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7625791 |
High-k dielectric metal gate device structure and method for forming the same
A metal gate/high-k dielectric semiconductor device provides an NMOS gate structure and a PMOS gate structure formed on a semiconductor substrate. The NMOS gate structure includes a high-k gate...
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7615827 |
Dual gate dielectric thickness devices and circuits using dual gate dielectric thickness devices
Dual thickness devices and circuits using dual gate thickness devices. The devices include: one or more FETs of a first polarity and one or more FETs of a second and opposite polarity, the one or...
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7612422 |
Structure for dual work function metal gate electrodes by control of interface dipoles
Exemplary embodiments provide structures for dual work function metal gate electrodes. The work function value of a metal gate electrode can be increased and/or decreased by disposing various...
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7612415 |
Method of forming semiconductor device
Embodiments relate to a method of forming a 90 nm semiconductor device, including forming an isolation film within a semiconductor substrate in which a pMOS region and an nMOS region are defined. A...
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7608912 |
Technique for creating different mechanical strain in different CPU regions by forming an etch stop layer having differently modified intrinsic stress
The present invention provides a technique for reducing stress or stress gradients in highly sensitive device regions, such as cache areas, while still providing high transistor performance in...
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7608895 |
Modular CMOS analog integrated circuit and power technology
A family of semiconductor devices is formed in a substrate that contains no epitaxial layer. In one embodiment the family includes a 5V CMOS pair, a 12V CMOS pair, a 5V NPN, a 5V PNP, several forms...
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7608897 |
Sub-surface region with diagonal gap regions
Diagonal deep well region for routing the body-bias voltage for MOSFETS in surface well regions is provided and described.
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7608896 |
Semiconductor device
A semiconductor device has an n-channel MIS transistor and a p-channel MIS transistor on a substrate. The n-channel MIS transistor includes a p-type semiconductor region formed on the substrate, a...
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7605433 |
Modular bipolar-CMOS-DMOS analog integrated circuit and power transistor technology
A family of semiconductor devices is formed in a substrate that contains no epitaxial layer. In one embodiment the family includes a 5V CMOS pair, a 12V CMOS pair, a 5V NPN, a 5V PNP, several forms...
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7605432 |
Modular bipolar-CMOS-DMOS analog integrated circuit and power transistor technology
A family of semiconductor devices is formed in a substrate that contains no epitaxial layer. In one embodiment the family includes a 5V CMOS pair, a 12V CMOS pair, a 5V NPN, a 5V PNP, several forms...
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7605429 |
Hybrid crystal orientation CMOS structure for adaptive well biasing and for power and performance enhancement
The present invention provides a semiconducting structure including a substrate having an SOI region and a bulk-Si region, wherein the SOI region and the bulk-Si region have a same or differing...
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7602023 |
Modular bipolar-CMOS-DMOS analog integrated circuit and power transistor technology
A family of semiconductor devices is formed in a substrate that contains no epitaxial layer. In one embodiment the family includes a 5V CMOS pair, a 12V CMOS pair, a 5V NPN, a 5V PNP, several forms...
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7602024 |
Modular bipolar-CMOS-DMOS analog integrated circuit and power transistor technology
A family of semiconductor devices is formed in a substrate that contains no epitaxial layer. In one embodiment the family includes a 5V CMOS pair, a 12V CMOS pair, a 5V NPN, a 5V PNP, several forms...
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7598545 |
Using metal/metal nitride bilayers as gate electrodes in self-aligned aggressively scaled CMOS devices
The present invention is directed to CMOS structures that include at least one nMOS device located on one region of a semiconductor substrate; and at least one pMOS device located on another region...
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7592675 |
Partial FinFET memory cell
A semiconductor structure includes a semiconductor substrate, a planar PMOS device at a surface of the semiconductor substrate, and an NMOS device at the surface of the semiconductor substrate,...
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7589386 |
Semiconductor device and manufacturing method thereof
A semiconductor device including a first field effect transistor having a source, a first conductivity type drain, a gate, and a first conductivity type channel layer formed beneath the gate and...
