|
Match
|
Document |
Document Title |
|
|
8181842 |
Device for assembly by brazing an end cap onto a cylindrical body and vacuum cartridge comprising one such device
The present invention relates to a device for assembly by brazing an end cover onto a cylindrical body, said end cover presenting a circular peripheral rim via which said cover is brazed onto a...
|
|
|
8096463 |
Wiring method and device
To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, the following steps are carried out: a. providing a frame including at least one tensioned...
|
|
|
8091760 |
Device for fixing conductor tracks on a solar cell
The invention concerns to a device for fixing conductor tracks on at least one first main-surface of at least one solar cell.
|
|
|
8020744 |
Methods for connecting a wire to a metalized circuit path on a plastic part
A method and apparatus for connecting wires to circuits, including the formation of at least one electrically conductive path having a plastic base with a metal foil formed of laser direct processes.
|
|
|
8011557 |
Automatic soldering machine
An automatic soldering machine for soldering wires, each exposing at least one core wire and electronic components with at least one soldering portion respectively is disclosed. The automatic...
|
|
|
7995324 |
Electrostatic attraction apparatus for glass substrate and method of attracting and releasing the same
An object is providing an electrostatic attraction apparatus and an attracting/releasing method capable of reliably attracting and quickly releasing a glass substrate. An attraction force for...
|
|
|
7980445 |
Fill head for full-field solder coverage with a rotatable member
A system, apparatus, and method, are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The...
|
|
|
7975899 |
Work clamp and wire bonding apparatus
A work clamp and a wire bonding apparatus that can sufficiently restrain oxidation of a bonding area even while reducing an amount of antioxidant gas that is used are provided. The work clamp...
|
|
|
7942305 |
Soldering apparatus
A soldering apparatus includes a base body, an actuator connected to the base body, and a pair of soldering arms connected to the actuator, each of the pair of soldering arms including a heating...
|
|
|
7882997 |
Method and device for mutual contacting of two wafers
A method and a device for the mutual contacting of two wafer-type component composite configurations made of multiple identical components which are implemented coherently, in particular a...
|
|
|
7845074 |
Method for manufacturing electronic parts module
The method for manufacturing an electronic parts module includes an adhesive layer forming process forming an adhesive layer including solder particles on the circuit forming surface in range...
|
|
|
7845539 |
Bump printing apparatus
There is provided a bump printing apparatus that can improve the printability of solder bumps printed on a board. The bump printing apparatus may include a printing table onto which a board is...
|
|
|
7841081 |
Method for manufacturing electronic parts module
The manufacturing method for an electronic parts module includes forming an adhesive layer including solder particles on the circuit forming surface in range covering at least the first and the...
|
|
|
7841505 |
Wire clamp and wire bonding apparatus having the same
A wire clamp includes a pair of clamp arms at a predetermined distance from each other to define an interval therebetween for a bonding wire, a clamp body coupled to the clamp arms, the clamp body...
|
|
|
7837083 |
Forming solder balls on substrates
A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask....
|
|
|
7757390 |
Method for production of a semiconductor component
A bonding head includes a pressure plate to press a component (e.g., a semiconductor chip) onto a substrate. The pressure plate includes a holding surface configured to hold the component and to...
|
|
|
7752742 |
Infrared camera packaging
Systems and methods for providing a sealed container having a reduced pressure atmosphere are disclosed. The container is suitable for housing an infrared detector array. Outgassing can be enhanced...
|
|
|
7654432 |
Forming solder balls on substrates
A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask....
|
|
|
7614538 |
Device clamp for reducing oxidation in wire bonding
A device clamp configured for use with a wire bonding machine is provided. The device clamp includes a body portion defining at least one device aperture. Each of the at least one device apertures...
|
|
|
7603769 |
Method of coupling a surface mount device
Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate...
|
|
|
7600665 |
Method for welding conductors
The invention concerns a method for welding electric conductors using ultrasound, whereby the conductors (32) are introduced into a compression chamber (30) that is bounded by at least two boundary...
|
|
|
7578425 |
Wirebonding method and apparatus
A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the...
|
|
|
7578423 |
Assembly for reducing oxidation of semiconductor devices
An assembly for reducing oxidation of a semiconductor device comprises a holding device for securing the semiconductor device to a platform. The holding device includes at least one opening for...
|
|
|
7546943 |
Apparatus, system, and method for positioning a printed circuit board component
An apparatus, system, and method are disclosed for positioning a printed circuit board component. A clamping member applies a clamping force to a levering member linked to a positioning member. The...
|
|
|
7344059 |
Apparatus and method for mounting an electrical connector to a glass sheet of a vehicle window
An electrical connector is soldered or affixed to a conductive element of a glass sheet of a vehicular window via radiation heating of a layer of solder with an infrared radiative heating device....
