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7389805 |
Bonding arm swinging type bonding apparatus
A bonding arm swinging type bonding apparatus that has a rotational center 13 of the bonding arm 1 beneath the bonding arm. The rotating shaft parts 11 of circular arc form rotary motors 10 ...
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7377415 |
Bond head link assembly for a wire bonding machine
A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes...
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7370785 |
Wire bonding method and apparatus
A wire bonding apparatus and method involving a computer 41 that has a height position counter 44 that produces height position signals for a capillary 5 by processing signals from a position...
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7360675 |
Wire bonder for ball bonding insulated wire and method of using same
An electrical contact device is provided for electrically grounding an uninsulated end-portion of insulated wire stored on a spool driven by a device comprises the following. An electrical...
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7353976 |
Wire bonder
A Wire Bonder contains a bondhead and a rocker arranged on the bondhead that is rotatable on a horizontal axis. A horn with a flange is attached to the rocker in which a capillary is clamped. At...
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7322507 |
Transducer assembly, capillary and wire bonding method using the same
A transducer assembly and wire bonding method has a vibration unit for generating an ultrasonic wave. A body section is coupled to the vibration unit for transferring the ultrasonic wave. A tapered...
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7320424 |
Linear split axis wire bonder
A wire bonding machine for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach...
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7320423 |
High speed linear and rotary split-axis wire bonder
A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is...
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7311239 |
Probe attach tool
A tool for attaching fine preformed probes to a substrate for use with a vacuum source is disclosed. The apparatus comprises a body portion; a tip portion disposed at one end of the body portion; a...
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7303113 |
Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance...
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7303111 |
Lightweight bondhead assembly
A bondhead assembly having a bond body for mounting a bonding tool, a support structure that is configured to be drivable for moving the bondhead assembly to different locations and flexural...
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7303110 |
Flange-mounted transducer
A flange-mounted transducer, such as an ultrasonic transducer, is provided that comprises a horn and a driver coupled to the horn for generating an oscillatory energy supply to the horn. A support...
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7303109 |
Stud bumping apparatus
The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a...
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7299966 |
Initial ball forming method for wire bonding wire and wire bonding apparatus
An initial ball forming method for wire bonding wire and wire bonding apparatus that uses: a capillary through which a wire is passed; a torch electrode made of a low-melting-point material that...
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7264146 |
Ultrasonic tool and ultrasonic bonder
An ultrasonic tool, for bonding two materials to each other by joining a face of one of the materials to a face of the other material using the action of ultrasonic waves applied to one of the...
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7250684 |
Circular wire-bond pad, package made therewith, and method of assembling same
A wire-bonding substrate includes a curvilinear wire-bond pad. The curvilinear wire-bond pad is used in reverse wire bonding to couple a die with the substrate. A curvilinear wire-bond pad is also...
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7246735 |
Wire clamping plate
A wire clamping plate is provided for a wire clamp that is adapted to contact a length of metallic wire when the wire clamp is applying a clamping force on the wire. The wire clamping plate...
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7240820 |
Clamping device for processing electronic devices
A clamping device is provided for holding an electronic device, such as a semiconductor carrier in the form of a leadframe, during processing thereof. It includes a main body for covering the...
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7227095 |
Wire bonders and methods of wire-bonding
Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a...
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7224829 |
Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program
Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar...
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7222772 |
Flip chip bonder
A flip chip bonder including a substrate holding mechanism and a chip die bonder for bonding a semiconductor chip having a plurality of electrodes projecting from its front surface to a substrate...
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7216794 |
Bond capillary design for ribbon wire bonding
A device ( 100 ) and method ( 200 ) for bonding a ribbon wire ( 104 ) to a workpiece ( 106 ) comprising feeding the ribbon wire through a passageway ( 116 ) of an ultrasonic bond capillary ( 102 )...
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7188759 |
Methods for forming conductive bumps and wire loops
A method of forming a conductive bump is provided. The method includes depositing a conductive bump on a bonding location using a bonding tool such that a junction exists between (1) a length of...
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7168165 |
Fabrication of electrical medical leads employing multi-filar wire conductors
During fabrication of an electrical medical lead, a cut end of a stranded wire conductor is subjected to electrical current sufficient to heat and weld the strands together upon discharge of a high...
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7150386 |
Systems and structures for supporting vibrators
An object of the present invention is to provide a novel system for supporting a vibrator having a terminal for electrical connection so that the vibrator may be miniaturized and the deviation of...
