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7179710 |
Method for fabricating NAND type dual bit nitride read only memory
A NAND type dual bit nitride read only memory and a method for fabricating thereof are provided. Firstly, a plurality of isolation layers, which are spaced and parallel to each other are formed in...
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7180128 |
Non-volatile memory, non-volatile memory array and manufacturing method thereof
A non-volatile memory is provided. A plurality of stacked gate structure is formed on the substrate. The stacked gate structure includes, upward from the substrate surface, a select gate dielectric...
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7176516 |
Structure and fabricating method to make a cell with multi-self-alignment in split gate flash
A new structure is disclosed for semiconductor devices with which contact regions are self-aligned to conductive lines. Openings to a gate oxide layer, in partially fabricated devices on a silicon...
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7176519 |
Memory cell, memory cell arrangement and method for the production of a memory cell
A memory cell, memory cell arrangement, and method for producing a memory cell arrangement is described where electric charge carriers can be introduced from a trench structure, which delivers...
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7176518 |
Nonvolatile flash memory device
A method of fabricating nonvolatile memory devices is disclosed. A nonvolatile memory device comprises: a polysilicon gate on a semiconductor substrate; a gate oxide layer between the polysilicon...
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7177505 |
MEMS-based actuator devices using electrets
Electrets are used in a variety of MEMS-based actuator devices. The electret is able to store electrical charge for a long time with negligible charge leakage. Therefore, when an electret is...
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7176077 |
Methods of forming memory cells and arrays having underlying source-line connections
Floating-gate memory cells having a trench source-line contact are suited for increased packing densities without a need for low-resistance ground straps placed at regular intervals across a memory...
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7173304 |
Method of manufacturing devices comprising conductive nano-dots, and devices comprising same
A method is disclosed that may include forming a first layer of insulating material above a semiconducting substrate, forming an aluminum oxide layer above the first layer of insulating material,...
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7173296 |
Reduced hydrogen sidewall spacer oxide
An embodiment of the invention is a method of making a semiconductor structure 10 where the spacer oxide layer 90 is formed by a hydrogen free precursor CVD process. Another embodiment of the...
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7172937 |
Method of manufacturing a non-volatile memory cell
The present invention relates to a method of manufacturing a non-volatile memory cell. The method comprises forming an ONO stack and a mask formed on the ONO stack, providing a first etching...
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7170129 |
Non-volatile memory, fabrication method thereof and operation method thereof
A method of fabrication a non-volatile memory is provided. A stacked structure is formed on a substrate, the stacked structure including a gate dielectric layer and a control gate. Then, a first...
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7166886 |
DRAM cells with repressed floating gate memory, low tunnel barrier interpoly insulators
Structures and methods for memory cells having a volatile and a non-volatile component in a single memory cell are provided. The memory cell includes a first source/drain region and a second...
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7164294 |
Method for forming programmable logic arrays using vertical gate transistors
One aspect disclosed herein relates to a method for forming a programmable logic array. Various embodiments of the method include forming a first logic plane and a second logic plane, each...
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7160777 |
Split-gate nonvolatile memory device and method of manufacturing the same
Embodiments of the invention include a gate insulating layer formed on a semiconductor substrate; a spacer-type floating gate and a spacer-type dummy pattern, which are formed on the gate...
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7160774 |
Method of forming polysilicon layers in non-volatile memory
In accordance with an embodiment of the present invention, a semiconductor structure includes an undoped polysilicon layer, a doped polysilicon layer in contact with the undoped polysilicon layer,...
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7157768 |
Non-volatile flash semiconductor memory and fabrication method
In a semiconductor memory, a plurality of FinFET arrangements with trapping layers or floating gate electrodes as storage mediums are present on respective top sides of fins made from semiconductor...
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7157767 |
Semiconductor memory element, semiconductor memory arrangement, method for fabricating a semiconductor memory element and method for operating a semiconductor memory element
A semiconductor memory element has a substrate, in which a source region and a drain region are formed, a floating gate electrically insulated from the substrate, and a tunnel barrier arrangement,...
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7157332 |
Method for manufacturing flash memory cell
Disclosed is a method for manufacturing a flash memory cell. A structure in which a floating gate, an ONO dielectric film and a control gate are stacked is formed by means of a gate mask process...
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7154138 |
Transistor-arrangement, method for operating a transistor arrangement as a data storage element and method for producing a transistor-arrangement
The invention relates to a transistor arrangement having a substrate and a vertical transistor comprising: a first electrode region, a second electrode region arranged essentially above the latter,...
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7154153 |
Memory device
A floating gate transistor has a reduced barrier energy at an interface with an adjacent gate insulator, allowing faster charge transfer across the gate insulator at lower voltages. Data is stored...
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7151292 |
Dielectric memory cell structure with counter doped channel region
A charge trapping dielectric memory cell array comprises a plurality of parallel bit lines implanted within the lightly doped substrate. The parallel bit lines define a plurality of channel regions...
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7148106 |
Methods of fabricating non-volatile memory devices including nanocrystals
Non-volatile memory devices can be fabricated by forming a tunnel dielectric layer on a semiconductor substrate, subjecting the semiconductor substrate having the tunnel dielectric layer to an...
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7148578 |
Semiconductor multi-chip package
A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is...
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7149113 |
Semiconductor integrated circuit device
To reduce cost of defect redundancy and trimming in a semiconductor integrated circuit having multiple layer wirings and copper wirings, an address for salvaging a defect of a memory cell array in...
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7148537 |
Semiconductor memory device
A semiconductor memory device includes a semiconductor substrate, a gate insulating film on the semiconductor substrate, a gate electrode on the gate insulating film, control insulating films...
