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7619272 |
Bi-axial texturing of high-K dielectric films to reduce leakage currents
The present invention is directed to a method of fabricating a high-K dielectric films having a high degree of crystallographic alignment at grain boundaries of the film. A disclosed method...
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7605436 |
Manufacture of semiconductor device having insulation film of high dielectric constant
A method contains the steps of (a) heating a silicon substrate in a reaction chamber; and (b) supplying film-forming gas containing source gas, nitridizing gas, and nitridation enhancing gas to a...
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7602030 |
Hafnium tantalum oxide dielectrics
A dielectric layer containing a hafnium tantalum oxide film and a method of fabricating such a dielectric layer produce a dielectric layer for use in a variety of electronic devices. Embodiments...
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7602016 |
Semiconductor apparatus and method of manufacturing the same
A semiconductor apparatus is disclosed. The semiconductor apparatus comprises a gate electrode formed on a surface of a semiconductor substrate with a gate insulating film provided therebetween....
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7602003 |
Semiconductor device structure for reducing hot carrier effect of MOS transistor
A semiconductor device structure is described, including a MOS transistor, a silicon-rich silicon nitride layer having a refractive index of about 2.00-2.30, and a dielectric layer. The...
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7598568 |
Semiconductor apparatus and method of manufacturing the same
A semiconductor apparatus is disclosed. The semiconductor apparatus comprises a gate electrode formed on a surface of a semiconductor substrate with a gate insulating film provided therebetween....
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7595538 |
Semiconductor device
A P-type MOSFET 120 includes a semiconductor substrate (N-well 102 b ); a gate insulating film formed on the semiconductor substrate, composed of a high-dielectric-constant film 108 which...
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7592678 |
CMOS transistors with dual high-k gate dielectric and methods of manufacture thereof
CMOS devices with transistors having different gate dielectric materials and methods of manufacture thereof are disclosed. A CMOS device is formed on a workpiece having a first region and a second...
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7586163 |
Semiconductor device having an electrode containing boron and manufacturing method thereof
A semiconductor device includes a semiconductor substrate; an insulation film provided on the semiconductor substrate; and an electrode provided on the insulation film, and containing boron and a...
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7586159 |
Semiconductor devices having different gate dielectrics and methods for manufacturing the same
A semiconductor device includes first and second transistor devices. The first device includes a first substrate region, a first gate electrode, and a first gate dielectric. The first gate...
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7582494 |
Device structures for reducing device mismatch due to shallow trench isolation induced oxides stresses
A circuit and method are disclosed for reducing device mismatch due to trench isolation related stress. One or more extended active regions are formed on the substrate, wherein the active regions...
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7579661 |
Semiconductor device, electronic device and electronic apparatus
An semiconductor device ( 1 ) of the invention includes a semiconductor substrate provided with a channel region ( 21 ), a source region ( 22 ) and a drain region ( 23 ), a gate insulating film ( 3...
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7579227 |
Semiconductor device and method for fabricating the same
A semiconductor device includes: a high dielectric constant gate insulating film formed on an active region in a substrate; a gate electrode formed on the high dielectric constant gate insulating...
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7573110 |
Method of fabricating semiconductor devices
Method of fabricating TFTs (thin-film transistors) having a crystallized silicon film and a gate-insulating film. First, an amorphous silicon film is formed on an insulating substrate. A first...
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7573081 |
Method to fabricate horizontal air columns underneath metal inductor
A new method is provided for creating an inductor on the surface of a silicon substrate. The invention provides overlying layers of oxide fins beneath a metal inductor. The oxide fins provide the...
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7573065 |
Semiconductor device evaluation method
An apparatus for evaluating a field-effect transistor includes a pulse generator, a current/voltage converter, a switch and a first constant-voltage source. The pulse generator can be electrically...
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7564108 |
Nitrogen treatment to improve high-k gate dielectrics
A MOSFET having a nitrided gate dielectric and its manufacture are disclosed. The method comprises providing a substrate and depositing a non-high-k dielectric material on the substrate. The...
