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7586180 Semiconductor packaging device comprising a semiconductor chip including a MOSFET  
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
7573081 Method to fabricate horizontal air columns underneath metal inductor  
A new method is provided for creating an inductor on the surface of a silicon substrate. The invention provides overlying layers of oxide fins beneath a metal inductor. The oxide fins provide the...
7560344 Semiconductor device having a pair of fins and method of manufacturing the same  
Example embodiments relate to a semiconductor device and a method of manufacturing the same. A semiconductor device according to example embodiments may have reduced disturbances during reading...
7498622 Latchup robust gate array using through wafer via  
A structure and a method for preventing latchup in a gate array. The structure including: a NFET gate array and a PFET gate array in a substrate; an electrically conductive through via extending...
7494909 Method of manufacturing a chip  
Provided are a chip, a chip stack, and a method of manufacturing the same. A plurality of chips which each include: at least one pad formed on a wafer; and a metal layer which protrudes up to a...
7482261 Interconnect structure for BEOL applications  
A semiconductor interconnect structure is provided that includes a new capping layer/dielectric material interface which is embedded inside the dielectric material. In particular, the new interface...
7476967 Composite carbon nanotube thermal interface device  
Embodiments of a composite carbon nanotube structure comprising a number of carbon nanotubes disposed in a matrix comprised of a metal or a metal oxide. The composite carbon nanotube structures may...
7476918 Semiconductor integrated circuit device and vehicle-mounted radar system using the same  
A semiconductor integrated circuit device includes a HFET formed on part of a substrate made of sapphire and including a Group III-V nitride semiconductor layer, a dielectric film formed on the...
7465977 Method for producing a packaged integrated circuit  
There is described a method for producing a packaged integrated circuit. The method comprises a first step of building an integrated circuit having a micro-structure suspended above a micro-cavity,...
7457334 Semiconductor laser diode package  
Provided is a semiconductor laser diode package. The semiconductor laser diode package may include: a stem having a through hole formed at a predetermined position; a heat sink that may be disposed...
7391067 Hybrid microwave integrated circuit  
An integrated microwave transistor amplifier includes a AlGaN/GaN active transistor arrangement on a thinned Si 1-mil heat spreader. Elongated, plated-through vias extend from the source portions...
7352019 Capacitance reduction by tunnel formation for use with a semiconductor device  
A method used during the manufacture of a semiconductor device comprises providing at least first, second, and third spaced conductive structures, where the second conductive structure is...
7338840 Method of forming a semiconductor die with heat and electrical pipes  
Thermal hot spots in the substrate of a semiconductor die, and the required surface area of the semiconductor die, are substantially reduced by forming thermal or thermal and electrical pipes in...
7335931 Monolithic microwave integrated circuit compatible FET structure  
A field effect transistor structure includes a single crystal substrate having: a source, gate and drain electrodes disposed on an upper surface of the substrate, the gate electrode having a region...
7335599 Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrate  
A semiconductor processing method includes providing a substrate, forming a plurality of semiconductor layers in the substrate, each of the semiconductor layers being distinct and selected from...
7332806 Thin, thermally enhanced molded package with leadframe having protruding region  
A semiconductor die package. It includes (a) a semiconductor die including a first surface and a second surface, (b) a source lead structure including protruding region having a major surface, the...
7285839 Coating of copper and silver air bridge structures to improve electromigration resistance and other applications  
An improved electrical interconnect for an integrated circuit and methods for providing the same are disclosed. The electrical interconnect includes an air bridge extending through a gaseous medium...
7262440 Light emitting diode package and fabrication method thereof  
The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation...
7223992 Thermal conducting trench in a semiconductor structure  
The invention relates to a trench filled with a thermally conducting material in a semiconductor substrate. In one embodiment, the semiconductor device has a trench defining a cell region, wherein...
7214594 Method of making semiconductor device using a novel interconnect cladding layer  
A method and apparatus are provided an interconnect cladding layer. In one embodiment, a first sacrificial layer is deposited over a substrate and patterned. In the vias created during the...
7208831 Semiconductor device having multilayer wiring structure and method, wherein connecting portion and wiring layer are formed of same layer  
A method for manufacturing a semiconductor device includes a step of forming a first groove in a first insulating film, forming a conductive film in the first groove, a step of selectively forming...
7196406 ESD protection apparatus for an electrical device  
An ESD protection apparatus for an electrical device with a circuit structure having an internal terminal, which is connected to an external terminal of the electrical device via a conductive...
7196403 Semiconductor package with heat spreader  
A semiconductor package with heat spreader is disclosed. In one embodiment, the semiconductor package comprises a device carrier having a plurality of contact areas and a semiconductor die having a...
7176578 Method for processing a thin film substrate  
The present invention comprises a processed thin film substrate ( 10 ) and a method therefore, in order to produce a flexible printed circuit card, having a plurality of microvias going or passing...
7095114 Semiconductor device with via hole group generating high frequency electromagnetic bonding, manufacturing method thereof, and monolithic microwave integrated circuit  
An amplifier GaAs MMIC for microwave band applications includes a ground electrode 8 having a via hole group 12 composed of three via holes 11 filled with plated metals 10 a that are formed...
7091603 Semiconductor device  
In a semiconductor device having semiconductor chips, a lower heat sink which is joined on the principal rear surface side of the semiconductor chips and an upper heat sink which is joined on the...
