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7419882 |
Alignment mark and alignment method for the fabrication of trench-capacitor dram devices
A small-size (w<0.5 micrometers) alignment mark in combination with a “k1 process” is proposed, which is particularly suited for the fabrication of trench-capacitor DRAM devices which...
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7411226 |
High electron mobility transistor (HEMT) structure with refractory gate metal
An InP high electron mobility transistor (HEMT) structure in which a gate metal stack includes an additional thin layer of a refractory metal, such as molybdenum (Mo) or platinum (Pt) at a junction...
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7391087 |
MOS transistor structure and method of fabrication
An MOS device comprising a gate dielectric formed on a first conductivity type region. A gate electrode formed on the gate dielectric. A pair of sidewall spacers are formed along laterally opposite...
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7342261 |
Light emitting device
A light emitting device includes a substrate having a patterned surface and formed with a plurality of spaced apart cavities, and an epitaxial layer formed on the patterned surface of the...
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7304335 |
Vertical-conduction and planar-structure MOS device with a double thickness of gate oxide and method for realizing power vertical MOS transistors with improved static and dynamic performance and high scaling down density
A vertical-conduction and planar-structure MOS device having a double thickness gate oxide includes a semiconductor substrate including spaced apart active areas in the semiconductor substrate and...
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7030506 |
Mask and method for using the mask in lithographic processing
A method and mask to improve measurement of alignment marks is disclosed. An exemplary embodiment of the invention includes a resist mask with a patterned alignment mark comprising an assemblage of...
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7023099 |
Wafer cleaning method and resulting wafer
A method of removing organic particles from a registration mark on a semiconductor wafer. The method comprises providing a semiconductor wafer comprising at least one registration mark at least...
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7005755 |
Semiconductor device and fabrication process thereof
A semiconductor device formed on a SOI substrate includes isolation trenches formed in a first region and reaching an insulation layer buried in the SOI substrate, and alignment marks formed in a...
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6979874 |
Semiconductor device and method of manufacturing thereof
A plurality of p anode regions are formed at one surface of an n − substrate. A trench is formed in each p anode region. An ohmic junction region is formed between an anode metallic electrode...
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6933523 |
Semiconductor alignment aid
An alignment aid for semiconductor devices. The alignment aid includes an area having a high level of reflectivity and an adjacent area having a of low level of reflectivity. The area having a low...
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6924516 |
Semiconductor device
A semiconductor device includes: a substrate; a buffer layer including GaN formed on the substrate, wherein: surfaces of the buffer layer are c facets of Ga atoms; a channel layer including GaN or...
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6906419 |
Semiconductor device having a wiring layer of damascene structure and method for manufacturing the same
In a semiconductor device, a wiring pattern groove is formed in a surface portion of a silicon oxide film provided above a semiconductor substrate. A wiring layer is buried into the wiring pattern...
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6844579 |
Organic device including semiconducting layer aligned according to microgrooves of photoresist layer
An organic device including a substrate or a dielectric layer; a photoresist layer formed on the substrate or dielectric layer, wherein the photoresist layer is provided with a plurality of...
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6787826 |
Heterostructure field effect transistor
A high electron mobility transistor is constructed with a substrate, a lattice-matching buffer layer formed on the substrate, and a heavily doped p-type barrier layer formed on the buffer layer. A...
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6780694 |
MOS transistor
A method of fabricating a semiconductor transistor device comprises the steps as follows. Provide a semiconductor substrate with a gate dielectric layer thereover and a lower gate electrode...
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6777722 |
Method and structure for double dose gate in a JFET
A method for fabricating a junction field effect transistor (JFET) with a double dose gate structure. A trench is etched in the surface of a semiconductor substrate, followed by a low dose implant...
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6773935 |
Confocal 3D inspection system and process
A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates...
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6768143 |
Structure and method of making three finger folded field effect transistors having shared junctions
An integrated circuit including a field effect transistor (FET) is provided in which the gate conducter has an even number of fingers disposed between alternating source and drain regions of a...
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6753559 |
Transistor having improved gate structure
A gate structure which includes a semiconductor substrate having a channel region, a gate insulator adjacent the channel region of the semiconductor substrate and a conductible gate adjacent the...
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6653667 |
GaAs-based semiconductor field-effect transistor
A GaAs-based semiconductor field-effect transistor in which electrons flowing from a source electrode to a drain electrode are controlled by a signal supplied to a gate electrode. The transistor...
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6613623 |
High fMAX deep submicron MOSFET
A method of forming a high f MAX deep submicron MOSFET, comprising the following steps of. A substrate having a MOSFET formed thereon is provided. The MOSFET having a source and a drain and...
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6570238 |
Preweakened on chip metal fuse using dielectric trenches for barrier layer isolation
A fuse for use in an integrated circuit includes a dielectric layer into which a trench or void is etched defined by a top opening and a bottom floor. The trench includes at least one undercut...
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6504190 |
FET whose source electrode overhangs gate electrode and its manufacture method
A gate electrode is in Schottky contact with the surface of a semiconductor substrate and extends in a first direction. A drain electrode is disposed on one side of the gate electrode, spaced apart...
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6501146 |
Semiconductor device and method of manufacturing thereof
A plurality of p anode regions are formed at one surface of an n − substrate. A trench is formed in each p anode region. An ohmic junction region is formed between an anode metallic electrode...
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6483135 |
Field effect transistor
A field effect transistor includes a semiconductor substrate with a channel layer being formed on its surface, a source electrode and a drain electrode formed at a distance on said semiconductor...
