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Match Document Document Title
8796597 In-line package apparatuses and methods  
An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip...
8770463 Head gimbal assembly carrier with adjustable protective bar  
A head gimbal assembly (HGA) carrier comprises a body; an HGA mounting location on the body to mount an HGA mounting member to the body; and an adjustable protective bar coupled to the body, the...
8707550 Bonding machine incorporating dual-track transfer mechanism  
A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical...
8701966 Induction bonding  
The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for...
8651359 Flip chip bonder head for forming a uniform fillet  
A low thermal conductivity material layer covers a peripheral portion of the bottom surface of the conductive plate of a chip bonder head. The center portion of the conductive plate is exposed or...
8651354 Ultrasonic bonding systems including workholder and ribbon feeding system  
An ultrasonic ribbon bonding system is provided. The ultrasonic ribbon bonding system includes a workholder for supporting a workpiece during a ribbon bonding operation. The workholder defines a...
8622278 Socket cover with heat flow for surface mount solder reflow  
A cover for a socket that is to be soldered to a printed circuit board is described. The socket has connections to be soldered to the printed circuit board and connections to contact a die that...
8622276 Assembly jig for a semiconductor device and assembly method for a semiconductor device  
In aspects of the assembly jig and method of the invention, when a packaging substrate is curved concaving upward at temperatures of melting solder, the gap between the assembly jig and the...
8561878 Linear cell stringing  
Techniques for linear cell stringing are disclosed. In some embodiments, a plurality of sets of solar cells are linearly positioned, a plurality of tabbing ribbon segments are placed in contact...
8556155 Solder ball mounting tool  
A solder paste mounting tool is provided, and includes a base, a positioning plate, a screen plate, and a pushing element. The base includes a first surface, a second surface, a through hole...
8556154 Clamping tool and equipment for rework process  
A clamping tool for rework process includes a casing, two clamping members and a thermal expansion member. The casing has a base. The two clamping members are pivotally connected to the casing and...
8517245 Automatic soldering machine  
An automatic soldering machine adapted for soldering cables with electronic products includes a main frame module, a man-machine control interface, a sliding tray located in front of the...
8317077 Thermal compressive bonding with separate die-attach and reflow processes  
A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The...
8297487 Quick-loading soldering apparatus  
A quick-loading soldering apparatus for soldering PCBs comprises a rotatable deck which has a plurality of angularly spaced PCB work sites. While a first PCB work site is angularly positioned for...
8274161 Flux-free chip to substrate joint serial linear thermal processor arrangement  
A linear, serial chip/substrate assembly processing machine for stepwise advancing a pre-assembled chip/die substrate on a support plate through a series of sealable chambers beginning at a...
8252678 Flux-free chip to wafer joint serial thermal processor arrangement  
A serial thermal processing arrangement for treating a pre-assembled chip/wafer assembly of semiconductor material in a rotary processor, through a series of intermittent, rotatively advanced,...
8240539 Joining apparatus with UV cleaning  
The joining apparatus includes a suction nozzle for holding an electronic component, a board stage for holding a circuit board in opposition to the electronic component, and an excimer ultraviolet...
8240541 Apparatus for mounting semiconductor chip  
Provided are an apparatus and a method for mounting a semiconductor chip. The semiconductor chip mounting apparatus includes a flux reservoir, a flux reservoir moving unit, a wafer support part, a...
8231044 Solar substrate ribbon bonding system  
An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The...
8220691 Bonding apparatus  
There is provided a bonding apparatus for holding a semiconductor chip by using a bonding head and bonding the semiconductor chip onto a substrate. The bonding head includes: a holding part for...
8210417 Bonding apparatus  
A bonding apparatus for bonding substrates having metal bonding portions, includes: a processing container having an opening formed on the bottom of the processing container; a thermal treating...
8209858 Method for mounting electronic components on a support  
An arrangement for mounting a multiplicity of components (9, 10), particularly with irregular surface topography, on a support (7) using an assembly tool which has a tool substructure (5) and a...
8196798 Solar substrate ribbon bonding system  
An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously...
8186563 Automatic soldering device and carrier device  
To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion. Conveying hooks 10 that hold the printed circuit board W1 therebetween,...
