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6362014 |
Bonding apparatus
Instead of using the ordinary pulse train command inputted from a computer to the control circuit, an offset signal outputted from an offset compensation circuit is employed for performing...
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6357112 |
Method of making connection component
A connection component for use in making microelectronic element assemblies, has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to...
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6354479 |
Dissipative ceramic bonding tip
Dissipative ceramic bonding tips for wire bonding electrical connections to bonding pads on integrated circuits chips and packages are disclosed. In accordance with the principles of the present...
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6352197 |
Method and apparatus for wire-bonding for electric components
Wire-bonding between first and second bonding parts of an electronic component is done by first using a capillary tool to press downward to thereby bond a first end of a metallic wire to the first...
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6343733 |
Wire bonding method
A wire bonding method in which first and second bonding points are connected by a wire comprising the steps of: connecting the wire that passes through a capillary to a first bonding point, raising...
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6340112 |
Stepwise autorotation of wire bonding capilliary
A rotation device provides precise, stepwise rotation of a wire bonding capillary about the longitudinal axis of the capillary. This enables the capillary to be rotated to different angular...
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6330485 |
High-speed multi-task system
A high-speed multi-task system which configures with an industrial personal computer and a numerical controller. The industrial personal computer handles the human-machine interface, visual...
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6325269 |
Wire bonding capillary
A wire bonding capillary (1), which is able to decrease wire extraction resistance and suitable for a long and low loop wire bonding process, comprises a through bore (5) for feeding a bonding...
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6321970 |
Wire bonding machine
An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a...
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6321969 |
Efficient energy transfer capillary
A bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a first diameter; a second cylindrical section coupled to an end of the first...
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6321976 |
Method of wire bonding for small clearance
A method of wire bonding for small clearance employs a conductive bump over the pad of a chip to prevent a capillary from colliding with the chip during three-dimensional package wiring process....
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6318622 |
High power hybrid modules assembly using vacuum oven for permanent electrical connections
The apparatus for assembly of high power hybrid modules including high power semiconductor chips and conventional surface mount technology (SMT) components are disclosed. The vacuum oven is used...
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6308881 |
Quality control method
A quality control method for ultrasonic wire bonding is provided wherein the deformation of the wire to be bonded to a contact surface is substantially constantly monitored. The method includes...
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6299051 |
Bonding method of electronic parts employing ultrasonic coupling oscillation
An object of the present invention is to provide a sealing method by which an excellent bonding may be realized without thermal shock by bonding at a normal temperature due to ultrasonic coupling...
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6282780 |
Bump forming method and its forming apparatus.
In a bump forming method and its forming apparatus, a torch is made to approach a bottom end of a wire extended from a capillary tool to form a ball, thereafter the wire is held by first clampers...
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6279226 |
Lead bonding machine for bonding leads of a chip disposed over a carrier tape to an electrode pad formed on the chip
A method and apparatus for stabilizing the form of a letter S of an inner lead after bonding in a method of manufacturing μBGAoIC in which a chip is fixed via an insulating film on a tape carrier...
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6276594 |
Method for positioning the bond head in a wire bonding machine
An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a...
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6273321 |
Wire bonding with capillary realignment
A wire bonding method includes aligning the face of a capillary along a first direction to make a first wire bond at a first bond point. The capillary face is realigned to a second direction to...
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6267290 |
Control of size and heat affected zone for fine pitch wire bonding
The amount of a terminal portion of bonding wire which is melted to form a free air ball for ball bonding and the temperature rise in the bonding wire adjacent the free air ball is limited by...
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6260753 |
Gold bumps bonding on connection pads and subsequent coining of their vertex
A method for forming and bonding a metal bump on a metal pad of an integrated circuit and successively stamping a vertex of the bonded metal bump is performed using the same capillary tool. The...
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6253991 |
Extended travel wire bonding machine
An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a...
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6247629 |
Wire bond monitoring system for layered packages
A wire bond monitoring system for monitoring wire bonds made on layered packages includes a technique for accessing both the die and the laminate package and making electrical contact thereto so as...
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6234374 |
Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source
A method and apparatus for selectively heating a structure capable of absorbing heat radiations in the 0.5 to 2 micron range relative to an adjacent structure wherein a first structure capable of...
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6206273 |
Structures and processes to create a desired probetip contact geometry on a wafer test probe
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The...
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6206275 |
Deep access, close proximity, fine pitch bonding of large wire
This invention relates to a wire bonding apparatus for bonding wire to a substrate wherein the components used to guide, bond and cut the wire have a reduced cross-sectional dimension near the...
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6206266 |
Control method for wire bonding apparatus
In a bonding method and apparatus, a bonding arm having a bonding tool at one end thereof is controlled to stop at a constant height position by a computer that incudes a memory containing...
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6192578 |
Method for electrically coupling bond pads of a microelectronic device
A method and apparatus for electrically coupling bond pads on the surface of a microelectronic device. The apparatus can include a microelectronic device having at least two bond pads with a...