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7145208 |
MOS transistor having a work-function-dominating layer
A MOS transistor including a substrate, a gate dielectric layer on the substrate, a stacked gate on the gate dielectric layer, and a source/drain in the substrate beside the stacked gate is...
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7145200 |
Nonvolatile semiconductor memory device
A nonvolatile semiconductor memory device includes a semiconductor substrate, a memory cell region which is disposed on the semiconductor substrate and has a transistor array of a stacked gate...
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7144773 |
Method for preventing trenching in fabricating split gate flash devices
A method for forming a split gate flash device is provided. In one embodiment, a semiconductor substrate with a dielectric layer formed thereover is provided. A conductor layer is formed overlying...
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7141838 |
Buried word line memory integrated circuit system
An integrated circuit system includes providing a semiconductor substrate and forming buried word lines in the semiconductor substrate with the buried word lines including vertical charge-trapping...
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7141835 |
Semiconductor memory device having memory cells requiring no refresh operation
A memory cell includes first and second data holding portions for holding stored data and its inverted data. First and second p channel TFT compensate for charges leaked from first and second...
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7141474 |
Fabrication method of a nonvolatile semiconductor memory
A method of fabricating a nonvolatile semiconductor memory including the steps of: sequentially forming a gate insulating layer and a first conductive layer of a floating gate on a semiconductor...
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7141850 |
Gated semiconductor assemblies and methods of forming gated semiconductor assemblies
In one aspect, the invention includes a method of forming a gated semiconductor assembly, comprising: a) forming a silicon nitride layer over and against a floating gate; and b) forming a control...
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7141824 |
Transistor with variable electron affinity gate
A SiC material composition is selected to establish the barrier energy between the SIC gate and a gate insulator. Various embodiments of selected SiC material composition include a memory...
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7138680 |
Memory device with floating gate stack
A memory device comprises a substrate including isolation regions and active regions, and a floating gate stack proximate the substrate. The floating gate stack comprises a first high-k dielectric...
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7138679 |
Semiconductor memory device
A semiconductor memory device comprises a silicon substrate having a main surface, a trench formed on the silicon substrate to open in the main surface and a memory cell formed on the trench. The...
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7135736 |
Semiconductor device
This specification relates to a semiconductor device that comprises a semiconductor substrate 11 , a source region 12 and a drain region 13 , which are formed on the semiconductor substrate 11...
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7135734 |
Graded composition metal oxide tunnel barrier interpoly insulators
Structures and methods for programmable array type logic and/or memory devices with graded composition metal oxide tunnel barrier intergate insulators are provided. The programmable array type...
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7132711 |
Programmable array logic or memory with p-channel devices and asymmetrical tunnel barriers
Structures and methods for programmable array type logic and/or memory with p-channel devices and asymmetrical low tunnel barrier intergate insulators are provided. The programmable array type...
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7132718 |
Fabrication method and structure of semiconductor non-volatile memory device
A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor substrate via a gate insulator, and a...
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7132331 |
Non-volatile semiconductor memory devices having self-aligned gate conductive layers and methods of fabricating such devices
A semiconductor device having a self-aligned gate conductive layer and a method of fabricating the same are disclosed. In embodiments of the present invention, a plurality of field isolation...
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7129540 |
Semiconductor circuit arrangement with trench isolation and fabrication method
An explanation is given of, inter alia, a circuit arrangement containing a trench which penetrates through a charge-storing layer ( 18 ) and a doped semiconductor layer ( 14 ). The trench...
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7126183 |
Programmable array logic or memory with p-channel devices and asymmetrical tunnel barriers
Structures and methods for programmable array type logic and/or memory with p-channel devices and asymmetrical low tunnel barrier intergate insulators are provided. The programmable array type...
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7126184 |
Nonvolatile semiconductor memory device and a method of the same
A reduction in size nonvolatile semiconductors for use in a memory device and an increase in the capacity thereof are promoted. Each memory cell of a flash memory is provided with a field effect...
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7125769 |
Method of fabricating flash memory device
A method of fabricating a flash memory devices disclosed wherein, upon formation of sidewall oxide films, a regrown thickness of a screen oxide film is controlled. The width of an element isolation...
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7122866 |
Semiconductor memory device with a stacked gate including a floating gate and a control gate and method of manufacturing the same
A semiconductor memory device includes first and second MOS transistors. The first MOS transistor is formed on a region enclosed by a first element isolating region and includes a first gate...
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7119384 |
Field effect transistor and method for fabricating it
The invention relates to a field effect transistor in which the planar channel region on the upper surface of the elevation is extended in width by means of additional vertical channel regions on...
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7118962 |
Nonvolatile memory device and method for manufacturing the same
The present invention discloses a nonvolatile memory device which can improve the data storage capacity without increasing the surface area of the device, and a method for manufacturing the same. ...
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7119393 |
Transistor having fully-depleted junctions to reduce capacitance and increase radiation immunity in an integrated circuit
A floating-gate transistor for an integrated circuit is formed on a p-type substrate. An n-type region is disposed over the p-type substrate. A p-type region is disposed over the n-type region....
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7115940 |
Semiconductor device
A semiconductor device includes: a silicon substrate, having a main surface, in which trenches are formed; element isolation oxide films filling in trenches; a tunnel oxide film, formed on main...
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7115470 |
Methods of fabricating flash memory cell having split-gate structure using spacer oxidation process
There is provided a method of fabricating a split-gate flash memory cell using a spacer oxidation process. An oxidation barrier layer is formed on a floating gate layer, and an opening to expose a...
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