|
Match
|
Document |
Document Title |
|
|
7618560 |
Stable metal/conductive polymer composite colloids and methods for making and using the same
Stable metal/conductive polymer composite colloids and methods for making the same are provided. The subject colloids find use in a variety of different applications, including analyte detection...
|
|
|
7611645 |
Thick film conductor compositions and the use thereof in LTCC circuits and devices
The present invention is directed to a thick film composition for use in low temperature co-fired ceramic circuits comprising, based on weight percent total thick film composition: (a) 30-98 weight...
|
|
|
7611644 |
Core-shell structure metal nanoparticles and its manufacturing method
The present invention provides metal nanoparticles, containing copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal...
|
|
|
7608557 |
Highly active photocatalyst and process for producing the same
Provided are a photocatalyst which is high in catalytic activity, is nontoxic, has a long life, allows visible light to be used directly for its photocatalytic reaction and is especially useful for...
|
|
|
7608205 |
Decentralized solution of microscopic particles and circuit formation device
Microscopic particle decentralized solution having microscopic particles with different diameters are decentralized, wherein: the microscopic particle decentralized solution has two peaks in a...
|
|
|
7608203 |
Metallic colloidal solution and inkjet-use metallic ink
A metallic colloidal solution (a) includes a water-based dispersion medium that is easy in handling with regard to safety and environment and metallic particles having a uniform particle diameter...
|
|
|
7604756 |
Preparation of silver particles using thermoplastic polymers
This invention relates to the synthesis and isolation of colloidal silver particles through the use of thermomorphic polymers and the resulting composition. It further relates to the use of the...
|
|
|
7601773 |
Room temperature-curable, heat-conductive silicone rubber composition
Provided is a room temperature-curable, heat-conductive silicone rubber composition, including: (A) a diorganopolysiloxane with both molecular chain terminals blocked with hydroxyl groups and/or...
|
|
|
7601197 |
Ultrafine metal powder slurry
In an ultrafine metal powder slurry containing an organic solvent, a surfactant, and an ultrafine metal powder, the surfactant is oleoyl sarcosine, the content of the ultrafine metal powder in the...
|
|
|
7588698 |
Circuit connecting adhesive
A circuit coupling adhesive which is superior in heat resistance and moisture resistance is provided. The circuit coupling adhesive of the present invention can be used for purposes where high...
|
|
|
7582229 |
Photopolymerization electrode paste composition
The present invention relates to an electrode paste composition, a front plate of plasma display panel, and a manufacturing method manufactured using the same. The front plate of plasma display...
|
|
|
7572396 |
Patterned photovoltaic cell
Patterned photovoltaic cells, as well as related components and methods, are disclosed.
|
|
|
7569164 |
Solder precoating method
A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within...
|
|
|
7569163 |
Polythioether amine resins and compositions comprising same
Polythioether amine resin compounds and compositions comprising the same are disclosed.
|
|
|
7569160 |
Electrically conductive UV-curable ink
An ultraviolet or electron beam curable conductive material for use in the electronics industry. The conductive material has a low viscosity and is capable of application to a substrate by high...
|
|
|
7560052 |
Silver ink compositions containing a cationic styrene/acrylate copolymer additive for inkjet printing
The present invention provides an aqueous ink containing ≧3% silver particles having much improved adhesion. It has been found that the adhesion can be improved by adding an aqueous cationic...
|
|
|
7560051 |
Metal particle dispersion liquid, method for manufacturing metal particle dispersion liquid, method for manufacturing conductive-film-forming substrate, electronic device and electronic apparatus
A metal particle dispersion liquid comprises: a compound including a sulfur atom; metal particles whose diameter ranges from 1 to 100 nm and made of a material including a precious metal material;...
|
|
|
7556748 |
Method of manufacture of semiconductor device and conductive compositions used therein
The present invention is directed to a thick film conductive composition comprising: (a) electrically conductive silver powder; (b) Zn-containing additive wherein the particle size of said...
|
|
|
7556747 |
Electrically conductive pastes
Provided is a conductive paste which can have high conductivity even if the sintering temperature is 500° C. or less, and which does not cause an interference pattern or crack on a substrate even...
|
|
|
7544314 |
Glass composition for thick film resistor paste, thick film resistor paste, thick-film resistor, and electronic device
A glass composition for a thick-film resistor including at least one oxide selected from CaO, SrO, and BaO in an amount of 13 mol % to 45 mol %, B 2 O 3 in 0 to 40 mol % (however, not including...
|
|
|
7537712 |
Electrically conductive silicone rubber composition
An electrically conductive silicone rubber composition comprises, at least, (A) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups per molecule, (B) an...
|
|
|
7531115 |
Conductive material and method for filling via-hole
The conductive material comprises a first metal material having a melting point of not more than 250° C. and a second metal material having a melting point of not less than 500° C., and is paste...
|
|
|
7528486 |
Anisotropic conductive film and bump, and packaging structure of semiconductor having the same
In an anisotropic conductive film including conductive particles, and a bump, and a packaging structure of a semiconductor chip having the anisotropic conductive film and the bump, the anisotropic...
|
|
|
7527749 |
Electrically conductive adhesives and methods of making
Modified electrically conductive adhesives and methods of preparation thereof, are disclosed.
|
|
|
7524893 |
Conductive adhesive
The present invention provides a conductive adhesive that is applicable as means for forming conductive junction to process for surface mounting of electronic parts for vehicle loading and process...
|
|
|
7521115 |
Low temperature bumping process
A method for low temperature bumping is disclosed. A resin capable of being cross-linked by free-radical or cationic polymerization at low temperature is provided. Electrically conductive particles...
