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Document Title |
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8104662 |
Inert environment enclosure
A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet...
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8096461 |
Wire-bonding machine with cover-gas supply device
A wire-bonding machine includes a main body, a fixture block, a mounting block, a gas supply tube, a cover-gas supply device, a capillary tool and an electrode. The fixture block is provided with a...
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8070049 |
Device and method for wave soldering
The instant invention relates to a device for wave soldering workpieces, encompassing means for moving the workpiece, which is to be soldered, along a specific path across at least one solder wave...
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7992760 |
Conduit purging device and method
A device for purging gas comprises a conduit assembly defining an interior volume. The conduit assembly comprises a first conduit portion having an open first end and an open second end and a...
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7988031 |
Reflow furnace and heater for blowing hot air
A reflow furnace using a conventional heater for blowing hot air has difficulty in reducing Δt and in stabilizing the oxygen concentration at a low level. In addition, it is difficult to uniformly ...
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7975899 |
Work clamp and wire bonding apparatus
A work clamp and a wire bonding apparatus that can sufficiently restrain oxidation of a bonding area even while reducing an amount of antioxidant gas that is used are provided. The work clamp...
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7938308 |
Wire bonder for improved bondability of a conductive wire and method therefor
A wire bonder has a capillary through which a wire passes. A discharge tip is positioned near a bottom section of the capillary and provides a flame to a distal end of the wire. A gas diffuser is...
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7878386 |
Method and device for heat treatment, especially connection by soldering
The present invention relates to a method and device (10) for the temperature treatment of workpieces (19) or components, in particular for producing a solder connection between a solder material...
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7748600 |
Process and device for soldering in the vapor phase
The invention provides a process for soldering in the vapor phase in which after the solder has melted onto the item to be soldered a vacuum is generated around the item to be soldered in the vapor...
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7735708 |
Reflow furnace
In a second horizontal plate (18a) bottoming an atmosphere recovery box (18), there are formed circular holes (21) between blowout pipes (20) adjacent to each other. Each of partition walls (2)...
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7708183 |
Reflow solder oven with cooling diffuser
A diffuser plate for a reflow oven includes an upper surface and a plurality of nozzle openings therein. Each of the plurality of nozzle openings has a raised surrounding portion for restricting...
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7690550 |
Reflow soldering apparatus
In a reflow soldering apparatus comprising a conveyor 4 to transport circuit boards 5 mounted with electronic components into multiple chambers 1, 2 and 3, and fans 6 installed in the chambers 1, 2...
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7690549 |
Purge line for welding backup
A purge arrangement for welding backup of a seam between two surfaces selected for welding together along respective runs which define the seam includes a ventilated tubeform and an adhesive tape...
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7673786 |
Welding shield for coupling heaters
Systems for coupling end portions of two elongated heater portions and methods of using such systems to treat a subsurface formation are described herein. A system may include a holding system...
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7628307 |
Apparatus for delivering shielding gas during wire bonding
An apparatus is provided for supplying a shielding gas during the bonding of wires to electronic components with a bonding tool comprising a horn and a capillary. The apparatus comprises a main...
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7614538 |
Device clamp for reducing oxidation in wire bonding
A device clamp configured for use with a wire bonding machine is provided. The device clamp includes a body portion defining at least one device aperture. Each of the at least one device apertures...
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7578423 |
Assembly for reducing oxidation of semiconductor devices
An assembly for reducing oxidation of a semiconductor device comprises a holding device for securing the semiconductor device to a platform. The holding device includes at least one opening for...
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7578900 |
Bonding device for manufacturing liquid crystal display device
A bonding device for manufacturing a liquid crystal display device includes a bonding chamber for bonding first and second substrates and an ionizing device for introducing ionized gas or air into...
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7520538 |
Orbital tube welding purge adaptor
A purge gas introduction system for an orbital tube welding setup is provided, configured to inject high purity inert purge gas to the interior volume of a tube or tubular component. An o-ring is...
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7380699 |
Method and apparatus for vapour phase soldering
The present invention concerns a method and an apparatus for performing soldering of items that are applied a soldering agent, where the soldering apparatus includes at least one soldering zone,...
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7303109 |
Stud bumping apparatus
The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a...
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7182793 |
System for reducing oxidation of electronic devices
The invention provides a system for reducing oxidation of a semiconductor device when it is heated, for example during wire bonding. A holding device is provided for securing the semiconductor...
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7137544 |
Apparatus and method for performing welding at elevated temperature
A welding apparatus includes a workpiece housing having a window therethrough and having a welding access therethrough for a welder to an interior of the workpiece housing. The workpiece housing is...
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7131566 |
Packaging method using lead-free solder
This invention relates to a packaging method using lead-free solder, characterized by including a reflow-soldering step in which a surface mount device is soldered to a circuit board with a...
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7112358 |
Self-adhesive purge dam for retaining purge gas around a weld zone
A self-adhesive purge dam for retaining purge gas around a weld zone includes a base configured to substantially obstruct an air passage leading to the weld zone and an adhesive skirt extending...
