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9035451 Wafer level sealing methods with different vacuum levels for MEMS sensors  
The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of cavities with different pressures on a wafer package system, and an associated apparatus. In...
9029963 MEMS microphone  
Mechanical resonating structures, as well as related devices and methods of manufacture. The mechanical resonating structures can be microphones, each including a diaphragm and a piezoelectric...
9029962 Molded cavity substrate MEMS package fabrication method and structure  
A molded ring includes a molded cavity of a molded cavity substrate MEMS package. The molded ring is formed by molding a dielectric material directly upon a substrate. As molding is a relatively...
9029179 MEMS device with improved charge elimination and methods of producing same  
A method for producing a MEMS device having improved charge elimination characteristics includes providing a substrate having one or more layers, and applying a first charge elimination layer onto...
9024396 Device with MEMS structure and ventilation path in support structure  
A device includes a support structure, a sound port disposed in the support structure, and a MEMS structure including a membrane acoustically coupled to the sound port. The membrane separates a...
9013013 Pressure sensor package having a stacked die arrangement  
A pressure sensor package includes a pressure sensor having a first side with a pressure sensor port, a second side opposite the first side, and electrical contacts. A logic die stacked on the...
9006845 MEMS device with polymer layer, system of a MEMS device with a polymer layer, method of making a MEMS device with a polymer layer  
A MEMS device, a method of making a MEMS device and a system of a MEMS device are shown. In one embodiment, a MEMS device includes a first polymer layer, a MEMS substrate disposed on the first...
8995694 Embedded circuit in a MEMS device  
A Microelectromechanical System (MEMS) microphone includes a printed circuit board, a MEMS die, and an integrated circuit. The MEMS die is disposed on a top surface of the printed circuit board....
8987842 Microelectromechanical system (MEMS) device and fabrication method thereof  
A MEMS device includes a silicon substrate and a structural dielectric layer. The silicon substrate has a cavity. The structural dielectric layer is disposed on the silicon substrate. The...
8987843 Mapping density and temperature of a chip, in situ  
A method and system to map density and temperature of a chip, in situ, is disclosed. The method includes measuring a propagation time that a mechanical propagation wave travels along at least one...
8987844 MEMS device and process  
A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume,...
8981501 Semiconductor device and method of forming the same  
A method of forming a semiconductor device is disclosed. Provided is a substrate having at least one MOS device, at least one metal interconnection and at least one MOS device formed on a first...
8981499 MEMS chip package and method for manufacturing an MEMS chip package  
A MEMS chip package includes a first chip, a second chip, a first coupling element, and a first redistribution layer. The first chip has a first chip surface and a second chip surface, which is...
8981535 Charge pump capacitor assembly with silicon etching  
Charge pump capacitor assemblies and methods of manufacturing the same. One charge pump capacitor assembly includes a charge pump capacitor and a silicon substrate. The charge pump capacitor...
8975713 Ultasound probe providing dual backing layer  
Disclosed is an ultrasonic probe comprising: CMUT cells (13) that mutually convert ultrasonic waves and electrical signals; a semiconductor substrate (15) that has a plurality of the CMUT cells...
8975107 Method of manufacturing a semiconductor device comprising a membrane over a substrate by forming a plurality of features using local oxidation regions  
In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is...
8969980 Vented MEMS apparatus and method of manufacture  
A micro-electromechanical system (MEMS) device includes a housing and a base. The base includes a port opening extending therethrough and the port opening communicates with the external...
8969978 TMAP sensor systems and methods for manufacturing those  
A pressure sensor system comprising a pressure sensor chip is disclosed. The pressure sensor chip comprises a sensing side where pressure sensing is performed and one or more interconnections...
8952468 Acoustic sensor, acoustic transducer, microphone using the acoustic transducer, and method for manufacturing the acoustic transducer  
In an acoustic sensor, a conductive vibrating membrane and a fixed electrode plate are disposed above a silicon substrate with an air gap provided therebetween, and the substrate has an impurity...
8946832 Filter using a waveguide structure  
A representative filter comprises a silicon-on-insulator substrate having a top surface, a metal shielding positioned above the top surface of the silicon-on-insulator substrate, and a band-pass...
8941193 Method for manufacturing a hybrid integrated component  
A simple and cost-effective manufacturing method for hybrid integrated components including at least one MEMS element, a cap for the micromechanical structure of the MEMS element, and at least one...
8921956 MEMS device having a back plate with elongated protrusions  
MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the...
8921955 Semiconductor device with micro electromechanical system die  
In one embodiment, a miniaturized, multi-function, highly integrated and high performance semiconductor device or package includes a microphone implemented using a MEMS (Micro Electro Mechanical...
8921957 Method of improving MEMS microphone mechanical stability  
A MEMS microphone. The MEMS microphone includes a back plate, a membrane, a support structure, a substrate, and an overtravel stop. The membrane is coupled to the back plate. The support structure...
8921203 Method of forming an integrated circuit having varying substrate depth  
A method for forming a semiconductor device includes providing a substrate having a first major surface and a second major surface, removing a first portion of the substrate to form a cavity at...
