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7619288 |
Thin film transistor substrate, liquid crystal display device provided with such thin film transistor substrate and method for manufacturing thin film transistor substrate
A method for manufacturing a thin film transistor substrate includes a step of forming a plurality of island-like semiconductor films above an insulating transparent substrate; a step of forming a...
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7615426 |
PMOS transistor with discontinuous CESL and method of fabrication
A transistor having a discontinuous contact etch stop layer comprising: a substrate having a surface, a gate dielectric on said surface of said substrate, a gate electrode on said gate dielectric,...
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7605038 |
Semiconductor device and manufacturing method thereof
A high voltage semiconductor deice and a manufacturing method thereof are provided. The high voltage semiconductor device comprises: second conductive type drift regions disposed spaced from each...
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7602019 |
Drive circuit and drain extended transistor for use therein
A transistor comprises a source region of a first conductivity type and electrically communicating with a first semiconductor region. The transistor also comprises a drain region of the first...
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7592669 |
Semiconductor device with MISFET that includes embedded insulating film arranged between source/drain regions and channel
With the objective of suppressing or preventing a kink effect in the operation of a semiconductor device having a high breakdown voltage field effect transistor, n + type semiconductor regions,...
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7589373 |
Semiconductor device
The present invention provides a semiconductor device, which includes a substrate and a sensing memory device. The substrate includes a metal-oxide-semiconductor transistor having a gate. The...
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7586153 |
Technique for forming recessed strained drain/source regions in NMOS and PMOS transistors
By forming a strained semiconductor layer in a PMOS transistor, a corresponding compressively strained channel region may be achieved, while, on the other hand, a corresponding strain in the NMOS...
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7569856 |
Semiconductor device and method for manufacturing the same
A TFT formed on an insulating substrate source, drain and channel regions, a gate insulating film formed on at least the channel region and a gate electrode formed on the gate insulating film....
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7560734 |
Semiconductor device and manufacturing method thereof
In a semiconductor device, typically an active matrix display device, the structure of TFTs arranged in the respective circuits are made suitable in accordance with the function of the circuit, and...
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7554156 |
Semiconductor device having a field effect transistor using a high dielectric constant gate insulating film and manufacturing method of the same
In a method for manufacturing a semiconductor device having an N-channel field effect transistor, the N-channel field effect transistor is formed by a process including the steps of forming a high...
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7544997 |
Multi-layer source/drain stressor
A method for forming a semiconductor device includes forming a recess in a source region and a recess in a drain region of the semiconductor device. The method further includes forming a first...
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7541653 |
Mask ROM devices of semiconductor devices and method of forming the same
Disclosed are a mask ROM device and a method of forming the same. This device includes a plurality of cells. At least one among the plurality of cells is programmed. The programmed cell includes a...
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7538387 |
Stack SiGe for short channel improvement
A semiconductor structure includes a first compound layer including an element, and a first impurity having a first impurity concentration; and a second compound layer including the element and a...
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7535058 |
Lateral DMOS structure
A lateral DMOS structure includes a light doped p-type region beneath and near the gate at the drain side. The electric field on the surface near the gate is reduced. Thus the electric field near...
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7531435 |
Semiconductor device and manufacturing method of the same
In consideration of an optimum combination of impurities used for the purpose of forming an extension region ( 13 ) and a pocket region ( 11 ) and further inhibiting impurity diffusion in the...
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7528445 |
Wing gate transistor for integrated circuits
A system is provided for forming a semiconductor device. Layers of gate dielectric material, gate material, and cap material are formed on a semiconductor substrate. The cap material and a portion...
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7525165 |
Light emitting device and manufacturing method thereof
The light emitting device according to the present invention is characterized in that a gate electrode comprising a plurality of conductive films is formed, and concentrations of impurity regions...
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7525150 |
High voltage double diffused drain MOS transistor with medium operation voltage
A method of fabricating a high voltage MOS transistor with a medium operation voltage on a semiconductor wafer. The transistor has a double diffused drain (DDD) and a medium operation voltage such...
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7514763 |
Semiconductor device and manufacturing method for the same
A semiconductor device includes a first diffusion region including germanium atoms and first impurity atoms, provided on a surface layer of a semiconductor substrate, the first impurity atoms...
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7514744 |
Semiconductor device including carrier accumulation layers
A semiconductor device includes a gate structure on a channel region of a semiconductor substrate adjacent to a source/drain region therein and a surface insulation layer directly on the...
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7511340 |
Semiconductor devices having gate structures and contact pads that are lower than the gate structures
Semiconductor devices have gate structures on a semiconductor substrate with first spacers on sidewalls of the respective gate structures. First contact pads are positioned between the gate...
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7507607 |
Method of forming a silicide bridged anti-fuse with a tungsten plug metalization process
A silicide bridged anti-fuse and a method of forming the anti-fuse are disclosed. The silicide bridged anti-fuse can be formed with a tungsten plug metalization process that does not require any...
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7495280 |
MOS devices with corner spacers
A MOS device having corner spacers and a method for forming the same are provided. The method includes forming a gate structure overlying a substrate, forming a first dielectric layer over the gate...
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7492029 |
Asymmetric field effect transistors (FETs)
A semiconductor structure. The structure includes (a) a semiconductor channel region, (b) a semiconductor source block in direct physical contact with the semiconductor channel region; (c) a source...
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7492006 |
Semiconductor transistors having surface insulation layers and methods of fabricating such transistors
Semiconductor devices having a transistor and methods of fabricating such devices are disclosed. The device may include a gate pattern formed on a substrate, spacers formed on sidewalls of the gate...