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7014673 |
Filtering apparatus
A filtering apparatus for a reflow oven includes a contaminated-gas inlet for receiving contaminated gas from a reflow oven; a filtering device configured to filter the received contaminated gas; a...
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6991967 |
Apparatus and method for die attachment
The invention provides an apparatus for die attachment onto a substrate including non-metallic material, and metallic material that is adapted to receive a die having a eutectic coating. A heating...
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6866182 |
Apparatus and method to prevent oxidation of electronic devices
The invention provides an apparatus and a method for preventing oxidation of an electronic device, such as a semiconductor leadframe, when it is heated. The apparatus comprises an area in which...
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6827249 |
Fluxless tube seal
A solder machine that can automatically solder a fiber optic cable to a package. The solder machine includes a fixture for supporting the cable and the package. The machine has a gas heater that...
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6814273 |
Flatwire repair tool systems and methods
A system and method for reworking, repairing and upgrading flatwire is disclosed. A repair tool for reworking and/or repairing the flatwire is disclosed for creating subsequent electrical and...
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6796483 |
Method and device for producing a soldered joint
A method and device is provided for thermal treatment of workpieces or components, in particular for producing a soldered joint between a solder material and at least one component or workpiece...
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6794616 |
Solder reflow oven
A solder flow oven comprises a reflow zone for heating a workpiece using heated air to a temperature effective to reflow solder. The reflow zone comprises a nozzle having divergent vanes that...
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6761304 |
Heating head for soldering and de-soldering of SMD components
A heating head for soldering and de-soldering surface mount devices (SMD's) using hot inert gas or air is comprised of a handle in which there is placed a heater sub-assembly on which there is...
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6761301 |
Soldering machine
A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts...
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6749655 |
Filtration of flux contaminants
A two-stage filtration system is coupled with an oven, such as a solder reflow oven, to remove a vapor stream from the oven and to remove organic compounds that have volatilized from a solder flux...
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6739204 |
Velocity measuring apparatus to establish purge gas velocity prior to welding
Velocity/flow measuring of purge gas when welding pipe, is accomplished by providing a controllably fixed orifice at the distal end of the pipe being welded. The purge gas passes through a pressure...
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6715662 |
Waste energy recovery system for a controlled atmosphere system
A continuous controlled atmosphere brazing system includes a dry-off oven for driving off moisture from materials to be brazed, a pre-heat section for pre-heating the material and a brazing furnace...
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6705506 |
Inert atmosphere soldering apparatus
A printed circuit board soldering process where a number of pockets containing solder are filled to overflowing with solder and then raised to immerse the terminals to be soldered. The solder pot...
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6676006 |
Flux supply device in which liquid flux is supplied through liquid holding portion, and liquid flux supply method
A flux supply device comprises a liquid replenishing portion containing a liquid flux for replenishment, a liquid holding portion connected to the lower end of the liquid replenishing portion with...
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6634544 |
Method and arrangement for improving quality in fusion welding operations
Arrangement for improving quality in fusion welding operations where protective gas is supplied to the welding point via a hose line. The arrangement comprises means (5, 6), such as a bypass line...
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6607613 |
Solder ball with chemically and mechanically enhanced surface properties
A metal alloy solder ball comprising a first metal and a second metal, the first metal having a sputtering yield greater than the second metal. The solder ball comprises a bulk portion having a...
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6600137 |
Heating device and heating method
The quantity of supply heat of heated gas is controlled so that a supply heat quantity of the heated gas when no heat treatment of solder or the like is needed is made smaller than a supply heat...
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6536649 |
Method of preventing residue contamination of semiconductor devices during furnace processing
Residue contaminates semiconductor devices during processing in a furnace. Residue contamination is prevented by removing the residue before it builds up to a point where it can contaminate...
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6527164 |
Removing flux residue from reflow furnace using active gaseous solvent
A method of cleaning residue on surfaces in a reflow furnace includes introducing a solvent into the furnace chamber; reacting the solvent with the residue to form a product; and, removing the...
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6478215 |
Automatic wave soldering apparatus and method
A wave soldering apparatus includes a solder reservoir adapted to contain molten solder, and a solder nozzle disposed in the solder reservoir and extending up above the molten solder. The nozzle...
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6474530 |
Adaptor assembly for interchangeably mounting hot air solder reflow nozzles to soldering/desoldering apparatus
Handheld and stationary hot air solder reflow apparatus for repairing, reworking or producing electronic components and circuit boards of the type having a means for supplying a flow of hot air to...
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6464122 |
Soldering method and soldering apparatus
Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of...
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6446855 |
Compact reflow and cleaning apparatus
A compact reflow oven and cleaning apparatus combines in a unitary housing for both the reflow and cleaning function. This results in the saving of valuable floor space in the printed circuit board...
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6427902 |
Machine for wave soldering of tinning
The invention relates to a machine for wave soldering or tinning comprising a solder reservoir (9); means that can form at least one solder wave with a so-called laminar form (8b); a conveyor...
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6395972 |
Method of solar cell external interconnection and solar cell panel made thereby
A method of solar cell external interconnection and a solar cell panel (1) made thereby are disclosed. An assembly (2) including a solar cell module (4), a flexible lead frame (5) to which the...
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