8921952 Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereof  
Methods for fabricating crack resistant Microelectromechanical (MEMS) devices are provided, as are MEMS devices produced pursuant to such methods. In one embodiment, the method includes forming a...
8912613 Dual-side micro gas sensor and method of fabricating the same  
Provided are a dual-side micro gas sensor and a method of fabricating the same. The sensor may include an elastic layer, a heat-generating resistor layer on the elastic layer, an interlayered...
8907434 MEMS inertial sensor and method for manufacturing the same  
A MEMS inertial sensor and a method for manufacturing the same are provided. The method includes: depositing a first carbon layer on a semiconductor substrate; patterning the first carbon layer to...
8901683 Micro electro mechanical system (MEMS) microphone and fabrication method thereof  
Provided is a structure for improving performance of a micro electro mechanical system (MEMS) microphone by preventing deformation from occurring due to a residual stress and a package stress of a...
8901680 Graphene pressure sensors  
Semiconductor nano pressure sensor devices having graphene membrane suspended over cavities formed in a semiconductor substrate. A suspended graphene membrane serves as an active...
8901682 Acoustic transducers with perforated membranes  
A MEMS device, such as a microphone, uses a perforated plate. The plate comprises an array of holes across the plate area. The plate has an area formed as a grid of polygonal cells, wherein each...
8890265 Semiconductor device and microphone  
A package is formed by vertically stacking a cover and a substrate. A microphone chip is mounted at the top surface of a concave portion provided to the cover, and a circuit element is mounted on...
8890628 Ultra slim RF package for ultrabooks and smart phones  
A semiconductor device package having reduced form factor and a method for forming said semiconductor device are disclosed. In an embodiment, an active die is embedded within a cavity in the core...
8883535 Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof  
Methods for the fabrication of a Microelectromechanical Systems (“MEMS”) device are provided. In one embodiment, the MEMS device fabrication method includes forming a via opening extending through...
8884384 Micromachine and method for manufacturing the same  
A semiconductor element of the electric circuit includes a semiconductor layer over a gate electrode. The semiconductor layer of the semiconductor element is formed of a layer including...
8878313 Pressure sensor  
A pressure sensor has a sensor body at least partly formed with an electrically insulating material, particularly a ceramic material, defining a cavity facing on which is a diaphragm provided with...
8872288 Apparatus comprising and a method for manufacturing an embedded MEMS device  
A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first...
8866237 Methods for embedding controlled-cavity MEMS package in integration board  
An embedded micro-electro-mechanical system (MEMS) (100) comprising a semiconductor chip (101) embedded in an insulating board (120), the chip having a cavity (102) including a radiation sensor...
8866241 Pressure sensing device having contacts opposite a membrane  
Pressure sensors that may be used in harsh or corrosive environments. One example may provide a pressure sensor having membrane with a top surface that may be free of components or electrical...
8866238 Hybrid integrated component and method for the manufacture thereof  
Hybrid integrated components including an MEMS element and an ASIC element are described, whose capacitor system allows both signal detection with comparatively high sensitivity and sensitive...
8865499 MEMS microphone and method for producing the MEMS microphone  
The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier...
8860516 Piezoelectric oscillator and transmitter  
A piezoelectric oscillator includes: a piezoelectric resonator element having a piezoelectric substrate and an excitation electrode formed on a surface of the piezoelectric substrate; a...
8860154 CMOS compatible silicon differential condenser microphone and method for manufacturing the same  
The present invention provides a CMOS compatible silicon differential condenser microphone and a method of manufacturing the same. Said microphone comprises a silicon substrate, wherein a CMOS...
8852985 Graphene pressure sensors  
Semiconductor nano pressure sensor devices having graphene membrane suspended over open cavities formed in a semiconductor substrate. A suspended graphene membrane serves as an active...
8855337 Microphone and accelerometer  
The invention relates to a method for manufacturing a micromachined microphone and an accelerometer from a wafer 1 having a first layer 2, the method comprising the steps of dividing the first...
8853800 Integrated device of the type comprising at least a microfluidic system and further circuitry and corresponding integration process  
An embodiment relates to a device integrated on a semiconductor substrate of a type comprising at least one first portion for the integration of at least one microfluidic system, and a second...
8841734 Sensor element  
A sensor element includes: a first substrate in which a diaphragm is configured on a main surface; a second substrate which is provided on the side opposite to the diaphragm of the first...
8841737 MEMS device and process  
A MEMS comprises a back-plate (7) having an inner portion (7a) and an outer portion (7b), the inner portion (7a) connected to the outer portion (7b) by a sidewall (7c). A raised section or anchor...
8841738 MEMS microphone system for harsh environments  
A MEMS microphone system suited for harsh environments. The system uses an integrated circuit package. A first, solid metal lid covers one face of a ceramic package base that includes a cavity,...
8836052 Electromechanical transducer and method of manufacturing the same  
An electromechanical transducer includes multiple elements each having multiple cells, with each cell including a first electrode formed from a conductive substrate, and a second electrode opposed...