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7015523 |
Ferroelectric memory structure and fabrication method thereof
A ferroelectric memory structure is disclosed. The ferroelectric memory structure includes a substrate, an insulating layer formed on the substrate, a plurality of oxide electrodes formed on the...
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7015525 |
Folded bit line DRAM with vertical ultra thin body transistors
A folded bit line DRAM device is provided. The folded bit line DRAM device includes an array of memory cells. Each memory cell in the array of memory cells includes a pillar extending outwardly...
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7012313 |
MOS transistor in a single-transistor memory cell having a locally thickened gate oxide
A MOS transistor in a single-transistor memory cell having a locally thickened gate oxide, and a process for producing the transistor. The MOS transistor can be used as a selection transistor in a...
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7012296 |
Semiconductor integrated circuit
A multi-storage nonvolatile memory of high density, high speed and high reliability has a memory transistor and switch transistors disposed on both the sides of the memory transistor. The memory...
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7009228 |
Guard ring structure and method for fabricating same
A method for fabricating a guard ring structure for JFETs and MESFETs. Trenches are etched in a semiconductor substrate for fabrication of a gate structure for a JFET or MESFET. At time the gate...
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7009262 |
Semiconductor device and manufacturing method thereof
A manufacturing method of a semiconductor device which can decrease the degradation of an element due to plasma in the LDD formation process is provided. The degradation of an element due to plasma...
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7005716 |
Dual metal gate process: metals and their silicides
Methods for forming dual-metal gate CMOS transistors are described. An NMOS and a PMOS active area of a semiconductor substrate are separated by isolation regions. A metal layer is deposited over a...
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6998681 |
Lateral low-side and high-side high-voltage devices
Lateral high-side and low-side high-voltage devices with low specific on-resistances are made in a first and in a second surface voltage-sustaining region, respectively. In the on-state of...
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6998658 |
Twin NAND device structure, array operations and fabrication method
A method for making a twin MONOS memory array is described where two nitride storage sites lay under the memory cell word gate. The fabrication techniques incorporate self alignment techniques to...
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6995428 |
High voltage LDMOS transistor having an isolated structure
A high voltage LDMOS transistor according to the present invention includes a P-field and divided P-fields in an extended drain region of a N-well. The P-field and divided P-fields form...
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6989559 |
Discrete circuit component having fabrication stage clogged through-holes and process of making the same
A discrete circuit component is made from a substrate with the first and second surfaces thereof each having a corresponding matrix of electrically conductive segments. A plated through-hole...
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6984568 |
Semiconductor memory device having multi-layered storage node contact plug and method for fabricating the same
A semiconductor memory device includes a bit line stack and a storage node contact hole which are aligned at bit line spacers formed at both side walls of the bit line stack and exposes a pad. The...
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6974752 |
Methods of fabricating integrated circuit devices having uniform silicide junctions
A gate having sidewalls is formed on an integrated circuit substrate. A barrier layer spacer is formed on the sidewalls of the gate. A portion of the barrier layer spacer protrudes from the...
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6974982 |
Method of manufacturing semiconductor device and semiconductor device
Impurity ions are implanted into the silicon layer of an SOI substrate to achieve an ion concentration distribution which inhibits for a reduction in threshold voltage (Vth-rolloff) as a gate...
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6967363 |
Lateral diode with multiple spacers
Various circuit devices, including diodes, and methods manufacturing therefor are provided. In one aspect, a method manufacturing is provided that includes forming a gate structure on a...
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6967364 |
Elevated photo diode in an image sensor
The invention provides an elevated photodiode for image sensors and methods of formation of the photodiode. Elevated photodiodes permit a decrease in size requirements for pixel sensor cells while...
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6963094 |
Metal oxide semiconductor transistors having a drain punch through blocking region and methods for fabricating metal oxide semiconductor transistors having a drain punch through blocking region
Metal oxide semiconductor transistors and devices with such transistors and methods of fabricating such transistors and devices are provided. Such transistors may have a silicon well region having...
