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7615810 Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus  
An electro-optical device includes first and second substrates that are bonded to each other, the first substrate having an extended portion extended from the second substrate on a first side...
7612423 Signal-carrying flexure structure for micro-electromechanical devices  
A signal-carrying flexure structure for a MEM device comprises at least two conductive flexure segments having respective cross-sectional areas, and at least one crosspiece affixed to the flexure...
7554136 Micro-switch device and method for manufacturing the same  
A micro device that is manufactured by semiconductor process and is electrically connected to outside for its operation. The micro device includes a circuit board, an electrode pad being provided...
7550794 Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer  
In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic...
7534640 Support structure for MEMS device and methods therefor  
A microelectromechanical systems device having support structures formed of sacrificial material that is selectively diffused with a dopant material or formed of a selectively oxidized metal...
7487050 Techniques and devices for characterizing spatially non-uniform curvatures and stresses in thin-film structures on substrates with non-local effects  
Techniques and devices are described to use spatially-varying curvature information of a layered structure to determine stresses at each location with non-local contributions from other locations...
7459732 Gas-sensitive field-effect transistor with air gap  
A gas-sensitive field-effect transistor may be formed from a substrate with a gas-sensitive layer and a transistor processed separately and then assembled. The substrate may be patterned to form...
7411261 MEMS device and fabrication method thereof  
A method for fabricating a MEMS device having a fixing part fixed to a substrate, a connecting part, a driving part, a driving electrode, and contact parts, includes patterning the driving...
7385268 Method for linearizing deflection of a MEMS device using binary electrodes and voltage modulation  
A micromechanical device comprising one or more electronically movable structure sets comprising for each set a first electrode supported on a substrate and a second electrode supported...
7342263 Circuit device  
A circuit device is provided which can be manufactured at reduced costs and which is highly reliable. The circuit device includes a Sensor area formed on part of a semiconductor substrate, a...
7321156 Device for capacitive pressure measurement and method for manufacturing a capacitive pressure measuring device  
A device for manufacturing a capacitive pressure measurement includes an insulated base electrode, a mechanically deflectable counterelectrode composed of a layer made of at least one of a...
7317233 Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same  
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having...
7312485 CMOS fabrication process utilizing special transistor orientation  
Complementary metal oxide semiconductor transistors are formed on a silicon substrate. The substrate has a {100} crystallographic orientation. The transistors are formed on the substrate so that...
7304358 MOS transistor with a deformable gate  
A MOS transistor with a deformable gate formed in a semiconductor substrate, including source and drain areas separated by a channel area extending in a first direction from the source to the drain...
7294895 Capacitive dynamic quantity sensor and semiconductor device  
A capacitive dynamic quantity sensor whose size is small and whose reliability and mass productivity are high is provided. In order to realize signal transmission from a lower electrode to an upper...
7280394 Field effect devices having a drain controlled via a nanotube switching element  
Field effect devices having a drain controlled via a nanotube switching element. Under one embodiment, a field effect device includes a source region and a drain region of a first semiconductor...
7271459 Physical quantity sensor  
A physical quantity sensor includes: a semiconductor substrate; a cavity disposed in the substrate and extending in a horizontal direction of the substrate; a groove disposed on the substrate and...
7240428 Method for making probes for atomic force microscopy  
A method for producing probes for atomic force microscopy comprises producing, on a surface of one side of a semiconductor substrate, one or more moulds for the production of one or more probe...
7208831 Semiconductor device having multilayer wiring structure and method, wherein connecting portion and wiring layer are formed of same layer  
A method for manufacturing a semiconductor device includes a step of forming a first groove in a first insulating film, forming a conductive film in the first groove, a step of selectively forming...
7199448 Integrated circuit configuration comprising a sheet-like substrate  
An integrated circuit is formed on a non-planar substrate. The integrated circuit is formed over a plurality of layers. Chemical or physical changes in the microstructure of the substrate cause the...
7187067 Sensor chip packaging structure  
A sensor chip for defining an exposed molding region is disclosed. The sensor chip includes a semiconductor chip and a metal dam bar protruding from the active surface of the semiconductor chip....
7157755 Polymer sacrificial light absorbing structure and method  
Method and structure for optimizing dual damascene patterning with polymeric dielectric materials are disclosed. Certain embodiments of the invention comprise polymeric sacrificial light absorbing...
7151057 Flexible MEMS transducer manufacturing method  
A method for manufacturing a flexible MEMS transducer includes forming a sacrificial layer on a flexible substrate, sequentially depositing a membrane layer, a lower electrode layer, an active...
7095064 Semiconductor sensor with pressure difference adjusting means  
In a semiconductor sensor having a membrane structure, the destruction of the membrane caused by the expansion or contraction of a fluid within a hollow part formed under the membrane while the...
7071520 MEMS with flexible portions made of novel materials  
MEMS devices are provided that are capable of movement due to a flexible portion formed of unique materials for this purpose. The MEMS device can have a flexible portion formed of a nitride or...
7071031 Three-dimensional integrated CMOS-MEMS device and process for making the same  
A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The structure includes a metal stud connecting a surface of the...