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7560344 |
Semiconductor device having a pair of fins and method of manufacturing the same
Example embodiments relate to a semiconductor device and a method of manufacturing the same. A semiconductor device according to example embodiments may have reduced disturbances during reading...
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7557416 |
Transistor and CVD apparatus used to deposit gate insulating film thereof
In a transistor adapted to suppress characteristic degradation resulting from fluorine contained in a deposited film, the concentration of fluorine contained in a gate insulating film ( 3 ) is...
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7554161 |
HfAlO3 films for gate dielectrics
A dielectric film containing HfAlO 3 and a method of fabricating such a dielectric film produce a reliable gate dielectric having an equivalent oxide thickness thinner than attainable using SiO 2...
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7554156 |
Semiconductor device having a field effect transistor using a high dielectric constant gate insulating film and manufacturing method of the same
In a method for manufacturing a semiconductor device having an N-channel field effect transistor, the N-channel field effect transistor is formed by a process including the steps of forming a high...
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7547951 |
Semiconductor devices having nitrogen-incorporated active region and methods of fabricating the same
A semiconductor device may include a semiconductor substrate having a first region and a second region. The nitrogen-incorporated active region may be formed within the first region. A first gate...
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7538376 |
Semiconductor integrated circuit device including a semiconductor device having a stable threshold characteristic
A semiconductor integrated circuit device includes a substrate, a nonvolatile memory device formed in a memory cell region of the substrate, and a semiconductor device formed in a device region of...
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7535067 |
Transistor in semiconductor devices and method of fabricating the same
Disclosed are a transistor in the semiconductor device and method of fabricating the same. A gate oxide film is formed using a nitrification oxide film in a low voltage device region and a gate...
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7535066 |
Gate structure and method
A MOSFET structure including silicate gate dielectrics with nitridation treatments of the gate dielectric prior to gate material deposition.
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7535047 |
Semiconductor device containing an ultra thin dielectric film or dielectric layer
An ultra thin dielectric film or dielectric layer on a semiconductor device is disclosed. In one embodiment, an oxide layer is formed over a substrate. A silicon-containing material is deposited...
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7528434 |
Production process for a semiconductor component with a praseodymium oxide dielectric
The invention concerns a semiconductor component and an associated production process having a silicon-bearing layer, a praseodymium oxide layer and a mixed oxide layer arranged between the...
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7525144 |
Insulating film and semiconductor device
An insulating film includes an oxide of a metal selected from Hf and Zr, the oxide being doped by at least one of Ba, Sr and Mg. And the insulating film satisfies the following formula (1):
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7521325 |
Semiconductor device and method for fabricating the same
A permeation preventing film of a silicon nitride film 16 is inserted between a silicon substrate 10 and a High-k gate insulation film 18 to thereby prevent the High-k gate insulation film ...
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7511326 |
ALD of amorphous lanthanide doped TiOx films
The use of atomic layer deposition (ALD) to form an amorphous dielectric layer of titanium oxide (TiO x ) doped with lanthanide elements, such as samarium, europium, gadolinium, holmium, erbium and...
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7511321 |
Method for forming a dielectric layer and related devices
A dielectric layer may be formed by depositing the dielectric layer to an intermediate thickness and applying a nitridation process to the dielectric layer of intermediate thickness. The dielectric...
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7507629 |
Semiconductor devices having an interfacial dielectric layer and related methods
A semiconductor device includes a semiconductor substrate including silicon and an oxide layer on the substrate. The oxide layer includes silicon. An interfacial dielectric layer is disposed on the...
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7504700 |
Method of forming an ultra-thin [[HfSiO]] metal silicate film for high performance CMOS applications and semiconductor structure formed in said method
A semiconductor structure and method of forming the same, comprising forming a uniform buffer layer of diffusion-controlling stable material on top of a base gate dielectric layer, and then forming...