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6960784 |
Charging sensor method and apparatus
A charging sensor is provided to detect charging signal during the manufacturing process of integrated circuits and various semiconductor devices. In one embodiment, the charging sensor includes a...
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6958500 |
Semiconductor device having low resistivity source and drain electrodes
A dummy gate crossing an active area having ends in contact with an isolation area is formed. A low area lower than a dummy gate is formed in the isolation area. Side walls are formed in the active...
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6956267 |
Semiconductor with a nitrided silicon gate oxide and method
A method of fabricating a transistor includes providing a semiconductor substrate having a surface and forming a nitride layer outwardly of the surface of the substrate. The nitride layer is...
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6952027 |
Semiconductor integrated circuit device and electronic card using the same
A semiconductor integrated circuit device includes a semiconductor region of a first conductivity type. A first insulated-gate field effect transistor having a source/drain region of a second...
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6949815 |
Semiconductor device with decoupling capacitors mounted on conductors
A semiconductor device has an LSI device provided with a plurality of power supply line connection pads and ground line connection pad in a peripheral edge part of a circuit-formation surface,...
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6940110 |
SiC-MISFET and method for fabricating the same
A storage-type SiC-MISFET includes a SiC substrate, an n-type drift layer, a p-type well region, an n-type source region, a SiC channel layer which contains an n-type impurity and is to be a...
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6940143 |
Semiconductor thin-film manufacturing method, semiconductor device manufacturing method, semiconductor device, integrated circuit, electro-optical device, and electronic appliance
According to the semiconductor thin-film and semiconductor device manufacturing method of the present invention, an insulating film having a through-hole between two layers of silicon film is...
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6936875 |
Insulated-gate field-effect transistor, method of fabricating same, and semiconductor device employing same
With the invention, it is possible to avoid deterioration in short-channel characteristics, caused by a silicon germanium layer coming into contact with the channel of a strained SOI transistor....
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6933555 |
Flash EEPROM with function bit by bit erasing
A multi-bit split-gate (MSG) flash cell with multi-shared source/drain, a method of making and a method of programming the same are disclosed. Furthermore, a method of bit-by-bit erasing, in...
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6930335 |
Field effect transistor with metal oxide gate insulator and sidewall insulating film
Provided is a semiconductor device including a silicon substrate, a gate insulator disposed on the silicon substrate and containing a metal oxide, a gate electrode disposed on the gate insulator,...
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6930346 |
Evaporation of Y-Si-O films for medium-K dielectrics
A gate oxide and method of fabricating a gate oxide that produces a more reliable and thinner equivalent oxide thickness than conventional SiO 2 gate oxides are provided. Gate oxides formed from...
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6924536 |
Semiconductor device and its manufacturing method
A semiconductor device and a method of manufacturing the semiconductor device are disclosed. A semiconductor device of one of several disclosed embodiments comprises a semiconductor layer having a...
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6921933 |
Semiconductor device and method of fabricating the same
A gate electrode is formed on a semiconductor substrate with agate insulating film interposed therebetween. A channel region composed of a first-conductivity-type semiconductor layer is formed in a...
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6918284 |
Interconnected networks of single-walled carbon nanotubes
An electronic device having an interconnected network of carbon nanotubes on the surface of a substrate, and two or more electrical leads. The network forms an electrical connection between the leads.
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6919644 |
Semiconductor device manufacturing method and semiconductor device manufactured thereby
A method of manufacturing a semiconductor device involves mounting a semiconductor chip, formed on top with a main electrode and a subelectrode smaller in area than the main electrode, on a die pad...
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6911666 |
Flexible metal foil substrate display and method for forming same
A flexible metal foil substrate organic light emitting diode (OLED) display and a method for forming the same are provided. The method comprises: supplying a metal foil substrate such as titanium...
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6903393 |
Semiconductor device fabricated on surface of silicon having <110> direction of crystal plane and its production method
In a semiconductor device in which a plurality of field effect transistors are formed on a silicon surface having substantially a <110> orientation, the field effect transistors are disposed...