|
|
|
7510673 |
Electroconductive paste and ceramic electronic component including electroconductive paste
For mounting on a substrate by using an electroconductive adhesive, an electroconductive paste for forming an external electrode which has improved moisture resistance and which is resistant to...
|
|
|
7504050 |
Modification of electrical properties of display cells for improving electrophoretic display performance
The invention is directed to a method for improving the performance of electrophoretic displays by modifying the electrical properties of the display cells.
|
|
|
7494608 |
Stabilized silver nanoparticle composition
A composition comprising a liquid and a plurality of silver-containing nanoparticles with a stabilizer, wherein the silver-containing nanoparticles are a product of a reaction of a silver compound...
|
|
|
7494607 |
Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
The present invention is directed to an electroconductive thick film composition comprising: (a) electroconductive metal particles selected from (1) Al, Cu, Au, Ag, Pd and Pt; (2) alloy of Al, Cu,...
|
|
|
7488434 |
Conductive paste for conductive substrate or conductive film
Membrane switches are manufactured by electrically conductive pastes consisting of 55 to 65% by weight of metal powder in the shape of flake (silver, aluminum, copper or the alloy thereof), 35 to...
|
|
|
7485245 |
Electrode paste for solar cell and solar cell electrode using the paste
An electrode paste for a solar cell comprising electrically conductive particles, lead-free glass frit, a resin binder and zinc oxide particles, wherein zinc oxide particles having a specific...
|
|
|
7485244 |
Internal electrode paste and production method of electronic device
An internal electrode paste comprises electrode material powder, a binder resin containing a polyvinyl butyral resin as the main component, and a solvent. The internal electrode paste furthermore...
|
|
|
7481953 |
Thick-film resistor paste and thick-film resistor
A thick-film resistor paste comprised of a resistor composition dispersed in an organic vehicle, the resistor composition containing at least one of RuO 2 and a Ru composite oxide as a conductive...
|
|
|
7462304 |
Conductive compositions used in the manufacture of semiconductor device
The present invention is directed to a thick film conductive composition comprising: (a) electrically conductive silver powder; (b) Mn-containing additive; (c) glass frit wherein said glass frit...
|
|
|
7459104 |
Low temperature fired, lead-free thick film heating element
A lead free, thick film heating element. Known thick film heating elements contain environmentally hazardous material such as lead. This is particularly problematic when manufacturing thick film...
|
|
|
7449132 |
Proton conductive composition and proton conductive membrane
The present invention provides a proton conductive membrane having capabilities of self-generating water and maintaining water, excellent ion conductivity and excellent effect of inhibiting...
|
|
|
7442327 |
Use of dispersions in making electronic devices
Dispersions useful in making capacitors, printed circuit boards, etc., comprising an electronic particulate solid, a carrier and a dispersant of formula (1): R—(O-A-CO)x(O—B—CO)y-Z wherein R...
|
|
|
7442226 |
Ultrafine metal powder slurry
In an ultrafine metal powder slurry containing an organic solvent, a surfactant, and an ultrafine metal powder, the surfactant is oleoyl sarcosine, the content of the ultrafine metal powder in the...
|
|
|
7438835 |
Transparent conductive film, coating liquid for forming such film, transparent conductive layered structure, and display device
This transparent conductive film comprises a single-layer film obtained by coating on a substrate a transparent conductive film-forming coating liquid which contains chainlike agglomerates of noble...
|
|
|
7438834 |
Anisotropic conductive adhesive having PTC characteristics
The present invention relates to an anisotropic conductive adhesive comprising an anisotropic conductive adhesive combined with a crystalline polymer to realize anisotropic conductivity and PTC...
|
|
|
7435360 |
Manufacturing process of conductive composition and a manufacturing process of conductive paste
A manufacturing method of conductive paste comprising arranging process (S 20 to S 23 ) of ceramics particles, arranging process (S 10 to S 14 ) of wetted metal particles, forming process (S 30 )...
|
|
|
7422707 |
Highly conductive composition for wafer coating
A conductive composition for coating a semiconductor wafer comprises conductive filler that has an average particle size of less than 2 microns and a maximum particle size of less than 10 microns,...
|
|
|
7416687 |
Electroconductive paste composition and printed wiring board
There is provided an electroconductive paste composition that can form a coating film having satisfactory thickness by single coating work. The electroconductive paste composition can form bumps...
|
|
|
7413686 |
Conductive particle and adhesive agent
A conductive particle can be used for connecting a variety of adherends. The conductive particle includes a resin particle, a first conductive particle disposed around the resin particle, a first...
|
|
|
7410601 |
Conductive paste for multilayer electronic part
Disclosed is a conductive paste for a multilayer electronic part to be screen-printed on a ceramic green sheet, comprising 70-95 weight % of conductive metal powder, a resin, and a solvent, wherein...
|
|
|
7390442 |
Anisotropic conductive film and method for producing the same
An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because...
|
|
|
7381353 |
Black conductive thick film compositions, black electrodes, and methods of forming thereof
This invention is directed to black conductive compositions, black electrodes made from such compositions and methods of forming such electrodes. In particular, the invention is directed to a...
|
|
|
7357884 |
Conductive ink composition
A conductive ink composition is obtained by dispersing, in an organic solvent, a solid material made from metal fine particles each coated with protective colloids each made of at least two organic...
|
|
|
7347957 |
Methods and compositions for improved electrophoretic display performance
The invention is directed to novel methods and compositions useful for improving the performance of electrophoretic displays. The methods comprise adding a high absorbance dye or pigment, or...
|