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7387230 |
Brazing filter metal sheet and method for production thereof
In order to provide a brazing sheet having excellent workability, a powder of a brazing filler metal composition is obtained from a single type of powder or by mixing two or more powders to form...
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7357291 |
Solder metal, soldering flux and solder paste
Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities.
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7331498 |
Method for refining and homogeneously distributing alloying partners and for removing undesirable reaction products and slags in or from soft solder during the production of fine solder powder
Method for refining and homogeneously distributing alloying partners and for removing undesired reaction products such as oxides and/or slag in or from soft solder during the production of fine...
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7318547 |
Method for assembling parts made of materials based on SiC by non-reactive refractory brazing, brazing composition, and joint and assembly obtained by said method
Method for assembling at least two pieces of silicon carbide based materials by non reactive refractory brazing, wherein these pieces are put into contact with a non reactive brazing solder...
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7293688 |
Gold/nickel/copper/aluminum/silver brazing alloys for brazing WC-Co to titanium alloys
A brazing material including about 2 to about 30 percent by weight gold, about 4 to about 14 percent by weight nickel, about 25 to about 65 percent by weight copper, about 1 to about 3 percent by...
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7224067 |
Intermetallic solder with low melting point
Embodiments of the invention provide a low-melting temperature comprised primarily of a bulk intermetallic phase material. This solder may allow reflow with less of a chance to damage...
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7222776 |
Printed wiring board and manufacturing method therefor
A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is...
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7220493 |
Lead-free solder, and a lead-free joint
A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of...
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7219825 |
SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same
Provided are a solder bump, a method of manufacturing the same, and a method of bonding a light emitting device using the method of manufacturing the solder bump. In particular, the solder bump is...
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7189083 |
Method of retaining a solder mass on an article
A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of...
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7160504 |
Alloy type thermal fuse and fuse element thereof
The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type. The fuse element has an alloy composition in which a total of 0.01 to 7 weight parts of at least one...
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7157150 |
Brazing titanium to stainless steel using layered particulate
A method of bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a compact titanium-nickel filler material...
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7156280 |
Braze alloy compositions
A nickel-based high-temperature braze alloy composition includes Cr, Hf, and B. Furthermore, a cobalt-based high-temperature braze alloy composition includes Cr, Hf, and B. The braze alloys can be...
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7100815 |
Diebond strip
A titanium alloy strip has a reduced cross section in the central region of the strip. By concentrating heat in this central region the process of bonding laser devices to a substrate is greatly...
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7097090 |
Solder ball
A solder ball is formed from an Sn—Pb alloy which consists essentially of about 2–65 mass % of Sn, 0–5 mass % of Ag, about 0.1–1 mass % of Sb, and 0.01–0.1 mass % of Cu, and 0.01–0.1...
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7036710 |
Method and structures for implementing impedance-controlled coupled noise suppressor for differential interface solder column array
A method and structures are provided for implementing an impedance-controlled coupled noise suppressor for a differential interface solder column array used to join a substrate to a circuit card....
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7036709 |
Method and structure for implementing column attach coupled noise suppressor
A method and structure are provided for implementing a column attach coupled noise suppressor for a solder column structure of the type used to join a substrate to a circuit card. The electrical...
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7022415 |
Layered sphere braze material
The invention is a method of bonding a ceramic part ( 6 ) to a metal part ( 4 ) by heating a component assembly ( 2 ) comprised of the metal part ( 4 ), the ceramic part ( 6 ), and a thin laminated...
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7021518 |
Micromagnetic device for power processing applications and method of manufacture therefor
The present invention provides a power micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a power processing circuit employing the same,...
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7014093 |
Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
A process of making a multi-layer thermal interface material is depicted. The multi-layer thermal interface material is attached between an integrated heat spreader and a die. Processing of the...
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7007834 |
Contact bump construction for the production of a connector construction for substrate connecting surfaces
Contact bump construction ( 27 ) and method for the production of a contact bump construction for the formation of elevated contact sites on connecting surfaces ( 22 ) of a substrate ( 21 ),...
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6989200 |
Ceramic to noble metal braze and method of manufacture
The invention is a method of bonding a ceramic part to a metal part by heating a component assembly comprised of the metal part, the ceramic part, and a compatible interlayer material such as...
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6955285 |
Apparatus for aligning and dispensing solder columns in an array
An apparatus for aligning and dispensing a plurality of solder columns in an array. The apparatus includes a vibrator and an elongated alignment plate supported on the vibrator. The alignment plate...
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6938815 |
Heat-resistant electronic systems and circuit boards
Methods of making improved electronic systems and circuits boards, and more specifically to methods of making improved electronic systems and circuits boards using heat-resistant composite...
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6933449 |
Selective area solder placement
A printed circuit board having at least one layer of conductive traces on an external surface has at least one preformed solder element placed on a conductive trace area of the printed circuit...
