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8011563 |
Compliant mold fill head with integrated cavity venting and solder cooling
A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant...
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7878386 |
Method and device for heat treatment, especially connection by soldering
The present invention relates to a method and device (10) for the temperature treatment of workpieces (19) or components, in particular for producing a solder connection between a solder material...
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7766211 |
Temperature control of a bonding stage
A bonding apparatus is provided comprising a bonding stage for holding a bonding tool, an air distribution system mounted to the bonding stage and an air inlet attached to the air distribution...
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7708183 |
Reflow solder oven with cooling diffuser
A diffuser plate for a reflow oven includes an upper surface and a plurality of nozzle openings therein. Each of the plurality of nozzle openings has a raised surrounding portion for restricting...
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7581961 |
Method for preventing solder rise to electric contact and electric contact produced by the same
Method for preventing solder from rising to a portion of an electric contact when the electric contact is being soldered to a copper foil so as to extend therefrom. The portion is plated with a...
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7392925 |
Handheld fluid cooled electric solder tweezers
A handheld fluid cooled electric solder tweezers. A pair of soldering heads extend from a pair of tweezer members, respectively, and are operatively connected to a cooling apparatus. The cooling...
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7156279 |
System and method for mounting electronic components onto flexible substrates
A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12)...
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7150387 |
Process and apparatus for flow soldering
An apparatus for mounting an electric component onto a board by means of a lead-free solder material. The apparatus of the present invention has a solder material supplying chamber in which a melt...
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7014092 |
Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate
The present invention provides a bump forming apparatus which can prevent charge appearance semiconductor substrates from pyroelectric breakdown and physical failures, a method carried out by the...
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6910614 |
Vacuum compression brazing furnace and method of using same
A vacuum heat treating furnace for brazing a large metallic part is disclosed. The vacuum furnace includes a pressure vessel having a cylindrical wall and a door dimensioned and positioned for...
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6827253 |
Method and means for rapid heat-sink soldering
A method and system for rapid heat-sink soldering, having a workpiece gripper, an intense heat source, and an optional air-jet cooling system, is provided for soldering workpieces to substrates of...
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6827249 |
Fluxless tube seal
A solder machine that can automatically solder a fiber optic cable to a package. The solder machine includes a fixture for supporting the cable and the package. The machine has a gas heater that...
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6796483 |
Method and device for producing a soldered joint
A method and device is provided for thermal treatment of workpieces or components, in particular for producing a soldered joint between a solder material and at least one component or workpiece...
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6772935 |
Method and device for friction stir welding with simultaneous cooling
A method for friction stir welding using liquid cooling. The method includes the steps of moving a pin tool across a welding location, spraying a cooling liquid in a localized manner from a cooling...
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6702173 |
Reflow apparatus in continuous printing and mounting apparatus for film-like printing body
When a movement of a film-like printing body is stopped for a longer time than the normal time because of generation of trouble or the like, heat of hot plates for full heating is prevented from...
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6691910 |
Method of joining different metal materials by friction welding
A rod material made of Ti alloy has a larger diameter portion at the end, which is joined with the end of material made of Ti—Al intermetallic compound, by friction welding, to form a poppet v...
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6642485 |
System and method for mounting electronic components onto flexible substrates
A system and method for reflowing solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality...
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6443355 |
Soldering method and apparatus
A soldering method and apparatus in which there is provided a tight contact cover tightly contacting a portion (unused portion) of a re-flow panel other than its portion facing a substrate to be...
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6402011 |
Reflow method and reflow device
For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot...
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6386422 |
Solder reflow oven
A solder reflow oven for the processing of ball grid array substrates bearing solder balls is described, comprising: input means for introducing substrates into the oven, a processing chamber...
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6347732 |
Circuit board component retention
A method and implementing system is provided in which a gas, such as oxygen, is injected on to area of a circuit board to which an electronic component is being mounted. The injected gas causes a...
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6347734 |
Methods and apparatus for installing a module on a circuit board using heating and cooling techniques
The invention is directed to techniques for installing a module on a circuit board by simultaneously heating a perimeter portion of the module, and bringing an inner portion of the module to...
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6345756 |
Defectively joined portion removal apparatus for use in a continuous hot rolling process
The invention comprises a continuous hot rolling method in which a rear end portion of a preceding metal block and a fore end portion of a succeeding metal block are cut and the metal blocks are...
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6318622 |
High power hybrid modules assembly using vacuum oven for permanent electrical connections
The apparatus for assembly of high power hybrid modules including high power semiconductor chips and conventional surface mount technology (SMT) components are disclosed. The vacuum oven is used...
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6230962 |
Process for cooling soldered objects
A process for cooling soldered objects, according to which a liquid is applied onto the soldered object and is evaporated in an accelerated manner. According to a preferred embodiment the soldered...
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6164516 |
Soldering apparatus and method
An automatic soldering apparatus includes a conveyor for conveying a printed circuit board along a predetermined path, a heater located below the conveyor and adapted to heat the lower surface of...