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7473976 |
Lateral power transistor with self-biasing electrodes
A semiconductor power transistor includes a drift region of a first conductivity type and a well region of a second conductivity type in the drift region such that the well region and the drift...
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7465978 |
Field effect transistor with a high breakdown voltage and method of manufacturing the same
An electric field effect transistor of high breakdown voltage and a method of manufacturing the same are disclosed. A recessed portion is formed at the channel region and is filled by a protective...
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7456430 |
Semiconductor device and method for fabricating the same
The invention primarily provides gate electrodes and gate wirings permitting large-sized screens for active matrix-type display devices, wherein, in order to achieve this object, the construction...
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7453120 |
Semiconductor structure
A method for fabricating a semiconductor structure is described. A substrate is provided, having thereon a gate structure and a spacer on the sidewall of the gate structure and having therein an...
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7446377 |
Transistors and manufacturing methods thereof
Transistors and manufacturing methods thereof are disclosed. An example transistor includes a semiconductor substrate divided into device isolation regions and a device active region. The example...
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7446375 |
Quasi-vertical LDMOS device having closed cell layout
A low voltage power device includes a plurality of quasi-vertical LDMOS device cells. A conductive trench sinker is formed through the epitaxial layer and adjacent a selected one of the source and...
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7442991 |
Display including casing and display unit
This invention provides a semiconductor device having high operation performance and high reliability. An LDD region 707 overlapping with a gate wiring is arranged in an n-channel TFT 802 ...
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7439124 |
Method of manufacturing a semiconductor device and semiconductor device
Method of manufacturing a semiconductor device includes: forming a substrate protection film to cover an n-type FET forming region having a first gate electrode and a p-type FET forming region...
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7436026 |
Semiconductor device comprising a superlattice channel vertically stepped above source and drain regions
A semiconductor device may include a semiconductor substrate and at least one metal oxide semiconductor field-effect transistor (MOSFET). The at least one MOSFET may include spaced apart source and...
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7429771 |
Semiconductor device having halo implanting regions
A MIS-type semiconductor device includes a p-type semiconductor substrate, a gate insulating film formed on the semiconductor substrate, a gate electrode formed on the gate insulating film, and...
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7429769 |
Recessed channel field effect transistor (FET) device
A method for forming a field effect transistor device employs a self-aligned etching of a semiconductor substrate to form a recessed channel region in conjunction with a pair of raised source/drain...
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RE40486 |
Self-aligned non-volatile memory cell
Disclosed is a self-aligned non-volatile memory cell including a small sidewall spacer electrically coupled and being located next to a main floating gate region. Both the small sidewall spacer and...
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7405458 |
Asymmetric field transistors (FETs)
A semiconductor structure and a method for forming the same. The structure includes (a) a semiconductor channel region, (b) a semiconductor source block in direct physical contact with the...
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7405450 |
Semiconductor devices having high conductivity gate electrodes with conductive line patterns thereon
Semiconductor devices that include a semiconductor substrate and a gate line are provided. The gate line is on the semiconductor substrate and includes a gate insulation pattern and a gate...
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7400018 |
End of range (EOR) secondary defect engineering using chemical vapor deposition (CVD) substitutional carbon doping
A method for incorporating carbon into a wafer at the interstitial a-c silicon interface of the halo doping profile is achieved. A bulk silicon substrate is provided. A carbon-doped silicon layer...
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7396717 |
Method of forming a MOS transistor
A method of forming a MOS transistor, in which a co-implantation is performed to implant an implant into a source region and a drain region or a halo implanted region to effectively prevent dopants...
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7388228 |
Display device and method of manufacturing the same
Thin film transistors for a display device each include a semiconductor layer made of polysilicon having a channel region, drain and source regions at both sides of the channel region and doped...
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7382021 |
Insulated gate field-effect transistor having III-VI source/drain layer(s)
A transistor includes one or more channel taps containing a stack consisting at least in part of a semiconductor an interfacial III-VI layered compound and a conductor. The III-VI compound consists...
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7365390 |
Method of fabricating recess transistor in integrated circuit device and recess transistor in integrated circuit device fabricated by the same
Provided is a method of fabricating a recess transistor in an integrated circuit device. In the provided method, a device isolation region, which contacts to the sidewall of a gate trench and a...
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7355245 |
Structure for reducing overlap capacitance in field effect transistors
A field effect transistor (FET) device includes a gate conductor formed over a semiconductor substrate, a source region having a source extension that overlaps and extends under the gate conductor,...
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7348631 |
Thin film transistor substrate and manufacturing method for the same
A thin film transistor substrate is provided whose structure allows for the formation of (i) a thick gate insulating film, (ii) a high pressure resistance TFT having a LDD region of a GOLD...
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7339234 |
Semiconductor device and fabrication process thereof, and application thereof
An LDMOS transistor includes a gate insulation film formed on a semiconductor substrate, a gate electrode formed on the gate insulation film, a drain well of a first conductivity type formed in the...
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7339230 |
Structure and method for making high density mosfet circuits with different height contact lines
Embodiments herein present a structure, method, etc. for making high density MOSFET circuits with different height contact lines. The MOSFET circuits include a contact line, a first gate layer...
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7329571 |
Technique for providing multiple stress sources in NMOS and PMOS transistors
By combining a plurality of stress inducing mechanisms in each of different types of transistors, a significant performance gain may be obtained, thereby providing enhanced flexibility in adjusting...
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7326975 |
Buried channel type transistor having a trench gate and method of manufacturing the same
In a method of manufacturing a buried channel type transistor, a trench is formed at a surface portion of a substrate. A first and a second threshold voltage control regions are formed at portions...
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