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7582522 |
Method and device for CMOS image sensing with separate source formation
A method and device for image sensing. The method includes forming a first well and a second well in a substrate, forming a gate oxide layer on the substrate, and depositing a first gate region and...
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7573104 |
CMOS device on hybrid orientation substrate comprising equal mobility for perpendicular devices of each type
Embodiments herein present device, method, etc. for a hybrid orientation scheme for standard orthogonal circuits. An integrated circuit of embodiments of the invention comprises a hybrid...
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7560782 |
Transistor structure with high input impedance and high current capability
An integrated transistor device is formed in a chip of semiconductor material having an electrical-insulation region delimiting an active area accommodating a bipolar transistor of vertical type...
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7560779 |
Method for forming a mixed voltage circuit having complementary devices
A mixed voltage circuit is formed by providing a substrate ( 12 ) having a first region ( 20 ) for forming a first device ( 106 ), a second region ( 22 ) for forming a second device ( 108 )...
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7547951 |
Semiconductor devices having nitrogen-incorporated active region and methods of fabricating the same
A semiconductor device may include a semiconductor substrate having a first region and a second region. The nitrogen-incorporated active region may be formed within the first region. A first gate...
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7547592 |
PMOS depletable drain extension made from NMOS dual depletable drain extensions
In accordance with an embodiment of the invention, there is an integrated circuit device having a complementary integrated circuit structure comprising a first MOS device. The first MOS device...
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7545004 |
Method and structure for forming strained devices
A method for manufacturing a device includes mapping extreme vertical boundary conditions of a mask layer based on vertical edges of a deposited first layer and a second layer. The mask layer is...
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7545005 |
Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage
A semiconductor device is provided which is capable of avoiding malfunction and latchup breakdown resulting from negative variation of high-voltage-side floating offset voltage (VS). In the upper...
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7545001 |
Semiconductor device having high drive current and method of manufacture therefor
A semiconductor device including an isolation region located in a substrate, an NMOS device located partially over a surface of the substrate, and a PMOS device isolated from the NMOS device by the...
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7538396 |
Semiconductor device and complementary metal-oxide-semiconductor field effect transistor
A semiconductor device includes a substrate, an epitaxial layer, a sinker, an active device, a first buried layer, and a second buried layer. The substrate has a first type conductivity. The...
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7528450 |
Semiconductor device having NMOSFET and PMOSFET and manufacturing method therefor
A element isolation insulating film is formed around the device regions in the silicon substrate. The device regions are formed an n-type diffusion layer region, a p-type diffusion layer region, a...
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7528439 |
Vertical wrap-around-gate field-effect-transistor for high density, low voltage logic and memory array
A vertical transistor having a wrap-around-gate and a method of fabricating such a transistor. The wrap-around-gate (WAG) vertical transistors are fabricated by a process in which source, drain and...
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7521741 |
Shielding structures for preventing leakages in high voltage MOS devices
A high-voltage MOS device includes a first high-voltage well (HVW) region overlying a substrate, a second HVW region overlying the substrate, a third HVW region of an opposite conductivity type as...
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7521325 |
Semiconductor device and method for fabricating the same
A permeation preventing film of a silicon nitride film 16 is inserted between a silicon substrate 10 and a High-k gate insulation film 18 to thereby prevent the High-k gate insulation film ...
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7514728 |
Semiconductor integrated circuit device using four-terminal transistors
In a semiconductor substrate of a first conductivity type, a first well region of the first conductivity type, second well regions of a second conductivity type, and a third well region of the...
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7514755 |
Integrated circuit modification using well implants
A technique for and structures for camouflaging an integrated circuit structure. The integrated circuit structure is formed having a well of a first conductivity type under the gate region being...
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7511347 |
Semiconductor integrated circuit for high-speed, high-frequency signal transmission
A semiconductor integrated circuit comprising: a pair of MOS transistors which are formed in a same well on a semiconductor substrate and arranged adjacent to each other with a distance such that...