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7140529 |
Wire bonding method and apparatus
A wire bonding apparatus that include a piezoelectric element 4 provided near the capillary attachment portion of a bonding arm 1 so that a capillary 3 vibrates in the axial direction of the...
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7134589 |
Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate
A Wire Bonder has a downholder for pressing the fingers of a system carrier onto a heating plate. The downholder can be raised and lowered. A downholder in accordance with the invention contains...
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7131568 |
Methods for lead penetrating clamping system
An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use...
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7124927 |
Flip chip bonding tool and ball placement capillary
A flip chip bonding tool and ball placement capillary system comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high...
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7108167 |
Wire bonder with a device for determining the vectorial distance between the capillary and the image recognition system and method
A Wire Bonder comprises a bondhead that can be moved in a horizontal plane that has a capillary clamped to a horn and parts of an image recognition system. The tip of the capillary and the optical...
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7103959 |
Conduit for preventing oxidation of a electronic device
An apparatus to prevent oxidation of an electronic device, such as a semiconductor substrate during a semiconductor packaging process, comprises a substantially-enclosed conduit having at least one...
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7100812 |
Capillary holder
A capillary holder for mounting a capillary onto a horn is provided that comprises a mounting hole formed in the horn that has a first width along a first axis that is smaller than a width of the...
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7096912 |
Bonding apparatus
A bonding apparatus including, on a supporting stand 12, two linear motors 130 and 140 and a bonding head supporting stage 114 which supports the bonding head 120 by means of fluid...
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7086148 |
Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit
An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated...
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7083077 |
Method and contact point for establishing an electrical connection
A method for establishing an electrical connection between a first contact surface and a second contact surface, with a wire-bonding tool being used to provide a contact wire between the contact...
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7077304 |
Bonding tool with polymer coating
A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the...
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7073702 |
Self-locking wire bond structure and method of making the same
A complimentary self-locking wire bond structure and technique is introduced, where the bonding force is focused at the tip of the bond wire and a barb-type construction is utilized to enhance the...
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7051915 |
Capillary for wire bonding and method of wire bonding using it
A capillary has a face surface 13 formed at the tip end thereof so that the face surface 13 inclines toward the center thereof so as to have a tapered shape, and has a through hole 11 formed...
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7044357 |
Bump formation method and wire bonding method
Bump formation method and wire bonding method including a step of forming a ball on the tip end of a wire that passes through a capillary and joining this ball to an electrode pad so as to make a...
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7032802 |
Bonding tool with resistance
A resistive bonding tool tip comprising a resistive material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large...
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7025247 |
Wire bonding method
A wire bonding method including the steps of forming a bump by performing ball bonding of a ball by wire on a second conductor, raising a capillary to a height that is equal to or lower than the...
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7025243 |
Bondhead for wire bonding apparatus
A bondhead is provided that comprises a bondhead body for holding a bonding tool, such as an ultrasonic transducer, and a bondhead actuator coupled to the bondhead body for moving the bonding tool...
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7021521 |
Bump connection and method and apparatus for forming said connection
A bump connection is formed by stacking at least two metallic balls of different kinds of metals on a conductor of an electronic component such as a semiconductor device. The bump connection is...
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7021520 |
Stacked chip connection using stand off stitch bonding
The present invention provides a structure, apparatus, and method for wire bonding in which a first wire bond is formed between first and second components, a second wire bond is formed between the...
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7017794 |
Wire bonding method and wire bonding apparatus
A highly reliable bonding process is provided. The wire bonding method includes: (a) bonding a tip portion of a wire to a first electrode by pressing an open end section of a first hole of a first...
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7014095 |
Wire bonding method, wire bonding apparatus and wire bonding program
Wire bonding being performed by, following the formation of a neck portion on a wire at a first bonding point, raising the capillary from the neck portion while paying out a first specified length...
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7004369 |
Capillary with contained inner chamfer
A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer...
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7000822 |
Wire bond integrity test system
An improved bond integrity test system is provided by eliminating the spring loaded wire spool cover which contributes to particulate matter, and by addition of a second contact diverter in the...
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6991147 |
Insulated bonding wire tool for microelectronic packaging
A method for insulating a bonding wire that includes the steps of attaching a bonding wire to a bond pad and coating the bonding wire with an insulating liquid while drawing the bonding wire...
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6981629 |
Apparatus of clamping semiconductor devices using sliding finger supports
An apparatus for supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present...
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