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6193130 |
Bump bonding apparatus
A bump bonding apparatus comprising: a loader section that holds trays which accommodate semiconductor pellets and an unloader section that holds trays which accommodate semiconductor pellets to...
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6189765 |
Apparatus and method for detecting double wire bonding
The present invention is to provide an apparatus and a method for detecting a double bonding error that a wire ball is in contact with a wire loop previously formed between a pad and a lead, by...
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6182882 |
Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe
A method of bonding wire between at least one pair of bond locations in a semiconductor device and the bonder. A conveyor is provided having a conveying surface for conveying in a predetermined...
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6179197 |
Missing wire detector
A method and apparatus for monitoring the presence of a bonding wire in a wire bonding machine. The apparatus generates an AC signal which is coupled to the bonding tool. A sensor senses a current...
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6176414 |
Linkage guided bond head
A bond head for use with a bonding machine. The bond head has an arm assembly; and a linkage coupled between the arm assembly and the frame of the bonding machine. The linkage forms a virtual pivot...
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6176416 |
Method of making low-profile wire connection
A method of making low profile wire connection comprising steps of: connecting a wire to a first bonding point, moving a capillary straight up a first length, moving the capillary away from a...
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6173884 |
Semiconductor device and equipment for manufacturing the same as well as method of fabricating the same
A bonding tool for bonding an inner lead to an electrode pad of a semiconductor chip, wherein the bonding tool has a head surface which is rectangular. The rectangular head surface has a long side...
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6171456 |
Method for making improved long life bonding tools
The present invention relates to post manufacturing operations for improving the working life of known bonding tools such as capillaries, wedges and single point TAB tools of the type used in the...
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6172318 |
Base for wire bond checking
A base mainly includes a heating plate and a probe. The probe is attached to the surface of a heating plate which serves to place a substrate having an ball pad on a lower surface facing the probe...
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6164514 |
Micro-manipulator for ultrasonic bonding with orthogonal tool support slides
A micro-manipulator apparatus for precisely positioning the tip of an ultrasonic bonding tool or similar implement relative to a work piece includes a pantograph-like input manipulator mechanism...
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6161747 |
Bonding apparatus
In a bonding apparatus such as a bump bonding apparatus, tape bonding apparatus or the like, a positioning claw which is used for positioning a semiconductor pellet on a bonding stage of the...
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6156990 |
Long-wearing impervious conductive wire clamp
A wire bonding machine having a wire clamp comprised of a platinum group metal such as iridium, rhodium, ruthenium, or osmium so as to minimize corrosion due to micro sparking.
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6155474 |
Fine pitch bonding technique
A capillary for bonding a wire between two bonding locations which comprises a capillary (1) having a body having an exterior surface, a bore (23) therethrough and a wall disposed between and...
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6148505 |
System and method for wiring electronic components in a three-dimensional manner
A system and method for wiring electronic components in a three-dimensional manner. The wiring system includes a means for temporarily placing components on a substrate, a means for directly or...
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6136681 |
Tool used in forming a chip scale package
A method of assembling a plurality of semiconductor chips is provided. A portion of a semiconductor wafer containing the plurality of chips is provided. Each of the plurality of chips has a contact...
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6135339 |
Ultrasonic transducer with a flange for mounting on an ultrasonic welding device, in particular on a wire bonder
The horn of an ultrasonic transducer is applied with ultrasonic waves from an ultrasonic converter in such a way that standing ultrasonic waves develop in the lengthwise direction of the horn. A...
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6135338 |
Capillary holding structure for ultrasonic horn
An ultrasonic horn that has a capillary attachment hole to hold a capillary therein so as to be used in wire bonding, including a perpendicular slit provided on the opposite side of the capillary...
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6131799 |
Method of making wire connections of predetermined shape
In a method of making a wire connection of predetermined shape between a first connecting point located on a semiconductor chip and a second connecting point a capillary is moved along a...
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6131792 |
Balancing of x and y axis bonding by 45 degree capillary positioning
A method of bonding wire and the bonder which includes providing a wire bonder for bonding wire to a bonding location. The wire bonder has a first bonding head designed to form a stitch bond while...
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6119917 |
Wire bonding apparatus and bonding load correction method for the same
A bonding apparatus for manufacturing, for instance, a semiconductor device including a computer system which calculates a limit value of a driving current that flows to a linear motor controlling...
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6119914 |
Wire bonding apparatus
A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values...
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6112969 |
Wire bonding apparatus
A wire bonding method for joining a metal wire with a bonding pad disposed on a semiconductor element by using a load and supersonic wave vibration, comprising: during interval of time from contact...
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6102275 |
Bond head having dual axes of motion
A bond head is provided for a wire bonding machine having a linear axis frame, a rotary axis frame, a bond tool and a wire clamp. The linear axis frame is vertically linearly displacable along a...
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