|
Match
|
Document |
Document Title |
|
|
5316201 |
Bonding apparatus
A bonding apparatus including a motor, a cam, a capillary, and a biasing means. The motor rotates both ways, the cam on the output shaft of the motor is rotated by the motor, and the capillary is...
|
|
|
5314175 |
Wire clamping device and wire clamping method
A wire clamping device which is used to clamp bonding wire in the wire bonding of electronic components comprising: a fixed arm; a movable arm that is positioned so that the end of the fixed arm...
|
|
|
5314105 |
Wire bonding ultrasonic control system responsive to wire deformation
A wire-bonding process for bonding a wire 8 to a contact surface of an electrical or electronic component 10, comprises supplying ultrasonic energy to a bonding tool 2 mounted on an ultrasonic...
|
|
|
5307977 |
Multi heater block of wire bonder
A multi heater block of a wire bonder including a multi heater block of such a wire bonder in which one heater may be used in various kinds of packages having different paddle size. The multi...
|
|
|
5307978 |
Smart indexing head for universal lead frame work station
Apparatus and a method for orienting individual bonding sites of a lead frame having a plurality of bonding sites includes a universal work station in a work holder. The work holder comprises a...
|
|
|
5302550 |
Method of bonding a microelectronic device
A method for ball-bonding thin film structures. The bonding characteristics of a thin-film electrode structure are measured, before the actual bonding step, by pressing a ball (of a material...
|
|
|
5294038 |
Method of and apparatus for manufacturing semiconductor device
This invention relates to an apparatus for manufacturing a semiconductor device, which has an auxiliary bonding stage in the vicinity of a wafer stage so that when a wire is disconnected during a...
|
|
|
5292050 |
Wire bonder
A wire bonder comprises a pattern recognition mechanism. The pattern recognition mechanism includes a TV camera head, a camera control unit, a program research unit, and a bonder controller. The...
|
|
|
5285949 |
Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
The present invention relates to a wire bonding method and a wire bonding apparatus employing a coated wire in which the surface of a metal wire is coated with an insulator, and a semiconductor...
|
|
|
5277355 |
Self-aligning fine wire clamp
A low mass self-aligning wire clamp jaw assembly is provided which may be employed as a replaceable wire clamp jaw assembly or as a complete integrated wire clamp assembly with an actuator. The...
|
|
|
5277354 |
Device for monitoring wire supply and consumption
A device for incorporation in a wire bonding machine for monitoring the supply of wire from a wire supply spool to a bonding wedge. The device includes a mount (12) for rotatably mounting a wire...
|
|
|
5275324 |
Wire bonding apparatus
A wire bonding apparatus in fabricating, for example, semiconductor devices including a bonding arm that is vertically and horizontally movable and has a capillary through which a bonding wire is...
|
|
|
5263631 |
Contact-making system for semiconductor wire connections
A contact-making system for wire connections on electronic components in semiconductor connection technology, which includes a contact-making device having a capillary tube arranged thereon for...
|
|
|
5264002 |
Method for conveying semiconductor lead frame strip with an apparatus having vertically movable guide rails
A method for conveying a continuous semiconductor lead frame strip includes a guide rail for conveying a lead frame, the guide rail being divided into three portions having a vertically movable...
|
|
|
5263246 |
Bump forming method
In order to minimize the size of an aluminum pad in a method of forming a bump, a metal wire is wedge-bonded on the aluminum pad, a necessary amount of the wire is left on the aluminum pad, and the...
|
|
|
5260514 |
Wire bonder and vacuum pedestal workholder for same
A fully-populated Pin Grid Array (PGA) is vacuum-chucked to a pedestal, without mechanical clamping. The pedestal includes a cylindrical shaft having a vacuum passageway extending its length, and a...
|
|
|
5242103 |
Pivotal wire bonding stage and method of use
A method and apparatus are provided for making a continuous wire bond (139) around an angle of a workpiece (101). A pivotal stage (110) having clamp assembles (104, 107) are mounted onto a base...
