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6320238 |
Gate structure for integrated circuit fabrication
The present invention relates to a gate stack structure having a dielectric material layer disposed on a substrate with a gate electrode disposed thereon. In an exemplary embodiment, the dielectric...
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6316798 |
Ferroelectric memory device and method for manufacturing the same
A long life ferroelectric memory device using a thin ferroelectric film capacitor as a memory capacitor is obtained by disposing one or a plurality of degradation preventive layers on an upper...
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6316802 |
Easy to manufacture integrated semiconductor memory configuration with platinum electrodes
The integrated semiconductor memory configuration has a semiconductor body in which selection transistors and storage capacitors are integrated. The storage capacitors have a dielectric layer...
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6313539 |
Semiconductor memory device and production method of the same
A semiconductor memory device includes: a capacitor formed on a substrate and including a lower electrode, a dielectric film and an upper electrode; a selection transistor formed at the substrate;...
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6313495 |
Stack capacitor with improved plug conductivity
The present invention includes a method of improving conductivity between an electrode and a plug in a stacked capacitor where an oxide has formed therebetween. The method includes the steps of...
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6307228 |
Semiconductor device with perovskite capacitor and its manufacture method
A method of manufacturing a semiconductor device which has the steps of: forming an insulated gate field effect transistor of a first conductivity type on a semiconductor substrate; forming a first...
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6307730 |
Capacitor formed by lower electrode having inner and outer uneven surfaces
A capacitor is constructed by a cylindrical lower capacitor electrode layer having uneven inner and outer surfaces, a capacitor insulating layer formed on the cylindrical lower capacitor electrode...
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6303972 |
Device including a conductive layer protected against oxidation
In a semiconductor device including a first conductive layer, the first conductive layer is treated with a nitrogen/hydrogen plasma before an additional layer is deposited thereover. The treatment...
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6300215 |
Methods of forming integrated circuit capacitors having composite titanium oxide and tantalum pentoxide dielectric layers therein
Methods of forming integrated circuit capacitors (e.g., DRAM capacitors) include the steps of forming a first capacitor electrode (e.g., polysilicon electrode) on a substrate and then forming a...
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6294805 |
Ferroelectric memory devices including capacitors located outside the active area and made with diffusion barrier layers
Integrated circuit ferroelectric memory devices include a pair of spaced apart word lines which cross an elongated active region, a drain region in the active region between the pair of word lines,...
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6291866 |
Zirconium and/or hafnium oxynitride gate dielectric
A field effect semiconductor device comprising a high permittivity zirconium (or hafnium) oxynitride gate dielectric and a method of forming the same are disclosed herein. The device comprises a...
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6291867 |
Zirconium and/or hafnium silicon-oxynitride gate dielectric
A field effect semiconductor device comprising a high permittivity zirconium (or hafnium) silicon-oxynitride gate dielectric and a method of forming the same are disclosed herein. The device...
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6288420 |
Composite iridium-metal-oxygen barrier structure with refractory metal companion barrier
An Ir--M--O composite film has been provided that is useful in forming an electrode of a ferroelectric capacitor, where M includes a variety of refractory metals. The Ir combination film is...
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6285051 |
Semiconductor memory device and method for fabricating the same
A low-leakage-current layer, made of BST in which the content of Ti deviates from its stoichiometric composition, is interposed between a high-dielectric-constant layer, made of BST with the...
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6285050 |
Decoupling capacitor structure distributed above an integrated circuit and method for making same
The present invention describes the use of large thin film (TF) capacitors having capacitance C made in a separate set of TF layers ABOVE the Si and wiring levels of an integrated circuit (IC)....
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6278147 |
On-chip decoupling capacitor with bottom hardmask
An on-chip vertically stacked decoupling capacitor includes a hardmask film formed between the capacitor dielectric and the lower electrode. The manufacturing process used to form the capacitor...
