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8117982 |
Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold
A method and apparatus for the formation of coplanar electrical interconnectors. Solder material is deposited onto a wafer, substrate, or other component of an electrical package using a complaint...
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8096464 |
Solder-bearing articles and method of retaining a solder mass along a side edge thereof
A method and device for depositing a solder mass within a plated opening that is formed in a side edge of an electronic device includes the steps of carrying the solder mass in a carrier device and...
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8061578 |
Solder preform
A solder preform has gaps extending from the boundary of preform towards the preform center. During reflow soldering, the gaps close from the center towards the boundary. This allows flux and...
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8020745 |
Solder ball
An object of the present invention is to improve a yield of electronic devices in a ball mounting process by preventing a micro-bonding and change in color of the solder balls, and to improve a...
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7946467 |
Braze material and processes for making and using
A braze material and processes for making and using the material, such as for use in the manufacturing, coating, repair, and build-up of superalloy components. The braze material is composed of...
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7879460 |
Welding wire and vehicle component manufactured using the same
Disclosed is a welding wire for joining cast iron and stainless steel, having a composition of 0.03 wt % or less of C, 2.0˜3.0 wt % of Si, 12.0˜14.0 wt % of Mn, 7.0˜9.0 wt % of Cr, 45.0˜47.0 wt % o...
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7857189 |
Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistance
There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin...
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7793820 |
Solder preform and a process for its manufacture
A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder...
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7784669 |
Method and process for reducing undercooling in a lead-free tin-rich solder alloy
Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduce...
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7780058 |
Braided solder
Improved solder and soldering methods are disclosed. In accordance with one technique, a solder having a plurality of individual wire strands braided together is used. In accordance with another...
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7775414 |
Consumable insert and method of using the same
A consumable insert (10) formed of material particles (14) contained within a sheath (12). The particles may be a melting point depressant that has a concentration that is greater in a center...
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7754343 |
Ternary alloy column grid array
Techniques and structures have been developed for providing lead-free column grid array interconnect structures. An exemplary interconnect has a body, a first joint, and a second joint, all having...
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7750475 |
Lead-free solder ball
A Sn—Ag—Cu based lead-free solder ball which does not undergo yellowing of its surface when formed into a solder bump on an electrode of an electronic part such as a BGA package. The solder bal...
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7745013 |
Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same
A foamed solder or a nano-porous solder is formed on a substrate of an integrated circuit package. The foamed solder exhibits a low modulus that resists cracking during shock and dynamic loading....
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7735718 |
Layered products for fluxless brazing of substrates
A brazing product for fluxless brazing comprises a substrate and a filler metal-forming composition applied to the substrate. The substrate preferably comprises aluminum, an aluminum alloy or...
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7703661 |
Method and process for reducing undercooling in a lead-free tin-rich solder alloy
Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with...
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7691282 |
Hydrofluoroether compounds and processes for their preparation and use
Disclosed is a hydrofluoroether compound comprising two terminal fluoroalkyl groups and an intervening substituted or unsubstituted oxymethylene group, each of the fluoroalkyl groups comprising...
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7690551 |
Die attach by temperature gradient lead free soft solder metal sheet or film
A die attach process employs a temperature gradient lead free soft solder metal sheet or thin film as the die attach material. The sheet or thin film is formed to a uniform thickness and has a heat...
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7681777 |
Solder paste and printed circuit board
In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a S...
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7654438 |
Copper-based brazing alloy and brazing process
The invention proposes a brazing alloy, which can be produced in particular as a homogenous, ductile, amorphous brazing foil and consists of 2 to 20 atom % of nickel, 2 to 12 atom % of tin, 0.5 to...
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7611778 |
Simultaneous multi-alloy casting
A method of casting a multi-layered metal ingot including the steps of delivering a metallic divider member into a direct chill mold, pouring a first molten metal into the mold on one side of the...
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7597233 |
Apparatus and method of mounting conductive ball
There is provided a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of connection pads formed on a substrate. The conductive ball mounting apparatus...
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7569164 |
Solder precoating method
A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within...
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7533793 |
Solder preforms for use in electronic assembly
A solder preform for use to attach an electronic component to a substrate. The preform is for placement by a pick-and-place machine using a vacuum nozzle which picks the preform from a preform...
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7527187 |
Titanium braze foil
The present invention provides a braze foil comprising titanium and zirconium layers covered by one or more layers of copper, nickel or an alloy of copper and nickel such that neither the zirconium...
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7523852 |
Solder interconnect structure and method using injection molded solder
Improved interconnects are produced by injection molded solder which fills mold arrays with molten solder so that columns that have much greater height to width aspect ratios greater than one are...