|
|
|
5238173 |
Wire bonding misattachment detection apparatus and that detection method in a wire bonder
The present invention provides a wire bonder and its method able to reliably and efficiently perform non-contact detection of the misattachment of wires spread between the pads of various types of...
|
|
|
5230458 |
Interconnect formation utilizing real-time feedback
The present invention provides real time feedback interconnect system which allows real-time detection and control of bond force exerted on the bond site. A force sensor is provided in the bond...
|
|
|
5217154 |
Semiconductor bonding tool
The disclosure relates to a bonding tool tip bonding electronic interconnects having a shank portion formed of a relatively hard, stiff material having a high modulus of elasticity and a foot...
|
|
|
5215940 |
Wire looping method during wire bonding
A method for looping the bond wires used to connected a semiconductor bond pad to a lead frame finger during bonding to improve the clearance between adjacent bond wires.
|
|
|
5207786 |
Wire bonding method
A wire bonding apparatus includes a capillary tip through which a fine metal wire passes, a first clamp disposed above the capillary tip for clamping the fine metal wire, a second clamp disposed...
|
|
|
5207369 |
Inner lead bonding apparatus
A process for manufacturing electronic components known as TAB method comprises a process employing a single apparatus for forming bumps in a chip, a process of inner lead bonding for bonding said...
|
|
|
5201454 |
Process for enhanced intermetallic growth in IC interconnections
An apparatus (10) and method is provided for bonding wire (12) to the bond sites (28) of integrated circuits (14). In preferred embodiments a bond end (30) on gold wire (12) is bonded to aluminum...
|
|
|
5201450 |
Heat block of wire bonding machine
A heat block of a wire bonding machine including an inner lead heating part for bonding each one end of wires to each inner lead of a lead frame, a chip heating part for bonding the other ends of...
|
|
|
5201453 |
Linear, direct-drive microelectronic bonding apparatus and method
A linear, direct-drive microelectronic bonding apparatus (10) provides a bondhead mounting plate (20), a stationary magnetic circuit (21), a moving coil (22), a primary wire clamp housing (23), a...
|
|
|
5199629 |
Wire bonding system
The spots to be bonded are determined by a light intensity controller as data and bonding is carried out in accordance with the data. The data obtained are stored in a memory or disk memory. In the...
|
|
|
5199628 |
Wire bonding device
A wire bonding device which comprises a height detector that detects the surface height of a semiconductor pellet, a position detector that detects the two-dimensional position of the semiconductor...
|
|
|
5195682 |
Method for attaching copper to a ferrous alloy
A method for welding copper to a ferrous alloy is provided in which an end of the copper wire, either in a single conductor form or a plurality of strands, is exposed to an electrical discharge to...
|
|
|
5193733 |
Clamping device for inner leads of lead frame
A clamp device for clamping inner leads of a lead frame includes a clamp fixing plate having a working opening and a plurality of inner lead clamps each made of a plate spring and fixedly mounted...
|
|
|
5190206 |
Ultrasonic wire bonding tool and method for self-threading same
An improved tool for ultrasonic wire bonding, and a novel method by which the tool may be semi-automatically threaded with bonding wire are disclosed. The overall exterior shape of the tool is that...
|
|
|
5186378 |
Method and apparatus for transducer heating in low temperature bonding
An apparatus (10) and method is provided for bonding wire (12) to the bond sites (28) of integrated circuits. In preferred embodiments gold wire (12) is bonded to aluminum bond pad (28). Apparatus...
|
|
|
5186719 |
Apparatus for conveying semiconductor lead frame strip using guide rails
An apparatus for conveying a continuous semiconductor lead frame strip includes a guide rail for conveying a lead frame, the guide rail being divided into three portions having a vertically movable...
