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7622387 |
Gate electrode silicidation process
A fully-silicided gate electrode is formed from silicon and a metal by depositing at least two layers of silicon with the metal layer therebetween. One of the silicon layers may be amorphous...
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7615831 |
Structure and method for fabricating self-aligned metal contacts
A semiconductor structure including at least one transistor is provided which has a stressed channel region that is a result of having a stressed layer present atop a gate conductor that includes a...
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7615803 |
Method for manufacturing transistor and image display device using the same
A method for manufacturing a transistor includes forming a semiconductor layer on a substrate, a first insulation film on the semiconductor layer, and a gate electrode on the first insulation film....
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7605414 |
MOS transistors having low-resistance salicide gates and a self-aligned contact between them
A method for forming a self-aligned contact between two MOS transistors is described. The method supports the use of low-resistivity suicides for the formation of contacts in nanometer applications...
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7598536 |
Semiconductor device having load resistor and method of fabricating the same
A semiconductor device includes a semiconductor substrate having a resistor region, an isolation layer disposed in the resistor region, the isolation layer defining active regions, first conductive...
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7592674 |
Semiconductor device with silicide-containing gate electrode and method of fabricating the same
There is provided a semiconductor device which is capable of solving a problem of threshold control in CMOS transistor, accompanied with combination of a gate insulating film having a high...
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7585756 |
Semiconductor device and method of manufacturing the same
A MOS transistor includes a substrate, source/drain regions formed at portions of the substrate, and a channel region formed between the source/drain regions. The MOS transistor further includes a...
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7576399 |
Semiconductor device and method of manufacture thereof
A dielectric material layer is formed over a workpiece, a metal layer is formed over the dielectric material layer, and a semiconductive material layer is formed over the metal layer. The workpiece...
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7576397 |
Semiconductor device
A semiconductor device includes a semiconductor substrate, an nMISFET formed on the substrate, the nMISFET including a first dielectric formed on the substrate and a first metal gate electrode...
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7573106 |
Semiconductor device and manufacturing method therefor
A method of manufacturing a semiconductor device comprises forming a gate insulation film on a semiconductor substrate; forming a first gate electrode and a second gate electrode on the gate...
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7566937 |
MOS transistor including multi-work function metal nitride gate electrode, COMS integrated circuit device including same, and related methods of manufacture
Disclosed is a MOS transistor including a multi-work function metal nitride gate electrode. The MOS transistor comprises a semiconductor substrate and a central gate electrode formed on the...
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7564081 |
finFET structure with multiply stressed gate electrode
A semiconductor structure and its method of fabrication include a semiconductor fin located over a substrate. A gate electrode is located over the semiconductor fin. The gate electrode has a first...
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7560331 |
Method for forming a silicided gate
A gate is silicided through its sides while limiting silicidation through the top of the gate. A blocking layer may be formed over the gate layer, and the sidewalls of the gate layer are exposed. A...
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7554161 |
HfAlO3 films for gate dielectrics
A dielectric film containing HfAlO 3 and a method of fabricating such a dielectric film produce a reliable gate dielectric having an equivalent oxide thickness thinner than attainable using SiO 2...
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7545009 |
Word lines for memory cells
Various embodiments of the invention described herein reduce contact resistance to a silicon-containing material using a first refractory metal material overlying the silicon-containing material...
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7541650 |
Gate electrode structures
Gate electrode structures used in field effect transistors and integrated circuits and methods of manufacture are disclosed. Improved work function and threshold modulation are provided by the...
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7531881 |
Semiconductor devices having transistors with different gate structures and methods of fabricating the same
A semiconductor device has two transistors of different structure from each other. One of transistors is P-type and the other is N-type. One of the transistors includes a gate structure in which a...
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7528451 |
CMOS gate conductor having cross-diffusion barrier
A gate conductor is provided for a transistor pair including an n-type field effect transistor (“NFET”) having an NFET active semiconductor region and a p-type field effect transistor...
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7528450 |
Semiconductor device having NMOSFET and PMOSFET and manufacturing method therefor
A element isolation insulating film is formed around the device regions in the silicon substrate. The device regions are formed an n-type diffusion layer region, a p-type diffusion layer region, a...
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7521346 |
Method of forming HfSiN metal for n-FET applications
A compound metal comprising HfSiN which is a n-type metal having a workfunction of about 4.0 to about 4.5, preferably about 4.3, eV which is thermally stable on a gate stack comprising a high k...
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7514753 |
Semiconductor device
A semiconductor device comprises n-type and p-type semiconductor devices formed on the substrate, the n-type device including an n-channel region formed on the substrate, n-type source and drain...
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7514732 |
Image pickup apparatus and image pickup system having plural semiconductor regions of a same conductivity type, with one of the semiconductor regions having a higher impurity concentration than and providing a potential to another of the semiconductor regions
A solid-state image pickup apparatus with little or no difference in the dark currents between adjacent photoelectric conversion elements and providing a high sensitivity and a low dark current...
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7514360 |
Thermal robust semiconductor device using HfN as metal gate electrode and the manufacturing process thereof
This invention relates to a semiconductor device making use of a highly thermal robust metal electrode as gate material. In particular, the development of Hafnium Nitride as a metal gate electrode...
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7511350 |
Nickel alloy silicide including indium and a method of manufacture therefor
The invention provides a semiconductor device, a method of manufacture therefore and a method for manufacturing an integrated circuit including the same. The semiconductor device, among other...
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7508075 |
Self-aligned poly-metal structures
A semiconductor structure is provided comprising a self-aligned poly-metal stack formed over a semiconductor substrate where the interface between an oxidation barrier placed over the stack and an...