8186041 Soldering fixture  
A soldering fixture is disclosed having a unitary base member configured to maintain a printed circuit board and an electrical connector in a particular orientation during soldering. The unitary...
8181842 Device for assembly by brazing an end cap onto a cylindrical body and vacuum cartridge comprising one such device  
The present invention relates to a device for assembly by brazing an end cover onto a cylindrical body, said end cover presenting a circular peripheral rim via which said cover is brazed onto a...
8151448 Component placement apparatus, component feeding apparatus and method  
A component placement apparatus includes: a tray storing device having slots for storing trays, a tray transporting device for transporting a tray from the tray storing device to a pickup area, a...
8091760 Device for fixing conductor tracks on a solar cell  
The invention concerns to a device for fixing conductor tracks on at least one first main-surface of at least one solar cell.
8066172 Quick-loading soldering apparatus  
A quick-loading soldering apparatus for soldering PCBs comprises a rotatable deck which has a plurality of angularly spaced PCB work sites. While a first PCB work site is angularly positioned for...
8047418 Soldering apparatus and method  
A soldering apparatus including a vessel containing a molten solder, a casing defining therewithin a soldering chamber in which a flat overflowing wave of the molten solder is formed, a conveyor...
8020744 Methods for connecting a wire to a metalized circuit path on a plastic part  
A method and apparatus for connecting wires to circuits, including the formation of at least one electrically conductive path having a plastic base with a metal foil formed of laser direct processes.
7980444 Electronic component mounting head, and apparatus and method for mounting electronic component  
An electronic component mounting apparatus includes an electronic component mounting head for holding an electronic component and an up/down device for pressing the electronic component against a...
7975898 Joining method and reflow apparatus  
A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot...
7942305 Soldering apparatus  
A soldering apparatus includes a base body, an actuator connected to the base body, and a pair of soldering arms connected to the actuator, each of the pair of soldering arms including a heating...
7921552 Method of manufacturing a small form factor PCBA  
A process carrier is capable of supporting printed circuit boards during manufacturing and testing. The process carrier includes a base plate, a first top plate and a second top plate. The base...
7882997 Method and device for mutual contacting of two wafers  
A method and a device for the mutual contacting of two wafer-type component composite configurations made of multiple identical components which are implemented coherently, in particular a...
7870991 Electronic component mounting system and electronic component mounting method  
In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of...
7845539 Bump printing apparatus  
There is provided a bump printing apparatus that can improve the printability of solder bumps printed on a board. The bump printing apparatus may include a printing table onto which a board is...
7837083 Forming solder balls on substrates  
A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask....
7819301 Bumping electronic components using transfer substrates  
A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic...
7789284 Electronic component mounting apparatus and electronic component mounting method  
There is provided an electronic component mounting apparatus including: a component holder which holds an electronic component; a pressing unit which applies pressure to the held electronic...
7752742 Infrared camera packaging  
Systems and methods for providing a sealed container having a reduced pressure atmosphere are disclosed. The container is suitable for housing an infrared detector array. Outgassing can be...
7677431 Electronic device handler for a bonding apparatus  
A large electronic device having a bonding area on one side that comprises first and second portions may be bonded by first locating the first portion but not the second portion of the electronic...
7654432 Forming solder balls on substrates  
A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask....
7648056 Selective soldering bath  
A solder machine uses various linear actuators to move a PWB carrier in three degrees of freedom relative to a solder bath, to facilitate safe loading and unloading of PWBs onto the carrier while...
7596864 Stacked module connector  
A method for soldering a soft wire to a printed circuit board conveniently includes the following step: providing a bracket having a through hole and an enameled wire; fastening the enameled wire...
7578423 Assembly for reducing oxidation of semiconductor devices  
An assembly for reducing oxidation of a semiconductor device comprises a holding device for securing the semiconductor device to a platform. The holding device includes at least one opening for...
7575147 Compliant wirebond pedestal  
A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical...
7516878 Bump formation method and bump forming apparatus for semiconductor wafer  
A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with...
7407085 Apparatus and method for attaching a semiconductor die to a heat spreader  
Embodiments of an apparatus and method for attaching a semiconductor die to a heat spreader (or other thermal component) are disclosed. The apparatus includes a substantially flat surface to...

Matches 1 - 50 out of 223 1 2 3 4 5 >