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5954996 |
Dental etch and package therefor
This disclosure relates to an anhydrous dental etchant composition that includes a mixture of phosphoric acid or an equivalent and anhydrous glycerin having a final acid concentration in the range...
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5932024 |
Decoating titanium and other metallized glass surfaces
Glass surfaces having titanium, stainless steel and/or other metals metallized thereon are denuded or reconditioned for a repeat of the initial metallization by contacting the initially metallized...
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5885339 |
Non-slip formulations
The present invention relates to formulations and methods for preventing surfaces of natural or mineral materials or cementitious products from becoming slippery, especially when wet. The...
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5885476 |
Composition for microetching copper or copper alloy
A microetching composition for copper or copper alloys comprising, (a) nitric acid or sulfuric acid, or both, (b) ferric nitrate or ferric sulfate, or both, (c) at least one component selected from...
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5871590 |
Vehicle cleaning and drying compositions
A touchless car wash composition, that can be made from a concentrate and diluted to use concentration using commonly available service water can comprise an ether amine or diamine in particular a...
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5858813 |
Chemical mechanical polishing slurry for metal layers and films
A polishing slurry for chemically mechanically polishing metal layers and films during the various stages of multilevel interconnect fabrication associated with integrated circuit manufacturing....
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5855805 |
Microetching and cleaning of printed wiring boards
The microetching and cleaning of copper clad substrates in printed wiring board production with solutions containing alkali metal persulfate and sulfuric acid is controlled to provide slower and...
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5807493 |
Microetching method for copper or copper alloy
A microetching composition for copper or copper alloys comprising, (a) a cupric ion source, (b) an organic acid with an acid dissociation constant (pKa) of 5 or less, (c) a halide ion source, and...
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5800859 |
Copper coating of printed circuit boards
A process for copper coating printed circuit boards is disclosed. The process includes a treating step in which a metal surface is contacted with an adhesion promotion composition material. The...
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5800577 |
Polishing composition for chemical mechanical polishing
A polishing composition for chemical mechanical polishing which comprises a carboxylic acid, an oxidizing agent, and water and has pH adjusted to 5 to 9 with an alkali. In chemical mechanical...
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5783495 |
Method of wafer cleaning, and system and cleaning solution regarding same
A method of cleaning wafer surfaces includes providing a wafer surface and cleaning the wafer surface using at least hydrofluoric acid (HF) and an etch reducing component. The etch reducing...
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5762819 |
Baths and process for chemical polishing of stainless steel surfaces
Phosphoric acid-free baths for chemical polishing of stainless steel surfaces, including, in aqueous solution, a mixture of hydrochloric acid and of nitric acid, an optionally substituted...
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5755989 |
Wet etching composition having excellent wetting property for semiconductors
The present invention provides a wet etching composition for semiconductors which is characterized in that a surfactant comprising the two components of an alkylsulfonic acid and an...
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5733377 |
Method for cleaning an automotive or truck wheel surface
A method for cleaning automotive or truck wheel surfaces. A cleaning composition containing an acid fluoride salt and having a pH of about 3 to 6.5 is applied to the automotive or truck wheel...
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5720823 |
Composition and process for desmutting and deoxidizing without smutting
A chromium and ferricyanide free aqueous deoxidizer/desmutter for aluminum and magnesium alloys contains nitric acid, ferric ions, and molybdate and/or condensed molybdate anions and preferably...
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5709756 |
Basic stripping and cleaning composition
An aqueous and basic stripping and cleaning composition is provided which contains a hydroxylamine, ammonium fluoride, water and optionally DMSO. The pH of the composition is greater than about 8....
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5705089 |
Cleaning fluid for semiconductor substrate
An acidic or basic hydrogen peroxide cleaning fluid for cleaning a semiconductor substrate, comprising a phosphonic acid chelating agent and a wetting agent, or comprising a wetting agent alone.