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6278153 |
Thin film capacitor formed in via
There is provided a thin film capacitor including (a) a lower electrode, (b) an insulating layer formed burying the lower electrode therein and formed with a via-hole reaching the lower electrode,...
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6278172 |
Semiconductor device having high-density capacitor elements and manufacturing method thereof
A semiconductor device including a capacitor element which has a high withstand voltage, a large capacitance, and little parasitic resistance and parasitic capacitance. On interlayer insulating...
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6274388 |
Annealing of a crystalline perovskite ferroelectric cell
A method of fabricating a ferroelectric capacitor usable as a memory cell in a non-volatile integrated circuit memory integrated on a silicon substrate, preferably including an intermetallic...
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6274899 |
Capacitor electrode having conductive regions adjacent a dielectric post
A dielectric film (110) is formed overlying a semiconductor device substrate (10). A dielectric post (204) having an outer peripheral boundary having sidewalls is formed over the dielectric film...
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6274453 |
Memory cell configuration and production process therefor
A memory cell configuration with many ferroelectric or dynamic memory cells provided in a semiconductor substrate. Alternating trenches and lands extend parallel in a longitudinal direction of a...
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6275370 |
Electrical connections to dielectric materials
A preferred embodiment of this invention comprises an oxidizable layer (e.g. tantalum 48), an oxygen gettering layer (e.g. platinum/tantalum mixture 34) overlaying the oxidizable layer, a noble...
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6271099 |
Method for forming a capacitor of a DRAM cell
A method for forming a DRAM cell with a crown full metal capacitor electrode with integrated selective tungsten contact hole. When the MOSFET devices are defined, a metal landing pad with...
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6271559 |
Semiconductor memory with information storage capacitance including an electrode containing precious metal and an added element
A semiconductor memory includes a structure in which an insulating film is formed on a transistor constituted by a gate oxide film, a gate electrode and diffusion regions, an information storage...
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6265740 |
Semiconductor device capacitor using a fill layer and a node on an inner surface of an opening
A capacitor of a semiconductor device includes a first insulating layer having a contact hole therethrough and a contact plug that is in the contact hole and electrically connected to a...
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6265260 |
Method for making an integrated circuit capacitor including tantalum pentoxide
A method for making an integrated circuit capacitor which in one embodiment preferably comprises the steps of: forming, adjacent a semiconductor substrate, a first metal electrode comprising a...
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6262462 |
Enhanced dielectric constant gate insulator
A field effect transistor with an enhanced dielectric constant gate insulator including spaced apart source and drain terminals positioned on a substrate structure so as to define a gate area...
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6259125 |
Scalable high dielectric constant capacitor
A capacitor for high density DRAM applications comprises a high-.di-elect cons. capacitor dielectric such as BST or PZT in an arrangement which obviates the need for barrier layers during...
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6259130 |
High density flash memories with high capacitive-couping ratio and high speed operation
The device includes a gate oxide formed on a semiconductor substrate. Oxide regions are respectively formed on the substrate and adjacent to the gate oxide. Textured oxides are formed on the...
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6255688 |
Capacitor having aluminum alloy bottom plate
The present invention provides for use with an integrated circuit, an embedded memory having a transistor in contact with an interconnect formed within a dielectric layer overlaying the transistor....
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6255682 |
Trench DRAM cells with self-aligned field plate
The capacitor includes trenches formed in a semiconductor substrate. Recess portions are formed adjacent to the top portion of the openings of the trenches. An isolation layer is formed on the...
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6246086 |
Structure of capacitor for dynamic random access memory and method of manufacturing thereof
A lower electrode of a capacitor is formed by a cylindrical conductive film and a pillar shaped conductive film disposed coaxially within the cylindrical conductive film. Consequently, in this...
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6246082 |
Semiconductor memory device with less characteristic deterioration of dielectric thin film
There is provided a semiconductor memory device with extremely less deterioration of characteristics of dielectric thin film and with high stability. A TaSiN barrier metal layer 13 is formed on a...
