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7566655 |
Integration process for fabricating stressed transistor structure
A process flow integration scheme employs one or more techniques to control stress in a semiconductor device formed thereby. In accordance with one embodiment, cumulative stress contributed by RTP...
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7564081 |
finFET structure with multiply stressed gate electrode
A semiconductor structure and its method of fabrication include a semiconductor fin located over a substrate. A gate electrode is located over the semiconductor fin. The gate electrode has a first...
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7564080 |
Method for producing a laser diode component, housing for a laser diode component, and laser diode component itself
A method for producing a laser diode component having an electrically insulating housing basic body and electrical connecting conductors, which are led out from the housing basic body and are...
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7564120 |
Electrical passivation of silicon-containing surfaces using organic layers
Electrical structures and devices may be formed and include an organic passivating layer that is chemically bonded to a silicon-containing semiconductor material to improve the electrical...
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7564061 |
Field effect transistor and production method thereof
A field effect transistor having a gate, a source, and a drain formed from metallic materials is disclosed that is able to supply a high driving current. In the field effect transistor, a source...
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7560762 |
Asymmetric floating gate NAND flash memory
A NAND-type flash memory device includes asymmetric floating gates overlying respective wordlines. A given floating gate is sufficiently coupled to its respective wordline such that a large gate...
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7560757 |
Semiconductor device with a structure suitable for miniaturization
A semiconductor device which is suitable for miniaturization, capable of improving variations in characteristics of a transistor and enhancing the current driving capability comprises a...
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7560759 |
Semiconductor device and method of manufacturing the same
A fin type MOSFET and a method of manufacturing the fin type MOSFET are disclosed. Gate structures in the fin type MOSFET are formed by a damascene process without a photolithography process....
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7560774 |
IC chip
An IC chip, including a switch LDMOS device and an analog LDMOS device, is configured on a substrate having a first conductive type. Components of the two LDMOS devices respectively include two...
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7560758 |
MOSFETs comprising source/drain recesses with slanted sidewall surfaces, and methods for fabricating the same
The present invention relates to improved metal-oxide-semiconductor field effect transistor (MOSFET) devices with stress-inducing structures located at the source and drain (S/D) regions....
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7557436 |
Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes
Wiring lines for the supply of a voltage to feed a drive voltage to an integrated circuit formed in a semiconductor chip are disposed so as to cover a main surface of the semiconductor chip, so...
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7557395 |
Trench MOSFET technology for DC-DC converter applications
A trench power semiconductor device including a recessed termination structure.
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7557396 |
Semiconductor device and method of manufacturing semiconductor device
A semiconductor device includes a side wall spacer formed on the side surface of a gate electrode formed on the upper side of a semiconductor substrate with a gate insulation film therebetween,...
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7554152 |
Versatile system for integrated sense transistor
The present invention provides a versatile system for producing sense transistors having optimized thermal and parametric matching with an associated power transistor. A power transistor is formed,...
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7554139 |
Semiconductor manufacturing method and semiconductor device
A production method for a semiconductor device according to the present invention includes: step (A) of providing a substrate including a semiconductor layer having a principal face, the substrate...
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7554140 |
Nand-type non-volatile memory device
Provided is a NAND-type nonvolatile memory device and method of forming the same. In the method, a plurality of cell layers are stacked on a semiconductor substrate. Seed contact holes for forming...
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7550795 |
SOI devices and methods for fabricating the same
Silicon on insulator (SOI) devices and methods for fabricating the same are provided. An exemplary embodiment of a SOI device comprises a substrate. A first insulating layer is formed over the...
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7550796 |
Germanium semiconductor device and method of manufacturing the same
A germanium semiconductor device and a method of manufacturing the same are provided. The method includes the steps of: forming an isolation layer on a substrate using a shallow trench; forming a...
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7547930 |
High performance FET devices and methods thereof
Structure and methods of fabrication are disclosed for an enhanced FET devices in which dopant impurities are prevented from diffusing through the gate insulator. The structure comprises a Si:C, or...
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7545236 |
Electromechanical filter utilizing a quantum device and sensing electrode
An electromechanical filter capable of attaining a size reduction and a higher integration and executing a high-sensitivity signal sensing is provided. A quantum device is used as a sensing portion...
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7544981 |
Active matrix type semicondcutor display device
There is provided an active matrix type semiconductor display device which realizes low power consumption and high reliability. In the active matrix type semiconductor display device of the present...
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7544980 |
Split gate memory cell in a FinFET
A memory cell is implemented using a semiconductor fin in which the channel region is along a sidewall of the fin between source and drains regions. One portion of the channel region has a select...
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7544552 |
Method for manufacturing junction semiconductor device
A method for manufacturing a junction semiconductor device, having a step for forming a first high-resistance layer, a step for forming a channel-doped layer, a step for forming a second...
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7541645 |
Metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regions
A unit cell of a metal oxide semiconductor (MOS) transistor is provided including an integrated circuit substrate and a MOS transistor on the integrated circuit substrate. The MOS transistor has a...
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7541656 |
Semiconductor devices with enlarged recessed gate electrodes
A semiconductor device includes a semiconductor substrate having a recess therein. A gate insulator is disposed on the substrate in the recess. The device further includes a gate electrode...
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7541629 |
Embedded insulating band for controlling short-channel effect and leakage reduction for DSB process
A method and structure for reducing leakage currents in integrated circuits based on a direct silicon bonding (DSB) fabrication process. After recessing a top semiconductor layer and an underlying...