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5700389 |
Etching solution for copper or copper alloy
An etching solution for copper or copper alloys comprising, (a) sulfuric acid, (b) a persulfate, (c) at least one compound selected from imidazole, imidazole derivatives, pyridine derivatives,...
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5696035 |
Etchant, etching method, and method of fabricating semiconductor device
An etchant includes an aqueous solution containing citric acid, ammonium citrate, and hydrogen peroxide, wherein the mol ratio of ammonium citrate to citric acid is not less than 1. Using this...
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5688366 |
Etching method, method of producing a semiconductor device, and etchant therefor
A method of etching material as a transparent conductive film, a method of producing a semiconductor device, and an etchant therefor are disclosed. These method and etchant are simple, excellent in...
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5645737 |
Wet clean for a surface having an exposed silicon/silica interface
A surface having an exposed silicon/silica interface is cleaned by an HF dip, followed immediately by a rinse in citric acid, followed by a rinse in deionized water. Low pH of the citric acid...
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5635463 |
Silicon wafer cleaning fluid with HN0.sub.3, HF, HCl, surfactant, and water
The present invention provides a silicon wafer cleaning fluid, comprising 35 to 65% by weight of HNO 3 , 0.05 to 0.5% by weight of HF, 0.05 to 0.5% by weight of HCl, 0.002 to 0.1% by weight of a...
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5635022 |
Silicon oxide removal in semiconductor processing
The present invention provides methods of removing or etching silicon oxide from a semiconductor wafer by contacting the silicon oxide with diorganocarbonates, including comprising hydrocarbyl...
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5630950 |
Copper brightening process and bath
A process and aqueous bath for bright dipping of a copper containing substrate. The bath includes: an acid, hydrogen peroxide and a bath soluble, peroxide stable constituent effective for creation...
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5616255 |
Solution and process for chemically resharpening smoothing tools, forming tools, and cutting tools
A solution and process for chemically resharpening smoothing tools, forming tools, and cutting tools such as files, jigsaw blades, hacksaw blades, coping saw blades, bandsaw blades, and other...
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5603849 |
Methods and compositions for cleaning silicon wafers with a dynamic two phase liquid system with hydrofluoric acid
Methods and compositions are disclosed for cleaning oxides and metals from surfaces of silicon wafers in a two-phase liquid system. The two-phase system comprises a fluorine containing oxide...
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5599399 |
Baths and process for the chemical polishing of stainless steel surfaces
Process for chemical polishing of austenitic stainless steel surfaces using chemical polishing baths effective at a slow rate of reaction. The baths include in an aqueous solution a mixture of...
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5571375 |
Method of removing native oxide film from a contact hole on silicon wafer
A method of removing a native oxide film on a main surface of a silicon wafer. The native oxide film is formed in a contact hole of a patterned BPSG film or PSG film formed on the main surface. The...
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5538152 |
Stabilizing composition for inorganic peroxide solutions
Stabilizing composition for inorganic peroxides and hydrogen peroxide intended for baths for the surface treatment of metal components comprising at least one activating agent selected from...
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5535904 |
Surface preparation for bonding iron
The present invention relates to an improved etchant for iron materials and method for etching iron materials. The etchant is an aqueous solution of ferrous chloride and phosphoric acid. The...
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5532094 |
Composition for treating copper or copper alloy surfaces
A method for roughening surfaces of copper or copper alloy to provide an excellent adhesion of a coated or laminated layer thereon, comprising treating said surfaces with an amount and for a time...
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5512201 |
Solder and tin stripper composition
A metal dissolving liquid and method for stripping tin and solder coatings, including the underlying tin-copper alloy, from the copper substrate of a printed circuit board. The liquid includes an...
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5505872 |
Solder stripper recycle and reuse
This invention relates to the removal of lead from spent ferric nitrate based solder strippers, the regeneration of the spent ferric nitrate based solder strippers, and the reuse of these solutions...