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6897102 |
Process to minimize polysilicon gate depletion and dopant penetration and to increase conductivity
A method of preparing a polysilicon gate to minimize gate depletion and dopant penetration and to increase conductivity is revealed. Several monolayers of atomic are condensed onto a gate...
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6897499 |
Semiconductor integrated circuit device including MISFETs each with a gate electrode extended over a boundary region between an active region and an element isolation trench
A gate electrode of each MISFET is formed on a substrate in an active region whose periphery is defined by an element isolation trench, and crosses the active region so as to extend from one end...
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6893949 |
Semiconductor devices having contact plugs and local interconnects and methods for making the same
Provided is, for example, a method for the fabrication of electrical interconnects in semiconductor devices wherein a substrate including two or more transistors having gate regions wherein the...
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6894334 |
Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same
Herein disclosed is a semiconductor integrated circuit device fabricating process for forming MISFETs over the principal surface in those active regions of a substrate, which are surrounded by...
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6894330 |
Memory configuration and method for reading a state from and storing a state in a ferroelectric transistor
The state of a ferroelectric transistor in a memory cell is read or stored, and the threshold voltage of further ferroelectric transistors in further memory cells in the memory matrix is increased...
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6891213 |
Base current reversal SRAM memory cell and method
A SRAM memory cell including an access device formed on a storage device is described. The storage device has at least two stable states that may be used to store information. In operation, the...
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6891210 |
Semiconductor device having a protection circuit
The semiconductor device includes a plurality of transistors, wherein one of the transistors that has the thinnest gate dielectric layer is selected to serve as a power source protection element,...
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6888197 |
Power metal oxide semiconductor field effect transistor layout
A power MOSFET layout according to one embodiment of the invention comprises a substrate and a plurality of cells. Each of the cells includes a base portion, a plurality of protruding portions...
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6888183 |
Manufacture method for semiconductor device with small variation in MOS threshold voltage
After a MOS type transistor is formed on the surface of a semiconductor substrate, an interlayer insulating film covering the transistor is formed. The insulating film includes a silicon oxide film...
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6888195 |
Semiconductor device with alternating conductivity type layers having different vertical impurity concentration profiles
A power semiconductor device is disclosed, which comprises a semiconductor layer including a first semiconductor layer of a first conductivity type and a second semiconductor layer of a second...
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6885068 |
Storage element and SRAM cell structures using vertical FETs controlled by adjacent junction bias through shallow trench isolation
A new digital follower device is achieved. The digital follower device comprises an n-channel vertical FET device and a p-channel vertical FET device. Each vertical FET device comprises a bulk...
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6881987 |
pMOS device having ultra shallow super-steep-retrograde epi-channel with dual channel doping and method for fabricating the same
The present invention provides a p-channel metal-oxide-semiconductor (pMOS) device having an ultra shallow epi-channel satisfying a high doping concentration required for a device of which gate...
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6881991 |
Dry-etching method and apparatus, photomasks and method for the preparation thereof, and semiconductor circuits and method for the fabrication thereof
A dry-etching method comprises the step of dry-etching a metal thin film as a chromium-containing film, wherein the method is characterized by using, as an etching gas, a mixed gas including (a) a...
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6878988 |
Non-volatile memory with induced bit lines
An electrically programmable non-volatile memory cell is provided. A semiconductor substrate is prepared. A pair of spaced apart source/drain (S/D) regions is defined on the semiconductor...
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6878578 |
Method for forming a high quality chemical oxide on a freshly cleaned silicon surface as a native oxide replacement
A continuous and integrated cleaning/preparation process is described to condition a silicon surface for the formation of a high quality ultra thin gate oxide described. The process is conducted...
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6872994 |
Semiconductor device having an active region whose width varies
A semiconductor device of the present invention has an active region whose width varies. Gate electrodes cross over narrowest portions of the active region. Therefore, the device is not prone to...
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