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7504699 |
Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections
A method of forming an air gap or gaps within solid structures and specifically semiconductor structures to reduce capacitive coupling between electrical elements such as metal lines, wherein a...
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7501683 |
Integrated circuit with protected implantation profiles and method for the formation thereof
An integrated circuit structure includes providing a semiconductor substrate and forming at least one oxide-nitride-oxide dielectric layer above the semiconductor substrate. At least one...
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7498643 |
Semiconductor device and method for manufacturing the same
It is possible to prevent the deterioration of device characteristic as much as possible. A semiconductor device includes: a semiconductor substrate; a gate insulating film provided above the...
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7492006 |
Semiconductor transistors having surface insulation layers and methods of fabricating such transistors
Semiconductor devices having a transistor and methods of fabricating such devices are disclosed. The device may include a gate pattern formed on a substrate, spacers formed on sidewalls of the gate...
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7482623 |
Organic semiconductor film and organic semiconductor device
An organic semiconductor device includes a substrate, a gate electrode formed directly on the substrate , gate insulating film formed directly on the gate electrode, a source electrode and a drain...
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7479684 |
Field effect transistor including damascene gate with an internal spacer structure
A MOSFET is disclosed that comprises a channel between a source extension and a drain extension, a dielectric layer over the channel, a gate spacer structure formed on a peripheral portion of the...
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7473652 |
Organic polymers, electronic devices, and methods
Organic polymers for use in electronic devices, wherein the polymer includes repeat units of the formula:
wherein: each R 1 is independently H, an aryl group, Cl, Br, I, or an organic group...
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7462554 |
Method for forming semiconductor device with modified channel compressive stress
A method for forming a semiconductor device provides for forming a gate region on top of a substrate. Gate sidewall liners are formed on opposed sides of the gate region, the sidewall liners having...
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7459757 |
Transistor structures
The invention encompasses a method of incorporating nitrogen into a silicon-oxide-containing layer. The silicon-oxide-containing layer is exposed to a nitrogen-containing plasma to introduce...
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7456468 |
Semiconductor device including high-k insulating layer and method of manufacturing the same
A semiconductor memory device a first dopant area and a second dopant area, the first dopant area and the second dopant area disposed in a semiconductor substrate, an insulating layer disposed in...
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7449756 |
Semiconductor device with a high-k gate dielectric and a metal gate electrode
A semiconductor device is described. That semiconductor device comprises a high-k gate dielectric layer that is formed on a substrate that applies strain to the high-k gate dielectric layer, and a...
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7446367 |
Reliable gap-filling process and apparatus for performing the process in the manufacturing of semiconductor devices
A reliable gap-filling process is performed in the manufacturing of a semiconductor device. An apparatus for performing the gap-filling process includes a chamber in which a wafer chuck is...
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7436034 |
Metal oxynitride as a pFET material
A compound metal comprising MO x N y which is a p-type metal having a workfunction of about 4.75 to about 5.3, preferably about 5, eV that is thermally stable on a gate stack comprising a high k...
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7427791 |
Method of forming a CMOS structure having gate insulation films of different thicknesses
The semiconductor integrated circuit device employs on the same silicon substrate a plurality of kinds of MOS transistors with different magnitudes of tunnel current flowing either between the...
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7427573 |
Forming composite metal oxide layer with hafnium oxide and titanium oxide
A metal oxide alloy layer comprises a first layer including a first metal oxide and having a first thickness, and a second layer formed on the first layer, the second layer including a second metal...
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7423326 |
Integrated circuits with composite gate dielectric
CMOS gate dielectric made of high-k metal silicates by passivating a silicon surface with nitrogen compounds prior to high-k dielectric deposition. Optionally, a silicon dioxide monolayer may be...
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7417290 |
Air break for improved silicide formation with composite caps
Disclosed is a structure and method for tuning silicide stress and, particularly, for developing a tensile silicide region on a gate conductor of an n-FET in order to optimize n-FET performance....
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