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6123247 |
Electronic unit soldering apparatus
An electronic unit soldering apparatus includes: a pallet on which an electronic unit to be reflow-soldered is placed; a transporting unit for transporting the pallet having the electronic unit;...
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6059170 |
Method and apparatus for insulating moisture sensitive PBGA's
Method and apparatus removing a component having a solder ball grid array to a circuitized substrate. The solder balls have a first temperature at which they melt. The component has a second...
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6045032 |
Method of preventing solder reflow of electrical components during wave soldering
A method of preventing solder reflow of a SMT component (14) attached with solder (22) to a circuit board (10) that subsequently undergoes a wave soldering operation. The method generally entails...
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6039236 |
Reflow soldering apparatus with improved cooling
A reflow soldering apparatus includes a plurality of heating compartments connected in series for heating objects for soldering; transporting means for successively carrying the objects through the...
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5942289 |
Hardfacing a surface utilizing a method and apparatus having a chill block
A hardfacing apparatus includes a deposition head including a heat source, a hardfacing material source, and a chill block having a chill block surface. The deposition head is positioned at a...
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5927588 |
Constant-heat type heating device and soldering method and soldering apparatus with heating device
A soldering apparatus has a base composed of a base plate and a column fixed on the base plate, a heating device vertically movably mounted on the column, an operational lever for moving the...
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5860583 |
Evaporative cooling vessel for controlling the temperature of a portion of an electronic part during solder reflow
An evaporative cooling vessel (100) for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The evaporative cooling vessel (100) includes...
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5842627 |
Soldering apparatus and a method thereof
A printed board, to which cream solders are applied on lands at the position where leads of electronic parts are to be soldered and the leads of the electronic parts are provided to the lands, is...
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5813595 |
Method for wave-soldering printed circuit boards
A method is provided for wave-soldering printed circuit boards. In order to obtain wave-soldered printed circuit boards with smallest possible number of solder globules, after the passage on the...
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5785233 |
Apparatus and method for solder reflow bottom cooling
An apparatus and method for cooling one side of a double sided product as the product is being reflow soldered is presented. A cooling assembly directs cold gas to a first side of the product which...
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5685475 |
Apparatus for cooling printed circuit boards in wave soldering
An apparatus and method for soldering components to a circuit board. The apparatus includes a conveyor in a tunnel for transporting the board through a preheat zone, molten waves of solder...
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5647529 |
Method of controlling the temperature of a portion of an electronic part during solder reflow
A method for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The method includes the steps of applying (107) an absorbent material...
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5641341 |
Method for minimizing the clogging of a cooling zone heat exchanger in a reflow solder apparatus
A method for minimizing the clogging of a cooling zone heat exchanger of a reflow solder apparatus that includes the steps of: removing a gas/flux mixture from an exhaust zone (20) that is located...
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5639012 |
Process and device for the posttreatment of welded compound panels
In a compound panel welding line, the compound panels discharged from a welding machine are cooled by means of a cooling unit. In the cooling unit, the welded seam is treated with a cooling fluid,...
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5622304 |
Tape bonding apparatus
A cooling system for cooling the upper and lower clampers of a wire bonding apparatus which hold a tab tape in between including a fluid passage formed inside the upper clamper so that air or water...
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5577658 |
Gas knife cooling system
A gas knife cooling system for reflow soldering cools soldered articles by impinging a gas flow directly on the articles and as a result uses less cooling gas. A heater is associated with the...
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5472134 |
Weld joint container
A joint container for forming a weld joint utilizing multiple adjacent metal plates which are spaced apart and positioned angularly to each other. One of the plates forming the joint may extend...
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5462626 |
Method of bonding an external lead and a tool therefor
A bonding method of for external leads which includes the steps of registering the external leads of an IC component with electrodes of a circuit substrate, setting an external lead retaining...
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5449107 |
Weld backing
A reusable weld backing capable of withstanding long use, which is held against the underside of a workpiece to provide weld-metal support in full penetration welding, the weld backing comprising a...
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5441196 |
Welding method
A method of welding two plates together along a substantially vertical weld line between the two plates involves the use of a weld pool support device having internally formed channels through...
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5441194 |
Thermo-compression assembly/disassembly system for electric circuit board in inert ambience
A thermo-compression tool incorproated in an assembly/disassembly system melts solder films of conductive leads of an electric circuit componet for bonding the conductive leads to pads of a circuit...
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5433368 |
Soldering system
A processing system includes at least one processing chamber, a conveyor disposed through the chamber and a drive unit coupled to the conveyor and intermittently activated by a drive controller for...
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5375758 |
Welding method of and apparatus for reconditioning hard metal products
This disclosure is directed to a method of and apparatus for applying a weld bead upon a surface of a chilled white iron product by (a) moving a surface of the product along a predetermined path of...
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5375757 |
Fixture for supporting a cable conductor during a soldering operation
A cable soldering fixture which supports a cable conductor during soldering. A heat sink is supported at one end of a support frame for maintaining a cable being soldered parallel to the axis of a...
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