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Match Document Document Title
9024430 Semiconductor device  
A semiconductor device includes a semiconductor element in a frame body. The semiconductor element includes a first electrode electrically connected to an electrode block provided on a first side...
8963315 Semiconductor device with surface electrodes  
A semiconductor device includes a plate-shaped semiconductor element and an electrically insulating resin member. The semiconductor element has a front-surface electrode on its front surface and a...
8933484 Heat transfer member and module with the same  
A heat transfer member is disposed between a semiconductor element and an electrode plate. The heat transfer member comprises a metal portion extending between a first face at the semiconductor...
8907376 Stretchable electronic circuit  
A stretchable electronic circuit that includes a stretchable base substrate having a plurality of stretchable conductors formed onto a surface thereof, with both the stretchable base substrate and...
8890163 Semiconductor device including metal silicide layer and method for manufacturing the same  
A device formed from a method of fabricating a fine metal silicide layer having a uniform thickness regardless of substrate doping. A planar vacancy is created by the separation of an...
8829545 Group III nitride semiconductor light-emitting device  
A group III nitride semiconductor light-emitting device comprises an n-type gallium nitride-based semiconductor layer, a first p-type AlXGa1-XN (0≦X<1) layer, an active layer including an InGaN...
8742500 Semiconductor device  
A semiconductor device is disclosed wherein a peripheral region with a high breakdown voltage and high robustness against induced surface charge is manufactured using a process with high mass...
8618557 Wide-band-gap reverse-blocking MOS-type semiconductor device  
A wide-band-gap reverse-blocking MOS-type semiconductor device includes a SiC n−-type drift layer; a p+-type substrate on the first major surface side of the drift layer; a trench extending...
8456001 Pressure-contact semiconductor device  
A pressure-contact semiconductor device (100) includes thermal buffer plates (2) and main electrode blocks (3) having flanges (4), by which semiconductor substrate (1) having a pair of electrodes...
8421087 Semiconductor module including a switch and non-central diode  
A semiconductor module having one or more silicon carbide diode elements mounted on a switching element is provided in which the temperature rise is reduced by properly disposing each of the diode...
8304889 Power semiconductor module and fabrication method thereof  
An elastic printed board is provided so that stress applied by the silicon gel is absorbed by the printed board. Further, the printed board is formed to be so narrow that the stress can escape. On...
8304819 Semiconductor device including metal silicide layer and method for manufacturing the same  
A device formed from a method of fabricating a fine metal silicide layer having a uniform thickness regardless of substrate doping. A planar vacancy is created by the separation of an...
8283763 Power semiconductor module and fabrication method thereof  
An elastic printed board is provided so that stress applied by the silicon gel is absorbed by the printed board. Further, the printed board is formed to be so narrow that the stress may be...
8222741 Semiconductor module with current connection element  
A semiconductor module having a current connection element designed for a high current carrying capability is disclosed. In one embodiment, the current connection element includes a plurality of...
8168985 Semiconductor module including a switch and non-central diode  
A semiconductor module having one or more silicon carbide diode elements mounted on a switching element is provided in which the temperature rise is reduced by properly disposing each of the diode...
8163651 Method of fabricating semiconductor substrate by use of heterogeneous substrate and recycling heterogeneous substrate during fabrication thereof  
The invention discloses a method of fabricating a first substrate and a method of recycling a second substrate during fabrication of the first substrate. The second substrate is heterogeneous for...
8143645 Semiconductor device having a stacked multi structure that has layered insulated gate-type bipolar transistors  
Each of first base regions of sequentially layered first IGBT and second IGBT has a peripheral section in the vicinity of the side face of the semiconductor substrate. Each of the IGBTs includes a...
8072084 Integrated circuit, circuit system, and method of manufacturing  
An integrated circuit, a circuit system and method of manufacturing such is disclosed. One embodiment provides a circuit chip including a first contact field on a chip surface; and an insulating...
7948007 Power semiconductor module with flush terminal elements  
A power semiconductor module includes a housing, terminal elements leading to the outside of the housing, an electrically insulated substrate arranged inside the housing, with the substrate being...
7943956 Semiconductor device comprising a housing containing a triggering unit  
A housing for a semiconductor device is disclosed. In an exemplary embodiment of the present invention, the housing comprises a semiconductor substrate that is arranged between two contact...
7732817 Pattern formed structure, method of forming pattern, device, electrooptical device and electronic equipment  
A partition-wall structure having a concave portion corresponding to a pattern formed by a functional liquid, including: a first concave portion provided corresponding to a first pattern; a second...
7705474 Connection structure for connecting flexible printed circuit to main substrate using a potting resin in a through-hole  
A main substrate is provided with a wiring pattern on its surface and in the inner layer. A wiring pattern for connecting the signal line or power line of the main substrate to an external circuit...
7692293 Semiconductor switching module  
A semiconductor switching module includes a power semiconductor element that is embodied in planar technology. In at least one embodiment, the power semiconductor element is provided with a base...
7671382 Semiconductor device with thermoplastic resin to reduce warpage  
A semiconductor device which includes a radiating plate, a wiring patterned layer on the radiating plate via an insulating layer, at least one semiconductor chip mounted on the wiring patterned...
7619289 MEMS switch and method for manufacturing the same  
A MEMS switch includes a lower substrate having a signal line on an upper surface of the lower substrate; an upper substrate, having a cavity therein, disposed apart from the upper surface of the...