|
|
|
5181646 |
Lead frame holding apparatus for use in wire bonders
A lead frame holding apparatus for wire bonding machines forcing an upward movement of a heater block and a frame retainer by a heater block raising-and-lowering cam and a frame retainer...
|
|
|
5180094 |
Wire bonder with bonding arm angle sensor
A wire bonder processes an angle sensor which detects, without making contact, the angle of rotation of a bonding arm provided so as to be allowed to freely oscillate centered on a shaft supported...
|
|
|
5176310 |
Method and apparatus for wire bond
The present invention relates to a ball bonding technique using an insulated wire in assembling a semiconductor chip in which the ball is formed at the end of an insulated wire by an electrical...
|
|
|
5176311 |
High yield clampless wire bonding method
The present invention method is carried out with a programmable automatic wire bonder having a linear drive motor. The wire bonder is programmed to bond loose lead frame leads at a second bond...
|
|
|
5169050 |
Wire bonder with improved actuator
To provide the necessary vertical motion of a wire- bonding head (20) mounted on a flexural pivot (16), a wire-bonding machine (10) includes an actuator comprising a permanent magnet (56) mounted...
|
|
|
5156318 |
Ultrasonic bonding apparatus for bonding a semiconductor device to a tab tape
In a method for bonding inner leads arranged along a square opening of a tab tape to a semiconductor device, the inner leads of a pair of inner lead rows that face each other are bonded first to...
|
|
|
5156319 |
Wire bonding inspection equipment
Wire bonding inspection equipment includes a judging unit for judging whether or not wire bonding of a semiconductor device is acceptabe and for producing a defect signal when the semiconductor...
|
|
|
5156320 |
Wire bonder and wire bonding method
A wire bonder and wire bonding method where there is repeatedly calculated the dislocation dy of the end of a capillary, based on the oscillation an elevation angle of a bonding arm which performs...
|
|
|
5154339 |
Frame retainer mount used in bonding machines
In a lead frame retainer mount used in, for example, wire bonding machines, tapered edges are formed on opposite ends of a frame retainer, and a frame retainer carrier which carries the frame...
|
|
|
5150828 |
Wire bonding method and apparatus for same capable of packaging semiconductor device into thin package
A wire bonding method includes a step of calculating the tracking parameters which determine the motion track of a capillary, from a function that has its variables a tracking wire loop length...
|
|
|
5148959 |
Wedge bonding tool
A wedge bonding tool having a shank and a tapered work end including a narrow bonding tip for holding a wire against a surface to which it is to be bonded, a shank secured to said tapered work end...
|
|
|
5121329 |
Apparatus and method for creating three-dimensional objects
Apparatus incorporating a movable dispensing head provided with a supply of material which solidifies at a predetermined temperature, and a base member, which are moved relative to each other along...
|
|
|
5114066 |
Voice coil programmable wire tensioner
A voice coil actuated wire tensioner is used on a wire bonder in conjunction with a primary wire clamp to provide accurate control of the bond wire and looping of the bond wire between ball bonding...
|
|
|
5111015 |
Apparatus and method for fusing wire
Fusing apparatus and methods for fusing armature wires having an electrically insulating coating to the tangs of a commutator include a pair of spaced apart, side-by-side electrodes. The electrode...
|
|
|
5097406 |
Lead frame lead located for wire bonder
A lead frame locater is used to locate actual positions of lead frame leads in respect to the semiconductor chip to provide accurate wire bonding of the semiconductor chip to the lead frame leads.
|
|
|
5097100 |
Noble metal plated wire and terminal assembly, and method of making the same
A lightweight, substantially corrosion-proof, conductive wire and terminal assembly (10) comprising a wire (12) laid on and welded to a terminal pad (18) at or near the end (16) of the wire. The...
|
|
|
5095187 |
Weakening wire supplied through a wire bonder
A technique for weakening an interconnection wire provided on a contact on an electronic component, in which the wire is weakened by means of an arc which is created between the wire and an...
|