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7591409 |
Semiconductor device bonding apparatus and method for bonding semiconductor device using the same
The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a...
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7549566 |
Method, apparatus and program of thermal analysis, heat controller and heating furnace using the method
A heating characteristic value at any measuring point of an object at any measuring location of a heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at...
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7523848 |
Method and apparatus for measuring the size of free air balls on a wire bonder
A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed...
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7516878 |
Bump formation method and bump forming apparatus for semiconductor wafer
A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the...
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7493191 |
Auxiliary control apparatus for micro-manipulators used in ultrasonic bonding machines
An auxiliary control apparatus mechanically couples forces exerted on a manually operable auxiliary hand control knob to an input member of a micro-manipulator of the type used to move a point of...
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7458496 |
Wire bonder and method of operating the same
Wire bonder having a bonding head which has a bonding tool and a bonding wire guide and, especially, a bonding wire cutting device which comprises a cutter for separation of that section of a...
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7380697 |
Welding condition monitoring device
A welding condition monitoring device for monitoring the welding state of a welding work portion by taking an image thereof by an image sensor having a wide dynamic range and capable of taking an...
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7350684 |
Apparatus and method for forming bump
A preheat device ( 160 ) is provided to execute, before forming bumps ( 16 ) to electrode parts ( 15 ), a pre-formation temperature control for bonding promotion to promote bonding between the...
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7137544 |
Apparatus and method for performing welding at elevated temperature
A welding apparatus includes a workpiece housing having a window therethrough and having a welding access therethrough for a welder to an interior of the workpiece housing. The workpiece housing is...
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7086576 |
Machine for constructing the side wall of a cylindrical tank
The machine is adapted to supply, manipulate and position steel strip, fed from a coil, so as to bring it into gapped relationship beneath the side wall of a partly constructed, elevated tank. This...
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7014092 |
Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate
The present invention provides a bump forming apparatus which can prevent charge appearance semiconductor substrates from pyroelectric breakdown and physical failures, a method carried out by the...
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6983872 |
Substrate alignment method and apparatus
The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing...
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6983538 |
Method of mounting component on a circuit board
A method of mounting a component on an electrode on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solder for the...
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6955284 |
Device for positioning a tool in relation to a workpiece
The device for positioning a tool ( 1 ) in relation to a workpiece ( 6 ) controls drives ( 2, 3, 4 ) in relation to three spatial axes (x, y, z) through two cameras ( 10, 11 ), the first ( 1 ) of...
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6935552 |
High-precision method and apparatus for evaluating creep damage
A high-precision method for evaluating creep damage of high tension heat resistant steel used in high temperature exposed apparatuses involves comparing particle size behavior varying with creep...
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6910613 |
Device and method for forming bump
A preheat device ( 160 ) is provided to execute, before forming bumps ( 16 ) to electrode parts ( 15 ), a pre-formation temperature control for bonding promotion to promote bonding between the...
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6906924 |
Temperature-controlled rework system
A temperature-controlled rework system comprises a manifold assembly adapted to direct a cooling gas flow toward an area of a printed circuit board adjacent a rework zone to reduce a temperature of...
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6869006 |
Amplitude measurement for an ultrasonic horn
A method and system for directly measuring and controlling the amplitude of an ultrasonic horn comprising an ultrasonic horn, a non-contact measurement device for directly measuring an amplitude of...
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6832714 |
Heated filling device
A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a beating element positioned so as to transfer heat to fill material...
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6820792 |
Die bonding equipment
Die bonding equipment for fine pitch ball grid array package includes: a semiconductor chip pickup stage for inspecting a status of a loaded semiconductor chip and a corresponding position thereof;...
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6814273 |
Flatwire repair tool systems and methods
A system and method for reworking, repairing and upgrading flatwire is disclosed. A repair tool for reworking and/or repairing the flatwire is disclosed for creating subsequent electrical and...
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6799712 |
Conveyor oven profiling system
A system is disclosed for determining optimal process settings for a conveyor oven, such as a reflow oven used to reflow solder paste on a PCB assembly. According to a disclosed embodiment, an...
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6796480 |
Reliability of heat sink mounted laser diode bars
A laser diode bar, solder preform and heat sink are assembled prior to reflowing the solder in a manner to prevent molten solder from being drawn by capillary action over the light emitting end of...
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6757966 |
Component mounting system and mounting method
A component mounting system which includes a printer for printing solder on electrodes formed on a board; a first inspection unit for detecting positions of printed solder and outputting solder...
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6722554 |
Soldering apparatus
Soldering apparatus designed to apply soldering, by means of jetting out streams of molten solder, which is gathered in a solder bath, to a piece to be soldered carried in a predetermined...
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6715662 |
Waste energy recovery system for a controlled atmosphere system
A continuous controlled atmosphere brazing system includes a dry-off oven for driving off moisture from materials to be brazed, a pre-heat section for pre-heating the material and a brazing furnace...
