolated germanium photodetectors integrated with a silicon substrate and silicon circuitry
In accordance with the invention, an improved image sensor comprises an array of germanium photosensitive elements integrated with a silicon substrate and integrated with silicon readout circuits....
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7443002 |
Encapsulated microstructure and method of producing one such microstructure
A microstructure including in a first layer insulated from a substrate by an insulator layer at least one sensitive element connected to at least one contact pad by an electrical connection and...
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7436037 |
Moisture resistant pressure sensors
A differential pressure sensor has a semiconductor wafer having a top and bottom surface. The top surface of the wafer has a central active area containing piezoresistive elements. These elements...
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7427797 |
Semiconductor device having actuator
A semiconductor device having a surface MEMS element, includes a semiconductor substrate, and an actuator which is arranged above the semiconductor substrate via a space and has a lower electrode,...
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7425749 |
MEMS pixel sensor
A MEMS pixel sensor is provided with a thin-film mechanical device having a mechanical body, with a mechanical state responsive to a proximate environment. A thin-film electronic device converts...
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7405099 |
Wide and narrow trench formation in high aspect ratio MEMS
Methods have been provided for forming both wide and narrow trenches on a high-aspect ratio microelectromechanical (MEM) device on a substrate including a substrate layer ( 126 ), an active layer (...
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7393711 |
Method of producing a digital fingerprint sensor and the corresponding sensor
An embodiment of the present invention related to fingerprint sensors is described. The sensor comprises an integrated-circuit chip having a sensitive surface, a substrate provided with electrical...
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7394138 |
Capacitance-type dynamic-quantity sensor and manufacturing method therefor
A capacitance-type dynamic-quantity sensor has a silicon substrate having etched recessed upper and lower surface portions forming a weight supported by beam portions and mounted to undergo...
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7380461 |
Micro-electromechanical capacitive strain sensor
A micro-electromechanical capacitive strain sensor. The micro-electromechanical capacitive strain sensor comprises a first bent beam, a second bent beam, and a straight center beam. The first bent...
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7371600 |
Thin-film structure and method for manufacturing the same, and acceleration sensor and method for manufacturing the same
A thin-film structural body formed by using a semiconductor processing technique and a manufacturing method thereof, and particularly a thin-film structural body constituting a semiconductor...
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7358581 |
Quantum dot based pressure switch
A semiconductor heterostructure based pressure switch comprising: first and second small bandgap material regions separated by a larger bandgap material region; a third small bandgap material...
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7358579 |
Reducing the actuation voltage of microelectromechanical system switches
A microelectromechanical system switch may include a relatively stiff cantilevered beam coupled, on its free end, to a more compliant or flexible extension. A contact may be positioned at the free...
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7355268 |
High reflector tunable stress coating, such as for a MEMS mirror
An optical device having a high reflector tunable stress coating includes a micro-electromechanical system (MEMS) platform, a mirror disposed on the MEMS platform, and a multiple layer coating...
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7348646 |
Micromechanical capacitive transducer and method for manufacturing the same
A micromechanical capacitive converter and a method for manufacturing a micromechanical converter comprise a movable membrane and an electrically conductive face element in a carrier layer. The...
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7337666 |
Movable sensor device
A movable sensor device includes a laminate body in which a micromechanical acting layer having a movable sensor structure and a coating layer coated on the micromechanical acting layer is...
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7329932 |
Microelectromechanical (MEM) viscosity sensor and method
A MEM viscosity sensor comprises a substrate, with first and second support structures affixed to the substrate and spaced-apart. A compliant member is affixed to the support structures such that...
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7321156 |
Device for capacitive pressure measurement and method for manufacturing a capacitive pressure measuring device
A device for manufacturing a capacitive pressure measurement includes an insulated base electrode, a mechanically deflectable counterelectrode composed of a layer made of at least one of a...
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7317233 |
Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having...
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7317199 |
Circuit device
To provide a circuit device suitable for incorporating a semiconductor element emitting or receiving short-wavelength light. The circuit device includes a casing, a semiconductor element, and a...
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7312485 |
CMOS fabrication process utilizing special transistor orientation
Complementary metal oxide semiconductor transistors are formed on a silicon substrate. The substrate has a {100} crystallographic orientation. The transistors are formed on the substrate so that...
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7309902 |
Microelectronic device with anti-stiction coating
One embodiment of a microelectronic device includes a movable plate including a lower surface, a bump positioned on the lower surface, and an anti-stiction coating positioned only on the bump.
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7307325 |
High temperature interconnects for high temperature transducers
A silicon wafer is fabricated utilizing two or more semiconductor wafers. The wafers are processed using conventional wafer processing techniques and the wafer contains a plurality of output...
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