7064401 Thin film piezoelectric element, method of manufacturing the same, and actuator  
Two piezoelectric thin films each sandwiched between a main electrode layer and an opposite electrode layer are laminated in pairs so as to form a thin film piezoelectric element. An electrode...
7057246 Transition metal dielectric alloy materials for MEMS  
Micromechanical devices are provided that are capable of movement due to a flexible portion. The micromechanical device can have a flexible portion formed of a nitride of preferably an element from...
7035083 Interdigitated capacitor and method for fabrication thereof  
A capacitor for use within a microelectronic product employs a first capacitor plate layer that includes a first series of horizontally separated and interconnected tines. A capacitor dielectric...
7034375 Micro electromechanical systems thermal switch  
A Micro Electro-Mechanical Systems (MEMS) thermal switch. The switch includes a FET having a source and drain in a substrate and a beam isolated from the substrate. The beam is positioned over the...
7030432 Method of fabricating an integrated circuit that seals a MEMS device within a cavity  
A method of fabricating an integrated circuit that includes a microelectromechanical (MEMS) device. The method includes forming a MEMS device on a substrate and forming an integrated circuit. The...
7026697 Microstructures comprising a dielectric layer and a thin conductive layer  
Surface micromachined structures having a relatively thick dielectric layer and a relatively thin conductive layer bonded together.
7015556 Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and saw device  
A basic portion layer 21 of a substrate electrode 12 a connected to a projecting electrode 13 electrically and mechanically on a substrate member of ceramics. The substrate member on which...
7012026 Method for producing defined polycrystalline silicon areas in an amorphous silicon layer  
A method of producing well-defined polycrystalline silicon regions is described, in particular for producing electrically conducting regions, in which a substrate is provided with an insulating...
6972447 Semiconductor component having a first earlier structure differing from a second earlier structure  
A semiconductor component for a semiconductor substrate, in which a first section and a second section are provided, and in which the pore structure of the first section differs from the pore...
6967362 Flexible MEMS transducer and manufacturing method thereof, and flexible MEMS wireless microphone  
A flexible wireless MEMS microphone includes a substrate of a flexible polymeric material, a flexible MEMS transducer structure formed on the substrate by PECVD, an antenna printed on the substrate...
6943391 Modification of carrier mobility in a semiconductor device  
Tensile or compressive stress may be added in one or more selected locations to the biaxial residual stress existing in the channel of a semiconductor device, such as a MOSFET. The periphery of the...
6939736 Ideal operational amplifier layout techniques for reducing package stress and configurations therefor  
A method of reducing package stress includes placing matched components of an op-amp substantially in a region of a die having the least stress gradients. The region is located in the center of the...
6900510 MEMS devices and methods for inhibiting errant motion of MEMS components  
A Microelectromechanical (MEMS) device and method of fabrication that can minimize derailing of an actuable element of the MEMS device during fabrication can include a MEMS actuator to selectively...
6867061 Method for producing surface micromechanical structures, and sensor  
A method is described for producing surface micromechanical structures having a high aspect ratio, a sacrificial layer being provided between a substrate and a function layer, trenches being...
6858911 MEMS actuators  
A Microelectromechanical (MEMS) device that can minimize the effects of fabrication tolerances on the operation of the device can include a MEMS electromagnetic actuator to selectively generate...
6835589 Three-dimensional integrated CMOS-MEMS device and process for making the same  
A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The MEMS has an anchor portion having a conductor therethrough, by...
6833570 Structure comprising an insulated part in a solid substrate and method for producing same  
A structure having a first part and at least one second part. The second part is electrically insulated from the first part and the parts are formed in the same wafer of a material. The first and...
6831340 Surface acoustic wave device and method of producing the same  
A surface acoustic wave device includes a piezoelectric substrate and interdigital electrode portions disposed on the piezoelectric substrate. A functional film including at least one of a silicon...
6825512 Micromachined sensor with insulating protection of connections  
An active part of a sensor is formed, for example, by micro-machined silicon wafers bearing electronic elements, electrical conductors, connection pads, and pins. The pads are electrically...
6812055 MEMS devices and methods of manufacture  
Microelectromechanical (MEMS) devices that use MEMS electromagnetic actuators to selectively generate displacement forces are disclosed herein. According to one exemplary embodiment disclosed...
6787866 Semiconductor device having a moveable member therein and a protective member disposed thereon  
A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is...
6787438 Device having one or more contact structures interposed between a pair of electrodes  
A microelectromechanical device is provided which includes a contact structure interposed between a pair of electrodes arranged beneath a beam. In some embodiments, the device may include...
6762116 System and method for fabricating microcomponent parts on a substrate having pre-fabricated electronic circuitry thereon  
A system and method is described for fabricating microcomponents onto pre-existing integrated electronics. One embodiment of the present invention provides additional process steps after completion...
6724023 Field effect transistor, especially for use as a sensor element or acceleration sensor  
A field effect transistor suited for use as a sensor element or in an acceleration sensor is described. For this purpose, the field effect transistor within a planar substrate has a drain area and...
Matches 1 - 50 out of 191 1 2 3 4 >