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7508074 |
Etch stop layer in poly-metal structures
In accordance with one embodiment of the present invention, a semiconductor structure is provided comprising a poly-metal stack formed over a semiconductor substrate where the interface between an...
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7504691 |
Power trench MOSFETs having SiGe/Si channel structure
Devices, methods, and processes that improve immunity to transient voltages and reduce parasitic impedances. Immunity to unclamped inductive switching events is improved. For example, a...
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7501668 |
Semiconductor memory devices having contact pads with silicide caps thereon
An integrated circuit device having a semiconductor substrate includes a gate structure on the semiconductor substrate. Source/drain regions are on opposite sides of the gate structure. A contact...
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7501333 |
Work function adjustment on fully silicided (FUSI) gate
A fully silicided gate with a selectable work function includes; a gate dielectric over the substrate; and a first metal silicide layer over the gate dielectric, and a second metal silicide layer...
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7498641 |
Partial replacement silicide gate
A method of forming fully silicide gates having uniform gate silicide thickness is presented. A gate dielectric is formed over a substrate. A silicon-containing layer is formed over the gate...
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7495299 |
Semiconductor device
The following steps are carried out: forming a gate electrode on a semiconductor substrate with a gate insulating film interposed therebetween, forming a dummy gate electrode on the semiconductor...
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7495298 |
Insulating buffer film and high dielectric constant semiconductor device and method for fabricating the same
A semiconductor device includes: an n-transistor including a first gate insulating film made of a high-dielectric-constant material and a first gate electrode fully silicided with a metal, the...
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7485934 |
Integrated semiconductor structure for SRAM cells
A semiconductor structure includes a semiconductor substrate having a first device area and a second device area. A gate layer is formed across the first device area and the second device area on...
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7473975 |
Fully silicided metal gate semiconductor device structure
A method for forming a semiconductor device structure, comprising the steps of independently forming source/drain surface metal silicide layers and a fully silicided metal gate in a polysilicon...
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7473626 |
Control of poly-Si depletion in CMOS via gas phase doping
A method to control the poly-Si depletion effect in CMOS structures utilizing a gas phase doping process which is capable of providing a high concentration of dopant atoms at the gate...
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7470605 |
Method for fabrication of a MOS transistor
Disclosed is a method for fabricating a MOS transistor. The present method includes the steps of: (a) forming a gate electrode including a gate insulating layer and a polysilicon gate conductive...
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7462554 |
Method for forming semiconductor device with modified channel compressive stress
A method for forming a semiconductor device provides for forming a gate region on top of a substrate. Gate sidewall liners are formed on opposed sides of the gate region, the sidewall liners having...
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7459758 |
Transistor structure and method for making same
A gate structure in a transistor and method for fabricating the structure. A gate structure is formed on a substrate. The gate structure includes three layers: an oxide layer, a nitride layer and a...
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7453127 |
Double-diffused-drain MOS device with floating non-insulator spacers
A double-diffused-drain metal-oxide-semiconductor device has a gate structure overlying a semiconductor substrate, a pair of insulator spacers on the sidewalls of the gate structure respectively,...
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7446381 |
Semiconductor memory device and method for fabricating the same
A semiconductor memory device has a memory region which is formed on a semiconductor substrate and in which a plurality of memory cells each including a memory transistor are arranged as a matrix...
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7446380 |
Stabilization of flatband voltages and threshold voltages in hafnium oxide based silicon transistors for CMOS
The present invention provides a metal stack structure that stabilizes the flatband voltage and threshold voltages of material stacks that include a Si-containing conductor and a Hf-based...
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7439596 |
Transistors for semiconductor device and methods of fabricating the same
The present invention discloses a transistor for a semiconductor device capable of preventing the generation of a depletion capacitance in a gate pattern due to the diffusion of impurity ions. The...
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7439140 |
Formation of standard voltage threshold and low voltage threshold MOSFET devices
Wells are formed in a substrate where standard Vt and low Vt devices of both a first and second type are to be fabricated. Wells defining the locations of first type standard Vt devices are masked,...
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7436034 |
Metal oxynitride as a pFET material
A compound metal comprising MO x N y which is a p-type metal having a workfunction of about 4.75 to about 5.3, preferably about 5, eV that is thermally stable on a gate stack comprising a high k...
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7435652 |
Integration schemes for fabricating polysilicon gate MOSFET and high-K dielectric metal gate MOSFET
Multiple integration schemes for manufacturing dual gate semiconductor structures are disclosed. By employing the novel integration schemes, polysilicon gate MOSFETs and high-k dielectric metal...
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7432570 |
Semiconductor device and manufacturing method thereof
A semiconductor device includes a substrate, a p-channel MIS transistor formed on an n-type well on the substrate, having a first gate dielectric and a first gate electrode formed thereon and...
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7432567 |
Metal gate CMOS with at least a single gate metal and dual gate dielectrics
A complementary metal oxide semiconductor (CMOS) structure including at least one nFET and at least one pFET located on a surface of a semiconductor substrate is provided. In accordance with the...
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7432566 |
Method and system for forming dual work function gate electrodes in a semiconductor device
A method is provided for forming dual work function gate electrodes. A dielectric layer is provided outwardly of a substrate. A metal layer is formed outwardly of the dielectric layer. A...
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7429777 |
Semiconductor device with a gate electrode having a laminate structure
A semiconductor device includes a semiconductor substrate having a semiconductor layer, a gate electrode, a source region, a drain region, an element separation insulating film layer and a wiring....
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7429770 |
Semiconductor device and manufacturing method thereof
A technique capable of reducing threshold voltage and reducing high-temperature heat treatment after forming a gate electrode is provided. An n-type MIS transistor or a p-type MIS transistor is...
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