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6917113 |
Lead-free alloys for column/ball grid arrays, organic interposers and passive component assembly
A lead free solder hierarchy structure for electronic packaging that includes organic interposers. The assembly may also contain passive components as well as underfill material. The lead free...
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6913184 |
Alloy composition and method for low temperature fluxless brazing
A family of low temperature brazing alloys wherein the alloy is utilized in the form of a filler metal or shim and consists of electroplated nickel on zinc shimstock, wherein the zinc shimstock...
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6892925 |
Solder hierarchy for lead free solder joint
A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module to a circuit board. An off-eutectic solder concentration of...
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6890844 |
Methods and apparatus for forming solder balls
Methods and apparatus for forming a plurality of uniformly sized solder balls utilize a stencil having a plurality of holes of uniform volume disposed on a substrate. Solder is disposed in the...
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6872465 |
Solder
In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made...
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6869007 |
Oxidation-resistant reactive solders and brazes
A method for fabricating a reactive solder or braze includes forming a metallic matrix with an interior region and surface regions by actively providing a higher concentration of reactive atoms to...
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6848610 |
Approaches for fluxless soldering
Improved fluxless soldering processes are disclosed. In accordance with one technique, a solder preform having a plurality of voids formed on its primary surfaces is disposed between metallized...
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6846575 |
Article having turbulation and method of providing turbulation on an article
An article includes turbulation material bonded to a surface of a substrate via a bonding agent, such as a braze alloy. In an embodiment, the turbulation material includes a particulate phase of...
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6843823 |
Liquid phase sintered braze forms
A braze preform and a method for making the braze preform are disclosed. The braze preform includes a filler metal that has been sintered to produce a liquid phase of at least a portion of the...
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6824039 |
Lead free tin based solder composition
Lead-free solder alloys based on a Sn—Ag—Mg system are disclosed. The alloy compositions have a melting temperature close to 183° C. and a similar surface tension to that of Sn—Pb solder,...
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6799711 |
Minute copper balls and a method for their manufacture
Minute copper balls having a high sphericity which are suitable for use as the cores of copper core solder balls are manufactured by heating small pieces comprising an alloy of 0.5-40 wt % of Zn...
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6793116 |
Solder ball and interconnection structure using the same
A solder ball achieves a desired quantity of solder material for a solder joint easily without increasing the thickness of a solder layer formed to cover a core. The solder ball comprises a...
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6773956 |
Method for contact-connecting a semiconductor component
A solder metal made of a eutectic or stoichiometric composition including at least two metallic or semiconducting elements is applied to a contact (of the semiconductor component, brought into...
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6732904 |
Solder ball holding terminal in a BGA arrangement
A solder ball holding terminal has a first plate, a second plate and a third plate integrally formed with and sandwiched between the first plate and the second plate. The first plate has a first...
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6689982 |
Apparatus and method for welding aluminum tubes
An apparatus and method for welding members that are formed at least in part of aluminum. A welding assembly is constructed and arranged to position a welding material in electrically conductive...
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6609651 |
Method of soldering a leaded circuit component
A two-part solder preform for use in attaching a leaded circuit component to a circuit board. The preform is formed by two different solid components, a first of which is formed of a...
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6582572 |
Target fabrication method for cylindrical cathodes
A method for fabricating cylindrical sputter targets for rotary cylindrical cathodes used in depositing a dielectric layer of desired alloy on non-planar substrates during sputtering is disclosed....
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6457632 |
Solder alloy and bonding method of substrate and electric or electronic parts with solder alloy
Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12% by weight of a zin component; and a tin component. The oxygen content of the solder alloy is...
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6427903 |
Solder ball placement apparatus
An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head...
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6399475 |
Process for producing electrical connections on the surface of a semiconductor package with electrical-connection drops
Process for producing electrical connections on the surface of a semiconductor package containing an integrated-circuit chip and having metal electrical-connection regions on the surface of the...
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6386426 |
Solder material and method of manufacturing solder material
Disclosed is a solder material and a manufacturing method thereof. The solder material has a first layer composed of a first metallic material and a second layer composed of a second metallic...
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6352195 |
Method of forming an electronic package with a solder seal
A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide...
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6347901 |
Solder interconnect techniques
A method and article of fabrication is described featuring a solder layer having a serpentine, interrupted, or interdigitated boundary. The non-planar design of the boundary layer increases the...
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6329631 |
Solder strip exclusively for semiconductor packaging
A transparent plastic solder strip being provided with a plurality of solder holes for each accommodating an amount of solder paste therein. These solder holes have a very small diameter and are...
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6326088 |
Diffusion-soldered joint and method for making diffusion-soldered joints
A diffusion-soldered joint and a method for making diffusion-soldered joints includes a particularly actively diffusing, low-melting-point intermediate layer, applied in the molten state,...
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