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7615822 |
Diffused drain transistor
A transistor has a source that includes a first impurity region with a first volume and a first surface area on a surface of the transistor. The transistor also has a drain that includes a second...
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7615426 |
PMOS transistor with discontinuous CESL and method of fabrication
A transistor having a discontinuous contact etch stop layer comprising: a substrate having a surface, a gate dielectric on said surface of said substrate, a gate electrode on said gate dielectric,...
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7608895 |
Modular CMOS analog integrated circuit and power technology
A family of semiconductor devices is formed in a substrate that contains no epitaxial layer. In one embodiment the family includes a 5V CMOS pair, a 12V CMOS pair, a 5V NPN, a 5V PNP, several forms...
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7605428 |
High-voltage depletion mode MOSFET
All low-temperature processes are used to fabricate a variety of semiconductor devices in a substrate the does not include an epitaxial layer. The devices include a non-isolated lateral DMOS, a...
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7602016 |
Semiconductor apparatus and method of manufacturing the same
A semiconductor apparatus is disclosed. The semiconductor apparatus comprises a gate electrode formed on a surface of a semiconductor substrate with a gate insulating film provided therebetween....
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7598568 |
Semiconductor apparatus and method of manufacturing the same
A semiconductor apparatus is disclosed. The semiconductor apparatus comprises a gate electrode formed on a surface of a semiconductor substrate with a gate insulating film provided therebetween....
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7579651 |
Semiconductor device
In a semiconductor device of the present invention, a thin gate oxide film is formed on a P-type diffusion layer. On the gate oxide film, a gate electrode is formed. N-type diffusion layers are...
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7576391 |
High-voltage lateral trench MOSFET
All low-temperature processes are used to fabricate a variety of semiconductor devices in a substrate the does not include an epitaxial layer. The devices include a non-isolated lateral DMOS, a...
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7573099 |
Semiconductor device layout and channeling implant process
A device structure and method for forming graded junction using a implant process. Embodiments of the invention comprise implanting ions into said silicon substrate to form doped regions adjacent...
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7569884 |
LDMOS transistor
A lateral DMOS transistor having a uniform distribution of channel impurity concentration includes a drift region of a first conductivity; a body of a second conductivity, the body being disposed...
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7560772 |
Semiconductor integrated circuit device and manufacturing method thereof
After silicon oxide film ( 9 ) is formed on the surface of a semiconductor substrate ( 1 ), the silicon oxide film ( 9 ) in a region in which a gate insulation film having a small effective...
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7550803 |
Vertical double-diffusion metal-oxide-semiconductor transistor device
A vertical double-diffusion metal-oxide-semiconductor (VDMOS) transistor device includes a first conductive type semiconductor substrate, a gate structure formed in a first trench in the first...
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7545003 |
Defect-free source/drain extensions for MOSFETS having germanium based channel regions
A process for forming defect-free source and drain extensions for a MOSFET built on a germanium based channel region deposits a first silicon germanium layer on a semiconductor substrate, deposits...
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7544996 |
Methods of fabricating a semiconductor device having a metal gate pattern
A method of fabricating a semiconductor device having a metal gate pattern is provided in which capping layers are used to control the relative oxidation rates of portions of the metal gate pattern...
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7544995 |
Power converter employing a micromagnetic device
A power converter including a power train, a controller and a driver. In one embodiment, the power train includes a switch that conducts for a duty cycle and provides a regulated output...
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7541653 |
Mask ROM devices of semiconductor devices and method of forming the same
Disclosed are a mask ROM device and a method of forming the same. This device includes a plurality of cells. At least one among the plurality of cells is programmed. The programmed cell includes a...
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7538387 |
Stack SiGe for short channel improvement
A semiconductor structure includes a first compound layer including an element, and a first impurity having a first impurity concentration; and a second compound layer including the element and a...
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7535058 |
Lateral DMOS structure
A lateral DMOS structure includes a light doped p-type region beneath and near the gate at the drain side. The electric field on the surface near the gate is reduced. Thus the electric field near...
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7528442 |
Semiconductor device and manufacturing method thereof
In this invention, the semiconductor device is provided with a gate electrode formed on a gate insulating film in a region sectioned by an element isolation formed on a semiconductor layer of the...
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7525150 |
High voltage double diffused drain MOS transistor with medium operation voltage
A method of fabricating a high voltage MOS transistor with a medium operation voltage on a semiconductor wafer. The transistor has a double diffused drain (DDD) and a medium operation voltage such...
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7521758 |
DMOS device of small dimensions and manufacturing process thereof
In a body of semiconductor material, a field region separates a first active area and a second active area. A drain region is formed in the first active area; a body region is formed in the second...
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7521756 |
DMOS transistor with optimized periphery structure
A lateral DMOS transistor is disclosed that includes a first region of a first conductivity type, which is surrounded on the sides by a second region of a second conductivity type, whereby a...
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7514758 |
Dual-oxide transistors for the improvement of reliability and off-state leakage
The invention provides a transistor having low leakage currents and methods of fabricating the transistor on a semiconductor substrate. The transistor has a gate and a nonuniform gate oxide under...
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7511340 |
Semiconductor devices having gate structures and contact pads that are lower than the gate structures
Semiconductor devices have gate structures on a semiconductor substrate with first spacers on sidewalls of the respective gate structures. First contact pads are positioned between the gate...
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7504692 |
High-voltage field-effect transistor
High-voltage field-effect transistor is provided that includes a drain terminal, a source terminal, a body terminal, and a gate terminal. A gate oxide and a gate electrode, adjacent to the gate...
