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8106468 Process for fabricating silicon-on-nothing MOSFETs  
A semiconductor device includes a gate stack; an air-gap under the gate stack; a semiconductor layer vertically between the gate stack and the air-gap; and a first dielectric layer underlying and...
8097906 Semiconductor device having finger electrodes  
A semiconductor device which has low input inductance is provided. It includes: source finger electrodes (3) disposed by predetermined direction on the main substrate 1; drain finger electrodes (4)...
8084794 Semiconductor device and manufacturing method thereof  
A semiconductor device includes a first wiring extending in a first direction and a second wiring extending in a second direction which crosses the first direction and being disposed with a space...
8058736 Semiconductor device having heat spreader with center opening  
The present invention provides a semiconductor device including: a semiconductor chip mounted on a substrate; a heat spreader provided above the semiconductor chip; and a sealing resin interposed...
7989839 Method and apparatus for using light emitting diodes  
The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the...
7982279 Method of manufacturing stacked-type semiconductor device  
A method of manufacturing a stacked-type semiconductor device, including the steps of: forming dividing grooves, having a depth corresponding to a finished thickness for a plurality of first chips...
7982280 Integrated circuits and interconnect structure for integrated circuits  
An integrated circuit includes N plane-like metal layers. A first plane-like metal layer includes M contact portions that communicate with the N plane-like metal layers, respectively. The first...
7968918 Semiconductor package  
A semiconductor package includes a semiconductor chip having two or more regions that partially overlap so as to define an overlapping region. Through-holes are defined through the two or more...
7947566 Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrate  
A semiconductor processing method includes providing a substrate, forming a plurality of semiconductor layers in the substrate, each of the semiconductor layers being distinct and selected from...
7939834 Light- emitting device  
A light-emitting device includes a substrate having an epitaxial-forming surface and a back surface opposite to the epitaxial-forming surface, the substrate being formed with a recess indented from...
7936048 Power transistor and power semiconductor device  
In a power semiconductor device, the vertically conducting power transistor has at its front side (11) a source zone (14) and a control input (16). A feedthrough for the control input has an...
7936045 Integrated circuit with multi-stage matching circuit  
An integrated circuit with a multi-stage matching circuit with an inductive conductive structure with a first end and a second end in the integrated circuit and a capacitor structure in the...
7935991 Semiconductor components with conductive interconnects  
A semiconductor component includes a semiconductor substrate having at least one conductive interconnect on the backside thereof bonded to an inner surface of a substrate contact. A stacked...
7923760 Dielectric spacers for metal interconnects and method to form the same  
A plurality of metal interconnects incorporating dielectric spacers and a method to form such dielectric spacers are described. In one embodiment, the dielectric spacers adjacent to neighboring...
7919834 Edge seal for thru-silicon-via technology  
One or more multilayer back side metallurgy (BSM) stack structures are formed on thru-silicon-vias (TSV). The multiple layers of metal may include an adhesion layer of chromium on the semiconductor...
7911068 Component and method for producing a component  
A component and a method for producing a component are disclosed. The component comprises an integrated circuit, a housing body, a wiring device overlapping the integrated circuit and the housing...
7875911 Semiconductor device and oscillator  
A semiconductor device includes a semiconductor substrate including an active element or an integrated circuit and a plurality of connection electrodes to be electrically connected to the...
7863641 Method and apparatus for using light emitting diodes for the treatment of biological tissue  
The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the...
7842553 Cooling micro-channels  
The present disclosure relates generally to microelectronic technology, and more specifically, to an apparatus used for the cooling of active electronic devices utilizing micro-channels or...
7839908 Mode control waveguide laser device  
Provided is a device capable of oscillating a plurality of oscillation modes within a laser medium for obtaining a fundamental wave output which is easy in output scaling and high in luminance,...
7833830 3D interconnect with protruding contacts  
This invention relates to a semiconductor having protruding contacts comprising, a first semiconductor substrate having at least one interconnect located substantially within the first substrate,...
7833894 Devices and systems having at least one dam structure  
A method for forming through-wafer interconnects (TWI) in a substrate. Blind holes are formed from a surface, sidewalls thereof are passivated and coated with a conductive material. A vent hole is...
7833890 Semiconductor device having a pair of fins and method of manufacturing the same  
Example embodiments relate to a semiconductor device and a method of manufacturing the same. A semiconductor device according to example embodiments may have reduced disturbances during reading...
7825440 Suspended-membrane/suspended-substrate monolithic microwave integrated circuit modules  
A suspended-membrane/suspended-substrate monolithic microwave integrated circuit module and method of making same. The device contains a plurality of active devices, such as transistors, a...
7825516 Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures  
In integrated circuit technology; an electromigration and diffusion sensitive conductor of a metal such as copper and processing procedure therefore is provided, wherein, at a planarized chemical...
