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Match Document Document Title
8999863 Stress liner for stress engineering  
A stress liner having first and second stress type is provided over a first type and a second type transistor to improve reliability and performance without incurring area penalties or layout...
8933484 Heat transfer member and module with the same  
A heat transfer member is disposed between a semiconductor element and an electrode plate. The heat transfer member comprises a metal portion extending between a first face at the semiconductor...
8900969 Methods of stress balancing in gallium arsenide wafer processing  
Systems, apparatuses, and methods related to the design, fabrication, and manufacture of gallium arsenide (GaAs) integrated circuits are disclosed. Copper can be used as the contact material for a...
8698302 Power switching assembly having a robust gate connection  
A structurally robust power switching assembly, that has a power transistor, comprising a thin and delicate layer of metal oxide, and a major surface of the layer of metal oxide being...
8624391 Chip design with robust corner bumps  
An integrated circuit structure includes a semiconductor chip, which includes a corner, a side, and a center. The semiconductor chip further includes a plurality of bump pad structures distributed...
8558290 Semiconductor device with dual metal silicide regions and methods of making same  
Disclosed herein are various semiconductor devices with dual metal silicide regions and to various methods of making such devices. In one example, the device includes a gate electrode and a...
8354720 Embedded stressor for semiconductor structures  
A semiconductor structure includes a semiconductor substrate; a gate stack on the semiconductor substrate; a plurality of spacers disposed on laterally opposing sides of the gate stack; source and...
8354692 Vertical semiconductor power switch, electronic component and methods of producing the same  
A vertical semiconductor power switch has a semiconductor body having a first surface and a second surface. At least one anode and one control electrode are positioned on the first surface and at...
8338258 Embedded stressor for semiconductor structures  
A method of fabricating an embedded stressor within a semiconductor structure and a semiconductor structure including the embedded stressor includes forming forming a dummy gate stack over a...
8304889 Power semiconductor module and fabrication method thereof  
An elastic printed board is provided so that stress applied by the silicon gel is absorbed by the printed board. Further, the printed board is formed to be so narrow that the stress can escape. On...
8283763 Power semiconductor module and fabrication method thereof  
An elastic printed board is provided so that stress applied by the silicon gel is absorbed by the printed board. Further, the printed board is formed to be so narrow that the stress may be...
8232160 Phase change memory device and method of manufacturing the same  
A phase change memory device having a strain transistor and a method of making the same are presented. The phase change memory device includes a semiconductor substrate, a junction word line,...
8129746 Phase change memory device and method of manufacturing the same  
A phase change memory device having a strain transistor and a method of making the same are presented. The phase change memory device includes a semiconductor substrate, a junction word line,...
8110736 Thermoelectric element device and thermoelectric module  
The present invention according to one preferred embodiment provides a thermoelectric element device comprising a first electrode including an electrode member, an elastic member that has...
8072084 Integrated circuit, circuit system, and method of manufacturing  
An integrated circuit, a circuit system and method of manufacturing such is disclosed. One embodiment provides a circuit chip including a first contact field on a chip surface; and an insulating...
8044431 Microdisplay packaging system  
Some embodiments provide a microdisplay integrated circuit (IC), a substantially transparent protective cover coupled to the microdisplay IC, and a base coupled to the microdisplay IC. Thermal...
8035127 Packaging substrate structure with a semiconductor chip embedded therein  
A packaging substrate structure with a semiconductor chip embedded therein is disclosed, including a carrier board having a first and an opposed second surfaces and disposed with at least a...
7943961 Strain bars in stressed layers of MOS devices  
A semiconductor structure includes an active region; a gate strip overlying the active region; and a metal-oxide-semiconductor (MOS) device. A portion of the gate strip forms a gate of the MOS...
7923645 Metal etch stop fabrication method and structure  
A first patterned etch stop layer and a first patterned conductor layer are laminated by a dielectric material to a second patterned etch stop layer and a second patterned conductor layer. As the...
7868336 Semiconductor device and method of manufacturing the same  
According to the present invention, protrusions 4 are formed on electrodes 3 of semiconductor elements 6, and an optical member 7 is secured on the semiconductor element 6 with an adhesive 8 so as...
7863646 Dual oxide stress liner  
A transistor structure includes a first type of transistor (e.g., P-type) positioned in a first area of the substrate, and a second type of transistor (e.g., N-type) positioned in a second area of...
7847318 Multilayer build-up wiring board including a chip mount region  
Mesh holes 35a and 59a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50 are not...
7833830 3D interconnect with protruding contacts  
This invention relates to a semiconductor having protruding contacts comprising, a first semiconductor substrate having at least one interconnect located substantially within the first substrate,...
7781851 Semiconductor device having reduced die-warpage and method of manufacturing the same  
A semiconductor device and a method of manufacturing the same reduce die-warpage. The semiconductor device includes a substrate and a first layer of material extending substantially over the...
7692293 Semiconductor switching module  
A semiconductor switching module includes a power semiconductor element that is embodied in planar technology. In at least one embodiment, the power semiconductor element is provided with a base...