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7489007 |
High-voltage lateral DMOS device
All low-temperature processes are used to fabricate a variety of semiconductor devices in a substrate the does not include an epitaxial layer. The devices include a non-isolated lateral DMOS, a...
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7485925 |
High voltage metal oxide semiconductor transistor and fabricating method thereof
A high voltage MOS transistor including a substrate, a well, a gate insulation layer, a gate, two drift regions, a channel region, a source/drain region and an isolation structure is provided. The...
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7485923 |
SOI semiconductor device with improved halo region and manufacturing method of the same
A semiconductor device includes a first insulating layer, a semiconductor layer formed on the first insulating layer, a second insulating layer on a part of the semiconductor layer, and a gate...
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7473976 |
Lateral power transistor with self-biasing electrodes
A semiconductor power transistor includes a drift region of a first conductivity type and a well region of a second conductivity type in the drift region such that the well region and the drift...
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7473965 |
Structure of a high breakdown voltage element for use in high power applications
The relationship between a distance Ls between a base layer and an n type buffer layer formed on the surface of a drift layer and the thickness t of a semiconductor substrate in contact with the...
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7473964 |
Semiconductor device
A semiconductor device includes: an insulating layer; a semiconductor fin protruding from the insulating layer, extending in a first direction parallel to a major surface of the insulating layer,...
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7465978 |
Field effect transistor with a high breakdown voltage and method of manufacturing the same
An electric field effect transistor of high breakdown voltage and a method of manufacturing the same are disclosed. A recessed portion is formed at the channel region and is filled by a protective...
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7456448 |
Semiconductor device and method for producing the same
A semiconductor device, including a first MIS-type transistor formed in a first region of a semiconductor region, the first region being of a first conductivity type, the first MIS-type transistor...
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7453120 |
Semiconductor structure
A method for fabricating a semiconductor structure is described. A substrate is provided, having thereon a gate structure and a spacer on the sidewall of the gate structure and having therein an...
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7446375 |
Quasi-vertical LDMOS device having closed cell layout
A low voltage power device includes a plurality of quasi-vertical LDMOS device cells. A conductive trench sinker is formed through the epitaxial layer and adjacent a selected one of the source and...
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7439183 |
Method of manufacturing a semiconductor device, and a semiconductor substrate
A method of manufacturing a semiconductor device. In the method, a thin film is formed on an Si substrate having face orientation ( 100 ), that part of the thin film, which lies on an...
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7436024 |
Semiconductor device and method of manufacturing the same
A lateral MOSFET and a method of forming thereof includes a p-type semiconductor substrate, a first n-type well in the surface portion of the semiconductor substrate, an n + -type drain region in...
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7427795 |
Drain-extended MOS transistors and methods for making the same
Drain-extended MOS transistors (T 1 , T 2 ) and semiconductor devices ( 102 ) are described, as well as fabrication methods ( 202 ) therefor, in which a p-buried layer ( 130 ) is formed prior to...
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RE40486 |
Self-aligned non-volatile memory cell
Disclosed is a self-aligned non-volatile memory cell including a small sidewall spacer electrically coupled and being located next to a main floating gate region. Both the small sidewall spacer and...
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7420247 |
Power LDMOS transistor
A LDMOS transistor comprises a trench formed through the epitaxial layer at least to the top surface of the substrate, the trench having a bottom surface and a sidewall contacting the source region...
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7417277 |
Semiconductor integrated circuit and method of manufacturing the same
Conventional capacitors constituted of a FET incur degradation in frequency response. A semiconductor integrated circuit includes a semiconductor substrate, an N-type FET, a P-type FET, and...
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7408234 |
Semiconductor device and method for manufacturing the same
An object of the present invention is to provide a semiconductor device that is able to realize a low on-resistance maintaining a high drain-to-source breakdown voltage, and a method for...
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7405450 |
Semiconductor devices having high conductivity gate electrodes with conductive line patterns thereon
Semiconductor devices that include a semiconductor substrate and a gate line are provided. The gate line is on the semiconductor substrate and includes a gate insulation pattern and a gate...
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7405443 |
Dual gate lateral double-diffused MOSFET (LDMOS) transistor
Method and apparatus for providing a lateral double-diffused MOSFET (LDMOS) transistor having a dual gate. The dual gate includes a first gate and a second gate. The first gate includes a first...
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7391080 |
LDMOS transistor device employing spacer structure gates
An integrated LDMOS transistor comprises a semiconductor substrate ( 11 ), an LDMOS gate region ( 17 ), LDMOS source ( 14 ) and drain ( 15 ) regions, and a channel region ( 13 ) arranged beneath...
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7381621 |
Methods of fabricating high voltage MOSFET having doped buried layer
A MOSFET includes an insulated gate electrode on a surface of a semiconductor substrate having an impurity region of first conductivity type therein that extends to the surface. Source and drain...
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7378323 |
Silicide process utilizing pre-amorphization implant and second spacer
A gate electrode is formed on a substrate with a gate insulating layer therebetween. A liner is then deposited on sidewalls of the gate electrode. Source/drain extensions are implanted into the...
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7372105 |
Semiconductor device with power supply impurity region
A semiconductor device in which by fixing a well at a predetermined potential via a contact within a memory cell, latch-up immunity is improved without accompanying increase in the area of the...
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7372104 |
High voltage CMOS devices
A transistor suitable for high-voltage applications is provided. The transistor is formed on a substrate having a deep well of a first conductivity type. A first well of the first conductivity type...
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7372083 |
Embedded silicon-controlled rectifier (SCR) for HVPMOS ESD protection
A high voltage p-type metal oxide semiconductor (HVPMOS) device having electrostatic discharge (ESD) protection functions and a method of forming the same are provided. The HVPMOS includes a PMOS...
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