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7538352 |
Semiconductor device and power converter, driving inverter, general-purpose inverter and high-power high-frequency communication device using same
In a semiconductor device that uses a silicon carbide semiconductor substrate having p type, n type impurity semiconductor regions formed by ion implantation, the electrical characteristics of the...
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7535051 |
Memory device and method of manufacturing the same
A example embodiment may provide a memory device that may include an active pattern on a semiconductor substrate, a first charge trapping layer pattern on the active pattern, a first gate electrode...
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7531849 |
High performance FET devices
An epitaxially layered structure with gate voltage bias supply circuit element for improvement in performance for semiconductor field effect transistor (FET) devices utilizes a structure comprised...
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7525162 |
Orientation-optimized PFETS in CMOS devices employing dual stress liners
A PFET is provided on a silicon layer having a (110) surface orientation and located in a substrate. A compressive stress liner disposed on the gate and source/drain regions of the PFET generates a...
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7525118 |
Test element group, method of manufacturing a test element group, method of testing a semiconductor device, and semiconductor device
To provide a TEG capable of early stage feedback of testing contents and a method of testing using the TEG. TFTs for TEG are manufactured on a different substrate than actual panel TFTs by using...
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7521747 |
Vertical transistor and a semiconductor integrated circuit apparatus having the same
AMOS transistor comprises: a first conduction type region; a second conduction type drain region formed on the outermost layer portion of the first conduction type region; a second conduction type...
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7521741 |
Shielding structures for preventing leakages in high voltage MOS devices
A high-voltage MOS device includes a first high-voltage well (HVW) region overlying a substrate, a second HVW region overlying the substrate, a third HVW region of an opposite conductivity type as...
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7521740 |
Semiconductor device comprising extensions produced from material with a low melting point
A semiconductor device comprises a gate electrode ( 1 ) and a gate insulating layer ( 2 ) both surrounded by a spacer ( 3 ) and produced on a surface (S) of a substrate ( 100 ) of a first...
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7518171 |
Photo diode and related method for fabrication
A method for fabricating a photo diode first involves providing a substrate. A doping area is then formed on the substrate. Afterwards, a dielectric layer, and a first poly-silicon layer are formed...
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7518246 |
Atomic layer deposition of CeO2/Al2O3 films as gate dielectrics
The use of atomic layer deposition (ALD) to form a nanolaminate layered dielectric layer of cerium oxide and aluminum oxide acting as a single dielectric layer with a ratio of approximately two to...
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7518169 |
MOS-transistor on SOI substrate with source via
In an inventive MOS transistor having a source region, a drain region and a channel region, which are formed in a semiconductor layer of an SOI substrate, which has a semiconductor substrate below...
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7514756 |
Semiconductor device with MISFET
A semiconductor device includes a substrate, a semiconductor region provided in the substrate, a group of transistors including a plurality of MIS transistors and provided in the semiconductor...
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7514755 |
Integrated circuit modification using well implants
A technique for and structures for camouflaging an integrated circuit structure. The integrated circuit structure is formed having a well of a first conductivity type under the gate region being...
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7514762 |
Active matrix pixel device with photo sensor
An active matrix pixel device including a plurality of polycrystalline silicon islands supported by a substrate, one of the polycrystalline silicon islands providing a channel and doped...
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7514731 |
Switch elements and a DC/DC converter using the same
A semiconductor device in which the self-turn-on phenomenon is prevented that can significantly improve power conversion efficiency. The semiconductor device is a system-in-package for power supply...
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7514730 |
Method of fabricating a non-floating body device with enhanced performance
Provided is a semiconductor transistor device including a substrate having at least two regions, a semiconductive region extending to a first surface of the substrate and an insulative region...
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7511321 |
Method for forming a dielectric layer and related devices
A dielectric layer may be formed by depositing the dielectric layer to an intermediate thickness and applying a nitridation process to the dielectric layer of intermediate thickness. The dielectric...
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7510926 |
Technique for providing stress sources in MOS transistors in close proximity to a channel region
A strained semiconductor material may be positioned in close proximity to the channel region of a transistor, such as an SOI transistor, while reducing or avoiding undue relaxation effects of metal...
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7508031 |
Enhanced segmented channel MOS transistor with narrowed base regions
By forming MOSFETs on a substrate having pre-existing ridges of semiconductor material (i.e., a “corrugated substrate”), the resolution limitations associated with conventional semiconductor...
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7504679 |
Enhancement mode GaN FET with piezoelectric gate
One or more enhancement mode GaN devices has a stress-reduced gate region which interrupts the normally conductive 2Deg layer. A piezoelectric film is disposed over the stress-reduced gate region...
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7504692 |
High-voltage field-effect transistor
High-voltage field-effect transistor is provided that includes a drain terminal, a source terminal, a body terminal, and a gate terminal. A gate oxide and a gate electrode, adjacent to the gate...
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7504693 |
Dislocation free stressed channels in bulk silicon and SOI CMOS devices by gate stress engineering
Structures and methods of manufacturing are disclosed of dislocation free stressed channels in bulk silicon and SOI (silicon on insulator) CMOS (complementary metal oxide semiconductor) devices by...
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7501674 |
Semiconductor device having fin transistor and planar transistor and associated methods of manufacture
Disclosed is a fin transistor and a planar transistor and a method of forming the same. The fin transistor and the planar transistor are formed to have gate electrodes with similar thicknesses by...
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7501673 |
Semiconductor device multilayer structure, fabrication method for the same, semiconductor device having the same, and semiconductor device fabrication method
In one embodiment, a semiconductor device includes a semiconductor substrate and a doped conductive layer formed over the semiconductor substrate. A diffusion barrier layer is formed over the doped...
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