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6448147 |
Semiconductor device and method for manufacturing the same
As an outside box mark for automatic overlay measurement formed on a semiconductor substrate, a # shape is formed by laying two vertical lines formed by word lines over two parallel lines formed of...
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6424005 |
LDMOS power device with oversized dwell
An LDMOS device ( 10, 20, 50, 60 ) that is made with minimal feature size fabrication methods, but overcomes potential problems of misaligned Dwells ( 13 ). The Dwell ( 13 ) is slightly overstated...
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6384442 |
Fabrication process for metal-insulator-metal capacitor with low gate resistance
A new method is provided for the creation of openings in a layer of dielectric while at the same time forming a dielectric that forms the dielectric of MIM capacitors. Under the first embodiment of...
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6323521 |
Thin film transistor with electrodes having compressive and tensile stress
A thin film transistor includes a substrate, a gate electrode on the substrate, a gate insulating layer on the substrate and covering the gate electrode, an active layer on the gate insulating...
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6258639 |
Sintered gate schottky barrier fet passivated by a degradation-stop layer
A transistor structure with a degradation-stop layer that prevents degradation of underlying semiconductor layers while minimizing any increase in the gate leakage current is disclosed. In one...
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6225653 |
Semiconductor components and methods of manufacturing semiconductor components
A semiconductor component (1a) has a highly-doped substrate (4) of a first type of doping into which a highly-doped layer (15) of a second type of doping is introduced in some areas to form a pn...
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6175134 |
Thin film transistors
A thin film transistor includes a thin film transistor layer having a source region, a channel region and a drain region. In one implementation, a gate of the transistor is disposed laterally...
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6147370 |
Field effect transistor with first and second drain electrodes
To enhance a drain current voltage characteristics of a compound semiconductor field effect transistor, an n-GaAs substrate is used. After forming an n - -GaAs layer and an i-AlGaAs layer...
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6078071 |
High-speed compound semiconductor device having an improved gate structure
A semiconductor device includes a gate structure formed on a substrate in which an LDD structure is formed, wherein gate structure includes a Schottky electrode making a Schottky contact with a...
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6078070 |
Broadband backside illuminated MESFET with collecting microlens
A composite-layer semiconductor device includes a gate above a host substrate, an n++ contact layer above the gate, and source and drain ohmic contacts applied to the n++ contact layer. The source...
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6075262 |
Semiconductor device having T-shaped gate electrode
A compound semiconductor transistor has a structure in which a first insulating film is formed only under a overhang of a gate electrode an upper part of which is formed widely, and a second...
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6060733 |
Formation of lightly doped regions under a gate having a reduced gate oxide
The formation of lightly doped regions under a gate of a transistor that has a reduced gate oxide is disclosed. In one embodiment, a method includes four steps. In the first step, a gate is formed...
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6060731 |
Insulated-gate semiconductor device having a contact region in electrical contact with a body region and a source region
A MOSFET wherein the formation of a channel in a channel formation region is controlled by a voltage applied to an insulated gate, comprising: a semiconductor substrate; a first semiconductor layer...
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6051863 |
Transistor gate conductor having sidewall surfaces upon which a spacer having a profile that substantially prevents silicide bridging is formed
A method is provided for fabricating a transistor gate conductor having opposed sidewall surfaces upon which dielectric spacers are formed such that the spacer profile substantially tapers toward...
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6013926 |
Semiconductor device with refractory metal element
A semiconductor device includes a self-aligned refractory metal constituent in a recess in a semiconductor substrate and having the same plane pattern as a bottom surface of the recess. The width...
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6002148 |
Silicon carbide transistor and method
A silicon carbide MESFET (10) is formed to have a source (21) and a drain (22) that are self-aligned to a gate (16) of the MESFET (10). The gate (16) is formed to have a T-shaped structure with a...
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5925903 |
Field-effect transistors and method of manufacturing the same
A conductive layer made of n-type GaAs is formed on a semi-insulating substrate made of GaAs. A pair of contact regions made of n + -type GaAs are formed on the conductive layer. A source...
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5925902 |
Semiconductor device having a schottky film with a vertical gap formed therein
In a semiconductor device, a gate electrode is formed by sequentially forming a Schottky metal film, a barrier metal film, and a low-resistance metal film from the lower side. The Schottky metal...
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5886373 |
Field effect transistor
A method of fabricating a field effect transistor with a spike-gate structure including forming a semiconductor layer on a semi-insulating substrate, and forming a recess having a spike shape in...
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5861644 |
High-frequency traveling wave field-effect transistor
A method of improving the performance of a traveling wave field-effect transistor operated at frequencies in the microwave range or above the microwave range comprising the steps of forming a...
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5786610 |
Field effect transistor
A field effect transistor includes an active layer having a surface; a source electrode and a drain electrode disposed on the surface of the active layer; a first gate electrode disposed on the...
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5717232 |
Semiconductor device sealed with molded resin
A semiconductor device has an active layer formed on a semiconductor substrate with different types of junctions, a source region, a drain region, a T-shaped gate electrode in which the...
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5691549 |
Sidewall strap
The present invention is a sidewall connector providing a conductive path linking at least two conductive regions. The sidewall connector has a top portion comprising surface. A conductive member...
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5585655 |
Field-effect transistor and method of manufacturing the same
On a semi-insulating substrate is formed a conductive layer and an undoped layer. On specified regions of the conductive layer are formed ohmic electrodes, each serving as a source electrode or a...
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5550065 |
Method of fabricating self-aligned FET structure having a high temperature stable T-shaped Schottky gate contact
A method of fabricating a self-aligned FET having a semi-insulating substrate of GaAs or InP with a conductive channel formed either by doping the surface or an epitaxially grown channel by...
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