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5496485 |
Etching compositions
An aqueous composition for etching and cleaning semiconductor devices comprises a solution of an acid and a surfactant which is a branched chain aliphatic amine having the formula C m H 2m +3 N,...
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5492595 |
Method for treating an oxidized copper film
The present invention is directed to an improved method for treating an oxidized surface of a copper film for bonding to a resinous layer such as in the formation of a single-sided, double-sided,...
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5478436 |
Selective cleaning process for fabricating a semiconductor device
A selective cleaning process for fabricating a semiconductor device includes the steps of processing a semiconductor substrate (10) and introducing metal contaminants (22) by contacting the...
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5462638 |
Selective etching of TiW for C4 fabrication
A chemical etchant (and a method for forming the etchant) is disclosed for removing thin films of titanium-tungsten alloy in microelectronic chip fabrication. The alloy removed is preferably 10% Ti...
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5462640 |
Etching solution
An etching solution for etching away a metal layer from a substrate includes a hydrogen-containing compound that dissolves the metal layer while developing hydrogen; and a nitrosubstituted organic...
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5460694 |
Process for the treatment of aluminum based substrates for the purpose of anodic oxidation, bath used in said process and concentrate to prepare the bath
Process for the treatment of aluminum based substrates for the purpose of their anodic oxidation, comprising a surface treatment or chemical etching step using an acid bath comprising at least one...
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5439783 |
Composition for treating copper or copper alloys
A composition suitable for the treatment of surfaces of copper and copper alloys is disclosed. It comprises, (a) a cupric complex of an azole compound, (b) an organic acid having a boiling point or...
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5417802 |
Integrated circuit manufacturing
The addition of ligands for chelating Group I and Group II ions to organic solvents used for photoresist removal and etched conductor cleaning enhances the shelf life of these solvents....
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5415731 |
Method of preparing non-glare glass
A method of preparing a non-glare glass comprising (a) applying a printing ink consisting of water, sugar, carboxymethyl cellulose, starch powder, and aluminum oxide on the surface of the glass by...
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5387361 |
Etching liquid for aluminium, method of etching aluminium and etched aluminium product
Aluminum is etched with an etching liquid comprising an aqueous solution containing a hydrofluoride of an aliphatic primary, secondary or tertiary amine of a formula: R 1 --N(R 3 )--R 2 where R...
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5384064 |
Hydrochloric acid pickling accelerator
A hydrochloric acid pickling accelerator for batch and continuous hydrochloric acid pickling baths for all types of steel, comprising an admixture of from about 10 to about 15 percent by weight...
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5378315 |
Removing imaging member layers from a substrate
Environmentally compatible solvents are used in a method for removing coating layers from an electrostatographic imaging member substrate. The solvents include a solution containing at least one...
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5376236 |
Process for etching titanium at a controllable rate
A process for removing titanium from a device is disclosed. The titanium is etched at a controllable rate. The etchant oxidizes the titanium, and the oxidized titanium forms a complex in the...
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5364549 |
Hydrogen peroxide solutions
It would be desirable to replace nitric acid based solutions for surface treating steels and like materials with a sulphuric acid based solution containing hydrogen peroxide, but such replacement...
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5336425 |
Acidic aluminum cleaner containing an oxidant and a nonionic surfactant stabilized by a glycol
The stability of an acidic liquid cleaner for aluminum comprising mineral acid, oxidant, polyvalent metal ions, and surfactant is substantially improved by the presence in the cleaner of from 0.05...
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5334284 |
Surface treatment of indium phosphide utilizing chemical roughening of the surface
A surface (30) of a wafer of indium phosphide (22) is treated by first etching the surface (30) with an aqueous solution of nitric acid and ceric ammonium nitrate. A toughening solution of about 4...
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5320709 |
Method for selective removal of organometallic and organosilicon residues and damaged oxides using anhydrous ammonium fluoride solution
A method for selectively removing oxidized organometallic residues, oxidized organosilicon residues, native oxides, and damaged oxides created in plasma-etching through emersion of plasma-etched...
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