7615863 Multi-dimensional wafer-level integrated antenna sensor micro packaging  
An integrated packaging assembly for an MMIC that uses the semiconductor wafers on which circuit elements are fabricated as the package. The packaging assembly includes a plurality of...
7582919 Functional coating of the SCFM preform  
The invention relates to a power semiconductor module having at least one semiconductor chip (11) made of a semiconductor material and having a first and a second main electrode (12, 13), a first...
7420224 Active rectifier module for three-phase generators of vehicles  
A rectifier for rectifying alternating current into direct current is described, in which a three-phase generator includes a three-phase stator winding. The phases of the stator winding are...
7397066 Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers  
Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device includes an imager die having a substrate,...
7262444 Power semiconductor packaging method and structure  
A semiconductor chip packaging structure comprising a dielectric film having one or more through holes aligned with the one or more contact pads of at least one power semiconductor chip. A...
7221004 Semiconductor module  
Disclosed is a semiconductor module comprising a semiconductor element (1) and two terminal electrodes (3a, 3b, 3c) between which the semiconductor element (1) is disposed and with which the...
7132698 Compression assembled electronic package having a plastic molded insulation ring  
A compression assembled semiconductor package for housing a power semiconductor die which includes two major pole pieces in intimate electrical contact with respective major electrodes of a power...
6995409 Module for high voltage power for converting a base of IGBT components  
This power switching cell comprises: at least two power components (4–6) forming a chain (2) of components electrically linked in series by way of at least one intermediate bond (52, 70), anda...
6933541 Emitter turn-off thyristors (ETO)  
A family of emitter controlled thyristors employ plurality of control schemes for turning the thyristor an and off. In a first embodiment of the present invention a family of thyristors are...
6930333 Semiconductor device wiring structure  
A semiconductor device wiring structure is provided to reduce the wiring inductance and curtail the generation of interfering electromagnetic waves. A semiconductor chip having an anode electrode...
6863769 Configuration and method for making contact with the back surface of a semiconductor substrate  
A base body is provided, on which a first sealing ring and a second sealing ring are disposed. A substrate is disposed on the sealing rings in such a way that a cavity is formed between the first...
6849879 Crosstalk reduction in a crosspoint thyristor switching array using a shielded dielectric stack  
A method and apparatus are disclosed for reducing crosstalk and dispersion in a crosspoint monolithic microwave integrated circuit (MMIC) switch array operating in a range between DC and microwave...
6831307 Semiconductor mounting system  
An object of the present invention is to provide a novel semiconductor mounting system having a semiconductor mounting member, a metal member and a joining layer joining the mounting and metal...
6828600 Power semiconductor module with ceramic substrate  
A power semiconductor module is presented in which terminal elements are press-fitted into openings in a plastic housing. This measure improves the reliability of the internal bonds between the...
6759735 High power semiconductor device having semiconductor chips  
A plurality of semiconductor chips is each arranged over a first conductor. Each of semiconductor chips has a first main electrode, a second main electrode and a control electrode. A second...
6710443 INTEGRATED CIRCUIT PROVIDING THERMALLY CONDUCTIVE STRUCTURES SUBSTANTIALLY HORIZONTALLY COUPLED TO ONE ANOTHER WITHIN ONE OR MORE HEAT DISSIPATION LAYERS TO DISSIPATE HEAT FROM A HEAT GENERATING STRUCTURE  
In one embodiment, an integrated circuit includes a heat generating structure within a dielectric region and one or more substantially horizontally arranged heat dissipation layers within the...
6686658 Semiconductor device, including an arrangement to provide a uniform press contact and converter using same  
In accordance with a press contact type semiconductor device, a metallic body having macroscopic vacancies inside is arranged between a main electrode of the semiconductor device and a main...
6683329 Semiconductor device with slot above guard ring  
A semiconductor device includes an electronic circuit, a metal guard ring surrounding the electronic circuit, and a passivation layer covering the electronic circuit and guard ring. The...
6614105 Chip-type semiconductor device  
A TRIAC which is one species of chip-type semiconductors includes an element body made of silicon, electrodes provided on one face of the element body, a molybdenum plate provided on one of the...
6445013 Gate commutated turn-off semiconductor device  
A first cathode flange (14) provided with branch-like protrusions (14d) extending towards substantially its outer periphery and a gate flange (15) provided with branch-like protrusions (15c)...
6423988 Pressure-contact semiconductor device  
This invention relates to a pressure-contact type semiconductor device (1) having a ring-shaped gate terminal, and aims at overcoming such a technical problem that a gate current is not uniformly...
6373129 Semiconductor apparatus with pressure contact semiconductor chips  
A semiconductor apparatus includes a plurality of semiconductor units and a common gate liner having silicon chip resistors at portions corresponding to the semiconductor units. Each unit includes...
6369411 Semiconductor device for controlling high-power electricity with improved heat dissipation  
A semiconductor device including (a) a base plate, (b) an insulation substrate including of an insulator plate with a front electrode and a back electrode bonded thereon and fixed onto the base...
6365965 Power semiconductor module with terminals having holes for better adhesion  
A power semiconductor module, a metal terminal for the power semiconductor module, and methods of fabricating a power semiconductor module and the metal terminal are disclosed. In the power...
6323547 Pressure contact type semiconductor device with ringshaped gate terminal  
In a GCT device which controls large current at the operating frequency of 1 kHz or more, a ring-shaped gate terminal (10) is made of a magnetic material with the maximum permeability of 15,000 or...

Matches 1 - 50 out of 96 1 2 >