7615477 Method of fabricating a BGA package having decreased adhesion  
Ball Grid Array packages having decreased adhesion of the BGA pad to the laminate surface and methods for producing same are provided.
7582919 Functional coating of the SCFM preform  
The invention relates to a power semiconductor module having at least one semiconductor chip (11) made of a semiconductor material and having a first and a second main electrode (12, 13), a first...
7521276 Compliant terminal mountings with vented spaces and methods  
A method of making chip assemblies includes providing an in-process assembly including a semiconductor wafer, a wafer compliant structure overlying a front surface of the wafer and cavities, and...
7470939 Semiconductor device  
A semiconductor device is disclosed that includes a first and a second semiconductor package. Each semiconductor package includes a semiconductor element, a plurality of electrode members, and an...
7449726 Power semiconductor apparatus  
The power semiconductor apparatus includes a resin package made up of a power semiconductor element and a control semiconductor element which are mounted on a main front surface of a lead frame...
7262507 Semiconductor-mounted device and method for producing same  
Semiconductor-mounted device comprises wired board, first semiconductor chip mounted on first side of wired board, second semiconductor chip mounted on second side of wired board and sealing resin...
7256431 Insulating substrate and semiconductor device having a thermally sprayed circuit pattern  
An insulating substrate includes a metal base as a base member, an insulating layer which is a room temperature, aerosol deposited shock solidification film formed on the metal base, and a circuit...
7227198 Half-bridge package  
A semiconductor package that includes two power semiconductor dies, such as power MOSFET dies, including vertical conduction MOSFETs, arranged in a half-bridge configuration is disclosed. The...
7187074 Semiconductor and electronic device with spring terminal  
A semiconductor or electronic device, such as a power module uses at least one spring terminal as a control terminal. The spring terminal is led outside a case through a coil-accommodating member,...
7084517 Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit  
A semiconductor device connecting structure is provided for connecting a semiconductor IC to a substrate. A bonding layer is placed between the substrate and the semiconductor IC to accomplish...
7046155 Fault detection system  
A fault detection system detecting malfunctions or deteriorations, which may result in an inverter fault, is provided. The system has a temperature sensor installed on a semiconductor module to...
7009292 Package type semiconductor device  
A package type semiconductor device comprising: a semiconductor chip having a semiconductor part; a main electrode for connecting to a first region of the semiconductor part; a control wiring...
6949828 Wiring structure having integral wiring portion and plug portion and method of forming the same  
In a wiring structure in which a wiring portion and a plug portion each made of a Cu material are formed integrally through a damascene process, the difference between deviation stress applied to...
6870266 Oxide semiconductor electrode and process for producing the same  
The present invention provides an oxide semiconductor electrode which can realize a combination of high transparency with large surface area and is highly responsive to ultraviolet light, as well...
6787815 High-isolation semiconductor device  
A switching device for switching a plurality of RF signal lines to deliver a selected one of the RF signals to a receiver has an isolation D/U characteristic as high as 40 dB or higher. The...
6399891 Multilayer boards  
A multilayer board free from breakage at connecting parts due to thermal fatigue is provided. A multilayer board 1 of the present invention comprises alternating polyimide films 11-16 and copper...
6087682 High power semiconductor module device  
High power semiconductor module device constituted in such a manner that a circuit board to which semiconductor pellets are bonded is bonded onto a heat sink, and an electrically insulating case...
6081039 Pressure assembled motor cube  
A pressure assembled power module is provided with first and second die, the first and second die being stacked atop one another and sandwiched between first and second conductive sheets, where...
5874774 Flat package semiconductor device  
A semiconductor device is provided which includes a plurality of semiconductor chips each of which has a first main electrode and a control electrode on a first main surface and a second main...
5739556 Pressure contact housing for semiconductor components  
In a pressure contact housing for semiconductor components, the gate electrode contact ring 4 is provided with spiral recesses 5. The latter can absorb axial movements produced during the assembly...
5721455 Semiconductor device having a thermal resistance detector in the heat radiating path  
In a semiconductor device comprising a semiconductor chip on which semiconductor elements are formed, the semiconductor device further comprises a thermal resistance detector for detecting an...
5641976 Pressure contact type semiconductor device with axial bias and radial restraint between a distortion buffer plate and a semiconductor body  
An alloy-free pressure contact type semiconductor device maintains a high reliability during transportation even without a pressure contact tool such as a simplified stack and therefore does not...
5635734 Insulated gate type semiconductor device in which the reliability and characteristics thereof are not deteriorated due to pressing action and power inverter using the same  
An insulated gate type semiconductor device has a gate electrode which controls current flow between two regions of the same conductivity type in a semiconductor substrate. A main electrode has a...
5578841 Vertical MOSFET device having frontside and backside contacts  
A multiple output, vertical MOSFET device (11) with improved electrical performance and thermal dissipation is integrated with an additional semiconductor device or semiconductor circuit (18) on a...
5539232 MOS composite type semiconductor device  
A plurality of segments of small-sized IGBT devices are arranged concentrically in a plurality of rows in a pellet substrate. Each segment has an independent polysilicon gate electrode layer. A...

Matches 1 - 50 out of 60 1 2 >