7821124 Thin, thermally enhanced flip chip in a leaded molded package  
Semiconductor die packages and methods of making them are disclosed. An exemplary package comprises a leadframe having a source lead and a gate lead, and a semiconductor die coupled to the source...
7786487 Semiconductor device and manufacturing method thereof  
Disclosed is a semiconductor device including a SiC substrate and a heat conductor formed in a hole in the SiC substrate and made of a linear structure of carbon elements.
7781884 Method of fabrication of on-chip heat pipes and ancillary heat transfer components  
The density of components in integrated circuits (ICs) is increasing with time. The density of heat generated by the components is similarly increasing. Maintaining the temperature of the...
7768043 Semiconductor device having high frequency components and manufacturing method thereof  
A transistor is located on a GaAs substrate. An air bridge extends to provide a cavity above gate electrodes of the transistor. An opening is sealed by the end ball of a second wire. Further, the...
7763914 Semiconductor device for high frequency  
A semiconductor device for high frequency includes a channel region fabricated on a compound semiconductor substrate, a gate electrode fabricated on the channel region, a source electrode and a...
7723759 Stacked wafer or die packaging with enhanced thermal and device performance  
An apparatus includes a metallization region including a plurality of metal layers on a device layer of a substrate, a via extending through the substrate and the device layer, and a heat spreading...
7723850 Electronic devices having air gaps  
A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer...
7723760 Semiconductor-based porous structure enabled by capillary force  
The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to...
7696541 Structure for a latchup robust gate array using through wafer via  
A structure, method and a design structure for preventing latchup in a gate array. The design structure including: a NFET gate array and a PFET gate array in a substrate; an electrically conductive...
7671442 Air-gap insulated interconnections  
Air-gap insulated interconnection structures and methods of fabricating the structures, the methods including: forming a dielectric layer on a substrate; forming a capping layer on a top surface of...
7656027 In-chip structures and methods for removing heat from integrated circuits  
An in-chip system and method for removing heat from integrated circuits is disclosed. One embodiment is a substrate with a front side and a back side. The front side of the substrate is capable of...
7649239 Dielectric spacers for metal interconnects and method to form the same  
A plurality of metal interconnects incorporating dielectric spacers and a method to form such dielectric spacers are described. In one embodiment, the dielectric spacers adjacent to neighboring...
7646064 Semiconductor die with aluminum-spiked heat pipes  
A low thermal pathway is provided from the top surface of a silicon substrate to the bottom surface of the silicon substrate by first forming aluminum plugs in the bottom surface of the silicon...
7586180 Semiconductor packaging device comprising a semiconductor chip including a MOSFET  
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
7573081 Method to fabricate horizontal air columns underneath metal inductor  
A new method is provided for creating an inductor on the surface of a silicon substrate. The invention provides overlying layers of oxide fins beneath a metal inductor. The oxide fins provide the...
7560344 Semiconductor device having a pair of fins and method of manufacturing the same  
Example embodiments relate to a semiconductor device and a method of manufacturing the same. A semiconductor device according to example embodiments may have reduced disturbances during reading...
7498622 Latchup robust gate array using through wafer via  
A structure and a method for preventing latchup in a gate array. The structure including: a NFET gate array and a PFET gate array in a substrate; an electrically conductive through via extending...
7494909 Method of manufacturing a chip  
Provided are a chip, a chip stack, and a method of manufacturing the same. A plurality of chips which each include: at least one pad formed on a wafer; and a metal layer which protrudes up to a...
7482261 Interconnect structure for BEOL applications  
A semiconductor interconnect structure is provided that includes a new capping layer/dielectric material interface which is embedded inside the dielectric material. In particular, the new interface...
7476918 Semiconductor integrated circuit device and vehicle-mounted radar system using the same  
A semiconductor integrated circuit device includes a HFET formed on part of a substrate made of sapphire and including a Group III-V nitride semiconductor layer, a dielectric film formed on the...
7476967 Composite carbon nanotube thermal interface device  
Embodiments of a composite carbon nanotube structure comprising a number of carbon nanotubes disposed in a matrix comprised of a metal or a metal oxide. The composite carbon nanotube structures may...
7465977 Method for producing a packaged integrated circuit  
There is described a method for producing a packaged integrated circuit. The method comprises a first step of building an integrated circuit having a micro-structure suspended above a micro-cavity,...
7457334 Semiconductor laser diode package  
Provided is a semiconductor laser diode package. The semiconductor laser diode package may include: a stem having a through hole formed at a predetermined position; a heat sink that may be disposed...
7391067 Hybrid microwave integrated circuit  
An integrated microwave transistor amplifier includes a AlGaN/GaN active transistor arrangement on a thinned Si 1-mil heat spreader. Elongated, plated-through vias extend from the source portions...
7352019 Capacitance reduction by tunnel formation for use with a semiconductor device  
A method used during the manufacture of a semiconductor device comprises providing at least first, second, and third spaced conductive structures, where the second conductive structure is...
Matches 1 - 50 out of 176 1 2 3 4 >