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6242771 |
Chemical vapor deposition of PB5GE3O11 thin film for ferroelectric applications
A method of forming a semiconductor structure having a ferroelectric memory (FEM) gate unit on a substrate of single crystal silicon includes: forming a silicon device area for the FEM gate unit;...
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6239460 |
Semiconductor device which includes a capacitor having a lower electrode formed of iridium or ruthenium
A semiconductor device such as DRAM including a capacitor, wherein a lower electrode of the capacitor is a metal electrode, the metal electrode being mainly composed of ruthenium or iridium, and...
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6239462 |
Semiconductor capacitive device having improved anti-diffusion properties and a method of making the same
The semiconductor device of the invention includes a capacitor device, which is formed on a substrate and which includes a capacitive lower electrode, a capacitive insulating film made of an...
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6239461 |
Semiconductor device capacitor having a recessed contact plug
A capacitor of a semiconductor device includes a first interlayer dielectric film pattern formed on a semiconductor substrate and having a first contact hole therein and a contact plug buried in...
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6235573 |
Methods of forming ferroelectric random access memory devices having shared capacitor electrodes
Methods of forming FRAM devices include the steps of forming first and second field effect access transistors in a semiconductor substrate, forming first and second bit lines (BL) electrically...
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6229174 |
Contact structure for memory device
Disclosed is a method of forming a self-aligned contact to a semiconductor substrate by use of a sacrificial spacer. The sacrificial spacer has the advantage of self aligning metallization to the...
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6229171 |
Storage element for semiconductor capacitor
A storage element of a stacked capacitor having a high dielectric film for a semiconductor device and a method of fabricating the same, the storage element having a storage node comprising a bottom...
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6225668 |
Semiconductor device having a single crystal gate electrode and insulation
In order to easily and accurately manufacture a micromachine comprising a member which is made of a single-crystalline material and having a complicated structure, an uppermost layer (1104) of a...
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6222220 |
Extended trench for preventing interaction between components of stacked capacitors
A stacked capacitor, in accordance with the present invention includes a conductive plug disposed within a trench for connecting to an access device. A barrier is formed on the plug and is disposed...
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6218697 |
Contact in semiconductor memory device
A contact in a semiconductor memory device is formed on an active region of a cell array region, rather than on a sloped area between the cell array region and a core region. Preferably, an...
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6211096 |
Tunable dielectric constant oxide and method of manufacture
A method is shown for manufacturing a semiconductor device in which a silicon oxide film acts as an insulating film for electrically isolating conductive layers included in the semiconductor...
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6198124 |
Method of forming a Ta2O5 dielectric layer, method of forming a capacitor having a Ta2O5 dielectric layer, and capacitor construction
A method of forming a dielectric layer includes, a) chemical vapor depositing a dielectric layer of Ta 2 O 5 atop a substrate; and b) providing a predominately amorphous diffusion barrier layer...
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6198119 |
Ferroelectric element and method of producing the same
A ferroelectric element is provided that can be highly densely integrated having a high Pr and a small Ec by using a ferroelectric thin film of the perovskite structure. A large distortion is...
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6194753 |
Method of forming a perovskite structure semiconductor capacitor
A semiconductor capacitor structure is made from a fabrication method which includes a step for forming an insulation film having a contact hole so that a portion of a substrate is exposed...
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6194752 |
Dielectric device, dielectric memory and method of fabricating the same
A gate insulating layer and a first lower electrode are formed on a channel region of a silicon substrate, and an interlayer insulating film is formed on the silicon substrate so as to cover the...
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6191441 |
Ferroelectric memory device and its drive method
A ferroelectric memory capable of writing data at a small operation voltage has an insulated-gate field effect transistor, a ferroelectric film, and a pair of capacitor electrodes formed on the...
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6191443 |
Capacitors, methods of forming capacitors, and DRAM memory cells
Capacitors and methods of forming capacitors are disclosed. In one implementation, a capacitor comprises a capacitor dielectric layer comprising Ta 2 O 5 formed over a first capacitor electrode....
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