|
|
|
7246735 |
Wire clamping plate
A wire clamping plate is provided for a wire clamp that is adapted to contact a length of metallic wire when the wire clamp is applying a clamping force on the wire. The wire clamping plate...
|
|
|
7240820 |
Clamping device for processing electronic devices
A clamping device is provided for holding an electronic device, such as a semiconductor carrier in the form of a leadframe, during processing thereof. It includes a main body for covering the...
|
|
|
7134589 |
Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate
A Wire Bonder has a downholder for pressing the fingers of a system carrier onto a heating plate. The downholder can be raised and lowered. A downholder in accordance with the invention contains...
|
|
|
7131568 |
Methods for lead penetrating clamping system
An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use...
|
|
|
7040525 |
Stage structure in bonding machine and method for controlling the same
Stage structure in a bonding machine including a plate movably fitted in a bonding chamber, a plurality of blocks of electro-static chucks fitted to the plate for providing an electro-static force...
|
|
|
7015066 |
Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly
A method of making a microelectronic assembly buying restraining a substrate in a fixture at room temperature, placing a flip chip on the substrate so that conductive bumps on the flip chip are...
|
|
|
6942137 |
Die removal method and apparatus
A method and apparatus for separating a semiconductor device from a substrate in a fixture with a shearing element, wherein the semiconductor device is attached to the substrate by solder...
|
|
|
6921017 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp...
|
|
|
6918528 |
Transducer tool holder
A transducer horn for holding a tool, such as a capillary, for a wire bonder has a pair of resilient arms which flex to clamp about a tool placed in a passage between the arms. The arms have free...
|
|
|
6899262 |
Clamping device
A clamping device is provided for clamping an object, such as bonding wire for a wire bonding machine. The device comprises a pair of clamping arms arranged in pivotal relationship with each other...
|
|
|
6886734 |
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding...
|
|
|
6845898 |
Bondhead lead clamp apparatus
An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of...
|
|
|
6840424 |
Compression bonding tools and associated bonding methods
Compression bonding tools having a CVD-formed pressing member with a non-reactive working surface are disclosed and described. Generally speaking, the pressing member is coupled to a tool body,...
|
|
|
6837418 |
Bondhead lead clamp apparatus and method
A method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The method includes the use of an individual independent...
|
|
|
6827253 |
Method and means for rapid heat-sink soldering
A method and system for rapid heat-sink soldering, having a workpiece gripper, an intense heat source, and an optional air-jet cooling system, is provided for soldering workpieces to substrates of...
|
|
|
6820793 |
Apparatus for the transport and equipping of substrates with semiconductor chips
An apparatus for the transport and equipping of substrates with semiconductor chips comprises a channel with two side walls in which the substrates are transported in a transport direction. The...
|
|
|
6821381 |
Tool for thermo-compression-bonding chips, and chip packaging device having the same
A ceramic holder 2 is mounted on the lower end of a connecting block 30 of metal mounted on the lower end of a tool main body 1 of metal, such ceramic holder 2, a ceramic heater 4 and a ceramic...
|
|
|
6814277 |
Lead frame substrate clamp and method
A method of securing articles to each other and an alignment and holding apparatus comprising a platform having an alignment member for positioning and holding a first article, such as a substrate,...
|
|
|
6799714 |
Circuit board pallet with component arm
A circuit board pallet with an improved securement pin and component positioning arms is disclosed. The improved pin of the present invention is cylindrical pin with an enlarged head. A countersunk...
|
|
|
6783052 |
Clamp actuation mechanism
The invention provides an apparatus and method for clamping an object. The apparatus comprises a clamping mechanism and an actuation system to actuate clamping and de-clamping of the clamping...
|
|
|
6769469 |
Process for mounting semiconductor device and mounting apparatus
A process for mounting a semiconductor device and a mounting apparatus whereby electrodes of a fine-pitch semiconductor device and a wiring board can be surely connected to each other. A process...
|
|
|
6732902 |
Lead penetrating clamping system
An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use...
|
|
|
6648045 |
Chip bonding apparatus
The present invention relates to a chip bonding apparatus for bonding a chip to a substrate, with a support structure for preventing a deviation or error in parallelism of a head 1 holding the...
|
|
|
6648204 |
Alignment weight for floating pin field design
An alignment weight is provided. The alignment weight includes a body of material having first and second opposing surfaces. A number of depressions are formed in the first surface. The depressions...
|
|
|
6641027 |
Method of connecting electric leads to battery tabs
A method of connecting a generally flat battery lead to at least one flat current collector of a polymer battery, comprising the steps of: bending a generally planar lead about at least one...
|