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7524698 |
Handling and positioning of metallic plated balls for socket application in ball grid array packages
A method and apparatus for handling and positioning half plated balls for socket application in ball grid array packages. The half plated balls, comprising a first side adapted to be soldered and a...
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7486480 |
Head gimbal assembly method with solder fillet formed by laser irradiating a shaped solder mass
Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider...
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7461772 |
Silver/aluminum/copper/titanium/nickel brazing alloys for brazing WC-Co to titanium alloys
A brazing material including about 20 to about 60 percent by weight silver, about 1 to about 4 percent by weight aluminum, about 20 to about 65 percent by weight copper, about 3 to about 18 percent...
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7451906 |
Products for use in low temperature fluxless brazing
A brazing product for low temperature fluxless brazing comprises a filler metal-forming composition which melts in the range from about 380-575° C. The filler metal-forming composition comprises ...
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7422721 |
Lead-free solder and soldered article
A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight...
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7422141 |
Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale
In one embodiment, a solder preform includes a solder matrix having microparticles secured with the solder matrix. The microparticles are constructed so as to be capable of arranging during a...
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7410088 |
Solder preform for low heat stress laser solder attachment
A solder preform for attaching an optical fiber having a diameter to a fiber attach pad, the solder preform comprising a body including solder at least on a bottom surface thereof, the body having...
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7387230 |
Brazing filter metal sheet and method for production thereof
In order to provide a brazing sheet having excellent workability, a powder of a brazing filler metal composition is obtained from a single type of powder or by mixing two or more powders to form...
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7357291 |
Solder metal, soldering flux and solder paste
Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities.
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7331498 |
Method for refining and homogeneously distributing alloying partners and for removing undesirable reaction products and slags in or from soft solder during the production of fine solder powder
Method for refining and homogeneously distributing alloying partners and for removing undesired reaction products such as oxides and/or slag in or from soft solder during the production of fine...
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7318547 |
Method for assembling parts made of materials based on SiC by non-reactive refractory brazing, brazing composition, and joint and assembly obtained by said method
Method for assembling at least two pieces of silicon carbide based materials by non reactive refractory brazing, wherein these pieces are put into contact with a non reactive brazing solder...
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7293688 |
Gold/nickel/copper/aluminum/silver brazing alloys for brazing WC-Co to titanium alloys
A brazing material including about 2 to about 30 percent by weight gold, about 4 to about 14 percent by weight nickel, about 25 to about 65 percent by weight copper, about 1 to about 3 percent by...
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7222776 |
Printed wiring board and manufacturing method therefor
A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by...
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7224067 |
Intermetallic solder with low melting point
Embodiments of the invention provide a low-melting temperature comprised primarily of a bulk intermetallic phase material. This solder may allow reflow with less of a chance to damage...
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7219825 |
SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same
Provided are a solder bump, a method of manufacturing the same, and a method of bonding a light emitting device using the method of manufacturing the solder bump. In particular, the solder bump is...
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7220493 |
Lead-free solder, and a lead-free joint
A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of...
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7189083 |
Method of retaining a solder mass on an article
A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of...
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7160504 |
Alloy type thermal fuse and fuse element thereof
The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type. The fuse element has an alloy composition in which a total of 0.01 to 7 weight parts of at least one...
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7157150 |
Brazing titanium to stainless steel using layered particulate
A method of bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a compact titanium-nickel filler material...
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7156280 |
Braze alloy compositions
A nickel-based high-temperature braze alloy composition includes Cr, Hf, and B. Furthermore, a cobalt-based high-temperature braze alloy composition includes Cr, Hf, and B. The braze alloys can be...
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7100815 |
Diebond strip
A titanium alloy strip has a reduced cross section in the central region of the strip. By concentrating heat in this central region the process of bonding laser devices to a substrate is greatly...
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7097090 |
Solder ball
A solder ball is formed from an Sn—Pb alloy which consists essentially of about 2–65 mass % of Sn, 0–5 mass % of Ag, about 0.1–1 mass % of Sb, and 0.01–0.1 mass % of Cu, and 0.01–0.1 mass % of B...
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7036710 |
Method and structures for implementing impedance-controlled coupled noise suppressor for differential interface solder column array
A method and structures are provided for implementing an impedance-controlled coupled noise suppressor for a differential interface solder column array used to join a substrate to a circuit card....
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7036709 |
Method and structure for implementing column attach coupled noise suppressor
A method and structure are provided for implementing a column attach coupled noise suppressor for a solder column structure of the type used to join a substrate to a circuit card. The electrical...
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