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7511348 |
MOS transistors with selectively strained channels
The channels of first and second CMOS transistors can be selectively stressed. A gate structure of the first transistor includes a stressor that produces stress in the channel of the first...
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7504693 |
Dislocation free stressed channels in bulk silicon and SOI CMOS devices by gate stress engineering
Structures and methods of manufacturing are disclosed of dislocation free stressed channels in bulk silicon and SOI (silicon on insulator) CMOS (complementary metal oxide semiconductor) devices by...
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7495291 |
Strained dislocation-free channels for CMOS and method of manufacture
A semiconductor device and method of manufacturing a semiconductor device. The semiconductor device includes channels for a pFET and an nFET. An SiGe layer is grown in the channel of the nFET...
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7485931 |
Semiconductor integrated circuit
A semiconductor integrated circuit has complementary field-effect transistors, one formed in a semiconductor substrate, the other formed in a well in the substrate, and has four power-supply...
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7482657 |
Balanced cells with fabrication mismatches that produce a unique number generator
A static random access memory (SRAM) is laid out to be balanced so that, when power is applied to the SRAM, the cells of the SRAM have no preferred logic state. In addition, the SRAM is fabricated...
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7482671 |
MOS semiconductor device isolated by a device isolation film
A MOS semiconductor device isolated by a trench device isolation region includes a p-channel MOS field effect transistor having a source/drain region with a length in the channel direction that is...
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7442996 |
Structure and method for enhanced triple well latchup robustness
Disclosed is a triple well CMOS device structure that addresses the issue of latchup by adding an n+ buried layer not only beneath the p-well to isolate the p-well from the p− substrate but also...
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7439124 |
Method of manufacturing a semiconductor device and semiconductor device
Method of manufacturing a semiconductor device includes: forming a substrate protection film to cover an n-type FET forming region having a first gate electrode and a p-type FET forming region...
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7439590 |
Semiconductor device
A semiconductor device features connecting gate patterns of all transistors to a N+ or +P junction by the first connected wiring layer to prevent degradation of characteristics of the semiconductor...
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7439140 |
Formation of standard voltage threshold and low voltage threshold MOSFET devices
Wells are formed in a substrate where standard Vt and low Vt devices of both a first and second type are to be fabricated. Wells defining the locations of first type standard Vt devices are masked,...
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7432553 |
Structure and method to optimize strain in CMOSFETs
A semiconductor structure of strained MOSFETs, comprising both PMOSFETs and NMOSFETS, and a method for fabricating strained MOSFETs are disclosed that optimize strain in the MOSFETs, and more...
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7423319 |
LDPMOS structure with enhanced breakdown voltage
A semiconductor structure includes a first well region of a first conductivity type overlying a substrate, a second well region of a second conductivity type opposite the first conductivity type...
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7420250 |
Electrostatic discharge protection device having light doped regions
Provided are an electrostatic discharge (ESD) protection device and a method for making such a device. In one example, the ESD protection device includes a Zener diode region formed in a substrate...
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7414293 |
Structure and method of applying localized stresses to the channels of PFET and NFET transistors for improved performance
A semiconductor device has an n channel conductivity type field effect transistor having a channel formation region formed in a first region on one main surface of a semiconductor substrate and a p...
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7412122 |
Integrated multichannel laser driver and photodetector receiver
An integrated circuit cast on a single die having a plurality of receivers in a receiver region, a plurality of transmitters in a transmitter region, and a spatial separation region having a...
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7410855 |
Semiconductor device
A semiconductor device includes a semiconductor substrate, an nMISFET formed on the substrate, the nMISFET including a first dielectric formed on the substrate and a first metal gate electrode...
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7411253 |
CMOS transistors using gate electrodes to increase channel mobilities by inducing localized channel stress
A semiconductor device includes an n channel conductivity type FET having a channel formation region formed in a first region on a main surface of a semiconductor substrate and a p channel...
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