7091534 Semiconductor device using low dielectric constant material film and method of fabricating the same  
The semiconductor device is capable of coping with speedup of operation using a low dielectric constant material film other than silicon. The base ( 10 ) formed by the substrate ( 11 ) and the low...
7075166 Coating of copper and silver air bridge structures to improve electromigration resistance and other applications  
An improved electrical interconnect for an integrated circuit and methods for providing the same are disclosed. The electrical interconnect includes an air bridge extending through a gaseous medium...
7075133 Semiconductor die with heat and electrical pipes  
Thermal hot spots in the substrate of a semiconductor die, and the required surface area of the semiconductor die, are substantially reduced by forming thermal or thermal and electrical pipes in...
7053426 Semiconductor device with heat sink  
A semiconductor device includes a glass substrate, a heat sink formed on the glass substrate and a transistor formed on the heat sink. The transistor includes an active layer formed on the heat...
7030448 Mask ROM and the method of forming the same and the scheme of reading the device  
The structure of the nonvolatile memory includes a substrate having source/drain formed at unselected sides and source/drain with extension source/drain formed at other selected sides. A gate...
7026211 Semiconductor component and method of manufacture  
A semiconductor component having smooth, void-free conductive layers and a method for manufacturing the semiconductor component. Surface features such as gate structures are formed on a...
7012298 Non-volatile memory device  
A non-volatile memory device is provided by forming a tunnel oxide layer and a gate electrode on the tunnel oxide layer. Silicon structures are formed below the side surfaces of the gate electrode...
6992386 Semiconductor device and a method of manufacturing the same  
A semiconductor device to prevent breakage of a semiconductor chip is disclosed. The device incorporates a sealing member, a semiconductor chip and having a source and gate electrodes on a first...
6984855 Manufacturing method of semiconductor device and semiconductor device  
A semiconductor device comprising a buried insulating film formed in a substrate; a protective film formed on the buried insulating film covering corresponding diffusion regions of a P-type MISFET...
6956255 Semiconductor device and drive circuit using the semiconductor devices  
A high-speed bipolar transistor is provided which is improved in the effect of heat radiation without increasing the substrate capacitance. The heat radiation connection between a base region and a...
6903392 Semiconductor device and its manufacturing method  
A semiconductor device having a single-crystal substrate made of a material different from nitride III-V compound semiconductors, and a device made on one major surface of said single-crystal...
6900482 Semiconductor device having divided active regions with comb-teeth electrodes thereon  
A high-frequency semiconductor device for power amplification has a comb-teeth electrode on each of active regions formed on the front surface of the semiconductor substrate. One aspect of the...
6876076 Multilayer semiconductor device for transmitting microwave signals and associated methods  
A multilayer semiconductor device includes at least one structure for transmitting electrical signals, and in particular, microwave signals. The device includes at least one electrically conductive...
6858888 Stress control of semiconductor microstructures for thin film growth  
A suspended semiconductor film is anchored to a substrate at at least two opposed anchor positions, and film segments are deposited on the semiconductor film adjacent to one or more of the anchor...
6841844 Air gaps copper interconnect structure  
An inter-level insulator structure is provided having an effective insulator dielectric constant approaching 1. An embodiment of the inter-level insulator comprises a first metal layer comprising a...
6818931 Chip design with power rails under transistors  
A method and an integrated circuit having power rails under transistors. In a preferred embodiment, power rails are formed over a substrate. Devices, such as FET transistors, are formed over the...
6800886 Semiconductor device and method for fabricating the same  
The semiconductor device comprises insulation films 30 a -30 f formed on a semiconductor substrate 10 , and a thermal conductor 42 buried in the insulation films. The thermal conductor is...
6774416 Small area cascode FET structure operating at mm-wave frequencies  
A small area cascode FET structure capable of operating at mm-wave frequenices cascades a common-source (CS) FET with a common gate (CG) FET, in a smaller physical area than conventional cascode...
6768143 Structure and method of making three finger folded field effect transistors having shared junctions  
An integrated circuit including a field effect transistor (FET) is provided in which the gate conducter has an even number of fingers disposed between alternating source and drain regions of a...
6737687 Field-effect transistor device having a uniquely arranged gate electrode  
A field-effect transistor device includes an active area on a semiconductor substrate and a gate electrode, a source electrode, and a drain electrode are disposed on the surface of the active area,...
6713793 Field effect transistor structure with bent gate  
An inexpensive and small-sized semiconductor device with high power output performance includes a semiconductor substrate; an active region on the semiconductor substrate; first and second channel...
6642559 Structure and process for improving high frequency isolation in semiconductor substrates  
An isolation structure for high frequency integrated circuits is a conductive material disposed over a region of active gallium arsenide substrate. The conductive material over the active region...
6642120 Semiconductor circuit  
A semiconductor circuit is provided which has a high breakdown voltage and is capable of outputting a large current. Field transistors (Q 1, Q 11 ) are cross-coupled. The gate of the first field...
6630700 NMOS circuit in isolated wells that are connected by a bias stack having pluralirty of diode elements  
An integrated NMOS circuit including an active stack having a plurality of isolated p-well active devices M 1 -M 3 , a bias stack having a plurality of diode-connected isolated p-well bias devices...
Matches 1 - 50 out of 140 1 2 3 >