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6708863 |
Heat bonding method and heat bonding device
In heat bonding method and device, first and second marks (MA, MB) formed on the film carrier ( 52 ) are measured before performing heat bonding of outer leads ( 54 ) formed on a film carrier ( 52...
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6691908 |
Brazing apparatus and brazing method in which the amount of heating is controlled on the basis of temperature of articles to be brazed
Articles to be brazed are preheated to an increased temperature in a preheating process and the temperature of the articles to be brazed is measured. Conversion data obtained and stored for...
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6657799 |
Wire bonding apparatus
A wire bonding apparatus including a bonding tool that performs bonding on a bonding part, a position detection camera which has a lens barrel and images the bonding part, a light source which...
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6651865 |
Position-, speed- and force-controllable chip accessing apparatus
A position-, speed- and force-controllable chip accessing apparatus comprises a fixing seat, a rotational direction moving device, a linear direction moving device, and a position sensing device,...
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6641026 |
Indirect imaging system for a bonding tool
A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube...
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6637637 |
Reflow apparatus
A reflow apparatus includes at least one heating unit. Each of the at least one heating unit includes an air blower for circulating air; a partition for defining an air circulating path; at least a...
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6619531 |
Temperature control method of solder bumps in reflow furnace, and reflow furnace
A method for determining the condition of a reflow furnace so as to prevent the semiconductor element from tilting due to different collapsed amounts of solder bumps in the single semiconductor...
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6609652 |
Ball bumping substrates, particuarly wafers
A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the...
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6585146 |
Automated non-destructive weld evaluation method and apparatus
A method and apparatus for automated, non-destructive evaluation of spot welds includes a device for heating a sample containing a spot weld, an infrared camera for detecting changes in the surface...
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6580050 |
Soldering station with built-in self-calibration function
A soldering station with a control unit and a soldering iron having a replaceable soldering tip, the soldering iron being connected to the control unit by a power cord for receiving electrical...
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6561408 |
Bonding head and component mounting apparatus
There is provided an inclination prevention member for preventing a pressing part from inclining to a supporting part. Therefore a pressing face and a stage face can be arranged to be nearly...
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6555418 |
Method for separating a semiconductor element in a semiconductor element pushing-up device
A push-up pin used for separating a semiconductor element attached by adhesive to an adhesive sheet of a semiconductor element pushing-up device in a die bonding apparatus from the adhesive sheet...
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6516990 |
Apparatus for making wire connections
An apparatus for making wire connections between a first connection area and a second connection area by means of a capillary. The apparatus contains an image recognition system which is designed...
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6481614 |
Apparatus for mounting semiconductor chips on a substrate
The invention concerns an apparatus for mounting semiconductor chips on a substrate with which the substrate is forwarded in steps in a first direction to a bonding station for the presentation of...
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6467673 |
Bonding apparatus and bonding method
Wire bonding method and apparatus in which axial center of a bonding tool is brought to a reference member, and light-emitting diodes are sequentially lit so that images of the reference member and...
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6467678 |
Wire bonding method and apparatus
A wire bonding method and apparatus, in which after the tail of a wire extends out of a capillary, the capillary moves to a measurement position above a tail length measuring member; the capillary...
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6464126 |
Bonding apparatus and bonding method
A wire bonding apparatus and method in which an axial center of a bonding tool is moved to the vicinity of a near reference member, laser diodes are sequentially lit, images of the reference member...
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6439447 |
Bump joining judging device and method, and semiconductor component production device and method
When electrodes on an electronic component and electrode portions on a circuit board are joined via bumps with the electronic component and the circuit board vibrated respectively, a vibration...
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6412680 |
Dual-in-line BGA ball mounter
A BGA ball mount line with a dual in-line mounter flowing into one reflow oven and one in-line cleaner. The dual in-line mounter comprises a first ball mount cell and a second ball mount cell. The...
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6371354 |
Apparatus for the temperature regulation of electronic components
An apparatus for the temperature regulation processing of electronic components such as semiconductor circuits, printed circuit boards and the like comprises a temperature regulated housing through...
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6354480 |
Apparatus for positioning a thin plate
A positioning apparatus includes: a stage having a flat placement surface on which a thin plate is mounted. The placement surface has a flat region which is slightly larger than and completely...
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6347732 |
Circuit board component retention
A method and implementing system is provided in which a gas, such as oxygen, is injected on to area of a circuit board to which an electronic component is being mounted. The injected gas causes a...
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6340107 |
Automatic motor vehicle assembly and welding station
A motor vehicle body assembly and welding station comprises a pair of facing tool ( 12 ) support conformators ( 11 ) designed to work on the body and taken between them by a conveyor system ( 14 )....
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6340109 |
Solder bump measuring method and apparatus
A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage...
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